发明授权
- 专利标题： Semiconductor package with stress relief and heat spreader
- 专利标题（中）： 具有应力消除和散热器的半导体封装
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申请号： US14277801申请日： 2014-05-15
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公开(公告)号： US09196576B2公开(公告)日： 2015-11-24
- 发明人: Kai Yun Yow , Poh Leng Eu , Meng Kong Lye , You Ge , Penglin Mei
- 申请人： Kai Yun Yow , Poh Leng Eu , Meng Kong Lye , You Ge , Penglin Mei
- 申请人地址： US TX Austin
- 专利权人： FREESCALE SEMICONDUCTOR, INC.
- 当前专利权人： FREESCALE SEMICONDUCTOR, INC.
- 当前专利权人地址： US TX Austin
- 代理商 Charles Bergere
- 优先权： CN201310680113 20130925
- 主分类号： H01L23/495
- IPC分类号： H01L23/495 ; H01L23/34
摘要：
A semiconductor device has a die mounted on a die paddle that is elevated above and thermally connected via tie bars to a heat sink structure. Heat generated by the die flows from the die to the die paddle to the tie bars to the heat sink structure and then to either the external environment or to an external heat sink. By elevating the die/paddle sub-assembly above the heat sink structure, the packaged device is less susceptible to delamination between the die and die attach adhesive and/or the die attach adhesive and the die paddle. An optional heat sink ring can surround the die paddle.
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