公开(公告)号：US20060261250A1

公开(公告)日：2006-11-23

申请号：US11436643

申请日：2006-05-19

申请人： Hirochika Narita ,  Ryuya Kuroda

发明人： Hirochika Narita ,  Ryuya Kuroda

IPC分类号： H01L27/14

CPC分类号： H01L31/0203 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L27/14618 ,  H01L2224/05554 ,  H01L2224/05624 ,  H01L2224/32225 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48227 ,  H01L2224/48245 ,  H01L2224/48247 ,  H01L2224/48624 ,  H01L2224/48724 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/83194 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01019 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01327 ,  H01L2924/10161 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/15312 ,  H01L2924/16195 ,  H01L2924/00014 ,  H01L2924/00

摘要： To provide a solid-state image sensing device that is capable of improving the connection reliability of bonding pads and bonding wires. A solid-state image sensing element 1 of the present invention contains a long plate-shaped metal substrate 16, a long plate-shaped solid-state image sensing element 4 fixed to the surface of the metal substrate 16 via an adhesive layer 18, and bonding pads 6, formed on the surface of the solid-state image sensing element 4, for electrically connecting to the lead frame via bonding wires 14. The adhesive layer 18 contains a first adhesive layer 18a, and a second adhesive layer 18b of a higher modulus of elasticity than the first adhesive layer 18a, and at the regions directly below the bonding pads 6 provided at both end sections in a longitudinal direction of the solid-state image sensing element 4, the metal substrate 16 and the solid-state image sensing element 4 are fixed via the second adhesive layer 18b.

摘要翻译： 提供能够提高接合焊盘和接合线的连接可靠性的固体摄像装置。 本发明的固体摄像元件1具有长板状的金属基板16，经由粘合层18固定在金属基板16的表面的长板状固体摄像元件4，以及 形成在固态图像感测元件4的表面上的接合焊盘6，用于经由接合线14电连接到引线框架。 粘合剂层18包含第一粘合剂层18a和比第一粘合剂层18a更高的弹性模量的第二粘合剂层18b，以及设置在第一粘合剂层18a的两端部处的接合焊盘6的正下方的区域 固体摄像元件4的长度方向，金属基板16和固体摄像元件4经由第二粘合层18b固定。

公开(公告)号：US07122908B2

公开(公告)日：2006-10-17

申请号：US09775366

申请日：2001-02-01

申请人： Tongbi Jiang ,  Yong Du

发明人： Tongbi Jiang ,  Yong Du

IPC分类号： H01L23/48 ,  H01L23/28 ,  H01L23/42 ,  H01L23/52

CPC分类号： H01L24/83 ,  H01L23/49816 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/05599 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/45099 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2224/48463 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2224/83194 ,  H01L2224/8385 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/09701 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207

摘要： An electronic device package comprises a substrate, a die, and a material having a Young's modulus of between about 0.1 megapascals and about 20 megapascals (at a solder reflow temperature) for attaching the die to the substrate. In one embodiment, the package utilizes a material having a Young's modulus of between about 0.1 megapascals and about 20 megapascals (at a solder reflow temperature) for attaching the die to the substrate. In an alternate embodiment, the package utilizes a material having a coefficient of thermal expansion α2 of less than about 400 (four-hundred) ppm (parts per million)/° C. for attaching the die to the substrate. In another alternate embodiment, the package utilizes a rigid material for attaching the die to the substrate.

摘要翻译： 一种电子器件封装，包括衬底，裸片和具有约0.1兆帕至约20兆帕（焊料回流温度）的杨氏模量的材料，用于将裸片附接到衬底。 在一个实施例中，封装使用具有约0.1兆帕至约20兆帕（在焊料回流温度下）的杨氏模量的材料，用于将管芯附接至基板。 在替代实施例中，封装使用具有小于约400（四百分之一ppm）（百万分之几）/℃的热膨胀系数α2 2的材料，用于将管芯附接到 底物。 在另一个替代实施例中，封装使用刚性材料将裸片附接至基板。

公开(公告)号：US07098071B2

公开(公告)日：2006-08-29

申请号：US11136181

申请日：2005-05-24

申请人： Ming-Lun Ho ,  Chih-Ming Chung

发明人： Ming-Lun Ho ,  Chih-Ming Chung

IPC分类号： H01L21/44

CPC分类号： H01L24/81 ,  H01L21/563 ,  H01L24/16 ,  H01L24/29 ,  H01L2224/13099 ,  H01L2224/13111 ,  H01L2224/13144 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/81801 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/83194 ,  H01L2224/83856 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H05K3/3436 ,  H01L2924/00 ,  H01L2224/0401

摘要： The present invention relates to a method for flip chip bonding by utilizing an interposer with embedded bumps. The method comprises (a) providing a first element having a first surface; (b) forming an interposer onto the first surface; (c) forming a plurality of openings on the interposer; (d) forming a plurality of bumps in the openings, wherein the height of the bumps is smaller than the depth of the openings; (e) providing a second element having a plurality of pre-solders; and (f) bonding the first surface onto the second element, so that the pre-solders are disposed in the openings and in contact with the bumps. As a result, the self-alignment between the pre-solders and the bumps can avoid the shift between the first element and the second element.

公开(公告)号：US20060175697A1

公开(公告)日：2006-08-10

申请号：US11344063

申请日：2006-02-01

申请人： Tetsuya Kurosawa ,  Junya Sagara

发明人： Tetsuya Kurosawa ,  Junya Sagara

IPC分类号： H01L23/02 ,  H01L21/50

CPC分类号： H01L25/0657 ,  H01L21/6836 ,  H01L23/481 ,  H01L24/27 ,  H01L24/29 ,  H01L24/48 ,  H01L24/73 ,  H01L24/83 ,  H01L24/85 ,  H01L25/50 ,  H01L29/0657 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2224/0401 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05684 ,  H01L2224/13144 ,  H01L2224/29012 ,  H01L2224/2919 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2224/83191 ,  H01L2224/83194 ,  H01L2224/838 ,  H01L2224/8592 ,  H01L2224/92247 ,  H01L2225/0651 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/06555 ,  H01L2225/06572 ,  H01L2225/06582 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01014 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01057 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/10155 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2924/3512 ,  H01L2924/00012

摘要： Chips are stacked and mounted on a circuit board having external connection electrodes and mounted thereon by wire bonding. At least one of the chips stacked on the chip includes overhung portions each of which has a start point inside bonding pads, is made thinner in a direction towards the outer periphery to an end point reaching the side wall and forms a space used to accommodate ball bonding portions between the overhung portion and the main surface of the chip arranged in the lower stage on a backside corresponding in position to the bonding pads, and insulating members formed to cover the overhung portions and prevent bonding wires of the chip arranged in the lower stage from being brought into contact with the upper-stage chip.

摘要翻译： 芯片堆叠并安装在具有外部连接电极的电路板上并通过引线接合安装在其上。 堆叠在芯片上的芯片中的至少一个包括在接合焊盘内部具有起始点的悬垂部分，在朝向外周边的方向到达到侧壁的端点处形成较薄，并形成用于容纳球的空间 在布置在下层的芯片的悬臂部分和主表面之间的接合部分在与接合焊盘相对应的背面上形成绝缘部件，以及形成为覆盖悬臂部分的绝缘部件，并且防止布置在下部的芯片的接合线 不与上级芯片接触。

公开(公告)号：US20060081996A1

公开(公告)日：2006-04-20

申请号：US11248262

申请日：2005-10-13

申请人： Keiji Shinyama ,  Ichiharu Kondo ,  Kimiharu Kayukawa ,  Shoji Miura

发明人： Keiji Shinyama ,  Ichiharu Kondo ,  Kimiharu Kayukawa ,  Shoji Miura

IPC分类号： H01L23/48

CPC分类号： H01L24/05 ,  H01L23/051 ,  H01L23/24 ,  H01L24/03 ,  H01L24/32 ,  H01L24/33 ,  H01L24/48 ,  H01L2224/04042 ,  H01L2224/05557 ,  H01L2224/05558 ,  H01L2224/05624 ,  H01L2224/29111 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48624 ,  H01L2224/48724 ,  H01L2224/73265 ,  H01L2224/83194 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01022 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01068 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/351 ,  H01L2924/00 ,  H01L2924/01026 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A semiconductor device includes: a semiconductor substrate; an aluminum electrode disposed on the surface of the substrate; a protection film disposed on the aluminum electrode and having an opening; and a metallic electrode disposed on a surface of the aluminum electrode through the opening of the protection film. The surface of the aluminum electrode includes a concavity. The concavity has an opening side and a bottom side, which is wider than the opening side. In the device, a concavity and a convexity of the metallic electrode become small.

摘要翻译： 半导体器件包括：半导体衬底; 设置在所述基板的表面上的铝电极; 保护膜，设置在铝电极上并具有开口; 以及通过保护膜的开口设置在铝电极的表面上的金属电极。 铝电极的表面包括凹面。 该凹部具有比开口侧宽的开口侧和底侧。 在该装置中，金属电极的凹凸变小。

公开(公告)号：US20060006553A1

公开(公告)日：2006-01-12

申请号：US11216814

申请日：2005-08-31

申请人： Jason Fuller ,  Frank Hall ,  Tongbi Jiang

发明人： Jason Fuller ,  Frank Hall ,  Tongbi Jiang

IPC分类号： H01L23/29

CPC分类号： H01L23/13 ,  H01L21/563 ,  H01L23/3128 ,  H01L23/4951 ,  H01L23/49816 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L24/83 ,  H01L24/85 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/0401 ,  H01L2224/06135 ,  H01L2224/06136 ,  H01L2224/16 ,  H01L2224/2919 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2224/48463 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/73215 ,  H01L2224/73257 ,  H01L2224/73265 ,  H01L2224/8314 ,  H01L2224/83192 ,  H01L2224/83194 ,  H01L2224/8385 ,  H01L2224/85 ,  H01L2224/92247 ,  H01L2225/0651 ,  H01L2225/06517 ,  H01L2225/06555 ,  H01L2225/06575 ,  H01L2225/06582 ,  H01L2225/06586 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/09701 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2224/78 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099

摘要： An electronic device package is described that includes a non-metal die attached adhesive. The die attach is positioned in discrete positions on a surface to which the die will be fixed. The die is placed on the discrete die attach. The die attach, in an embodiment, is an epoxy resin or other material that is cured. After curing, the die is electrically connected to an external circuit. The volume between the die and surface is filled with an underfill. In an embodiment, underfill cross-links with the die attach.

公开(公告)号：US20050266670A1

公开(公告)日：2005-12-01

申请号：US11124493

申请日：2005-05-05

申请人： Mou-Shiung Lin ,  Shih Lin ,  Hsin-Jung Lo

发明人： Mou-Shiung Lin ,  Shih Lin ,  Hsin-Jung Lo

IPC分类号： H01L21/44 ,  H01L21/48 ,  H01L21/50 ,  H01L21/56 ,  H01L21/60 ,  H01L21/98 ,  H01L23/485 ,  H01L25/065

CPC分类号： H01L21/563 ,  H01L24/13 ,  H01L24/16 ,  H01L24/29 ,  H01L24/81 ,  H01L24/83 ,  H01L24/94 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/05001 ,  H01L2224/05022 ,  H01L2224/05027 ,  H01L2224/05147 ,  H01L2224/05166 ,  H01L2224/05171 ,  H01L2224/05572 ,  H01L2224/05655 ,  H01L2224/13022 ,  H01L2224/1308 ,  H01L2224/13083 ,  H01L2224/13111 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/16237 ,  H01L2224/29011 ,  H01L2224/29012 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/81191 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2224/83192 ,  H01L2224/83194 ,  H01L2224/83907 ,  H01L2225/06513 ,  H01L2225/06527 ,  H01L2924/00013 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/04953 ,  H01L2924/00014 ,  H01L2224/13099 ,  H01L2924/00 ,  H01L2224/29099 ,  H01L2924/00012

摘要： A bonding process includes the following process. A bump is formed on a first electric device. A patterned insulation layer is formed on a second electric device, wherein the patterned insulation layer has a thickness between 5 μm and 400 μm, and an opening is in the patterned insulation layer and exposes the second electric device. The bump is joined to the second electric device exposed by the opening in the patterned insulation layer.

摘要翻译： 粘合过程包括以下过程。 在第一电气设备上形成凸块。 图案化的绝缘层形成在第二电气装置上，其中图案化绝缘层的厚度在5μm和400μm之间，并且开口位于图案化的绝缘层中并暴露第二电气装置。 凸块与由图案化的绝缘层中的开口暴露的第二电气装置接合。

公开(公告)号：US20050253279A1

公开(公告)日：2005-11-17

申请号：US10891377

申请日：2004-07-14

申请人： Qwan Ho Chung

发明人： Qwan Ho Chung

IPC分类号： H01L21/52 ,  H01L21/56 ,  H01L21/58 ,  H01L23/00 ,  H01L23/02 ,  H01L23/31 ,  H01L23/525

CPC分类号： H01L23/564 ,  H01L21/563 ,  H01L23/3192 ,  H01L23/5256 ,  H01L24/29 ,  H01L24/83 ,  H01L2224/2919 ,  H01L2224/83194 ,  H01L2224/8385 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00

摘要： Disclosed are a semiconductor chip package and a method for fabricating the same. The semiconductor chip package includes a semiconductor chip and a circuit board. The semiconductor chip is bonded to the circuit board by means of adhesive except for a metal-exposed region of the semiconductor chip. Anti-migration material is formed between the circuit board and a predetermined portion of the semiconductor chip, in which the predetermined portion of the semiconductor chip has no adhesive, in order to prevent material contained in the metal trace from migrating to the metal-exposed region of the semiconductor chip. A lamination phenomenon is not created between the circuit board and the semiconductor chip after the HAST has been carried out.

摘要翻译： 公开了一种半导体芯片封装及其制造方法。 半导体芯片封装包括半导体芯片和电路板。 除了半导体芯片的金属曝光区域之外，通过粘合剂将半导体芯片接合到电路板。 防电迁移材料形成在电路板和半导体芯片的预定部分之间，其中半导体芯片的预定部分没有粘合剂，以防止包含在金属迹线中的材料迁移到金属暴露区域 的半导体芯片。 在执行HAST之后，在电路板和半导体芯片之间不产生叠层现象。

公开(公告)号：US20050194680A1

公开(公告)日：2005-09-08

申请号：US11117201

申请日：2005-04-28

申请人： Noriyuki Honda ,  Nobuhiro Hanai ,  Masakazu Nakada

发明人： Noriyuki Honda ,  Nobuhiro Hanai ,  Masakazu Nakada

IPC分类号： H01L21/56 ,  H01L21/60 ,  H01R4/04 ,  H05K3/32 ,  G02F1/1339

CPC分类号： H01L24/31 ,  H01L21/563 ,  H01L24/29 ,  H01L24/83 ,  H01L2224/1134 ,  H01L2224/13144 ,  H01L2224/16225 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/83192 ,  H01L2224/83194 ,  H01L2224/838 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/14 ,  H01L2924/351 ,  H01R4/04 ,  H05K3/323 ,  H05K2201/0209 ,  H05K2201/10674 ,  H05K2203/1189 ,  H01L2924/00014 ,  H01L2224/13099 ,  H01L2924/00 ,  H01L2924/3512

摘要： The present invention is to provide an electrical connection material through which an electrical connection via conductive particles can be performed reliably regardless of a little unevenness of an object. The electrical connection material is an electrical connection material 100 for electrically connecting an electrical connection portion of a first object 4 and an electrical connection portion of a second object 2. The electrical connection material 100 comprises a first film-like adhesive layer 6 which is a film-like adhesive layer arranged on the first object 4 and is composed of a plurality of conductive particles 7, a first binder 8 containing the conductive particles 7, and a first filler F1 and a second film-like adhesive layer 9 which is arranged on the first film-like adhesive layer 6 and is composed of a second binder 9A whose viscosity is lower than that of the first binder 8 and a second filler F2.

摘要翻译： 本发明提供一种电连接材料，通过该电连接材料可以可靠地执行通过导电颗粒的电连接，而不管物体的一些不均匀性。 电连接材料是用于电连接第一物体4的电连接部分和第二物体2的电连接部分的电连接材料100。 电连接材料100包括第一膜状粘合剂层6，其为布置在第一物体4上的膜状粘合剂层，并且由多个导电颗粒7，包含导电颗粒7的第一粘合剂8和 第一填料F 1和第二膜状粘合层9，其布置在第一膜状粘合剂层6上，并且由粘度低于第一粘合剂8的第二粘合剂9A和第二填料 F 2。

公开(公告)号：US20050172891A1

公开(公告)日：2005-08-11

申请号：US10892133

申请日：2004-07-16

申请人： Shinsuke Suzuki ,  Shinji Muraki

发明人： Shinsuke Suzuki ,  Shinji Muraki

IPC分类号： H01L21/52 ,  B05B1/14 ,  B05C5/00 ,  B05C5/02 ,  B65B1/00 ,  B65C1/00 ,  H01L21/00 ,  H01L21/44 ,  H01L21/58

CPC分类号： H01L24/27 ,  B05B1/14 ,  B05C5/0208 ,  H01L21/6715 ,  H01L24/29 ,  H01L24/30 ,  H01L24/743 ,  H01L24/83 ,  H01L2224/3003 ,  H01L2224/30151 ,  H01L2224/743 ,  H01L2224/83192 ,  H01L2224/83194 ,  H01L2224/8385 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01023 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/07802 ,  Y10T156/10 ,  H01L2924/00

摘要： A dies bonding apparatus is provided with a nozzle unit for supplying an adhesive agent to a rectangular bonding area of a chip mounting surface. The nozzle unit includes a central nozzle for discharging an adhesive agent to the center of the bonding area, and a plurality of peripheral nozzles provided around the central nozzle and whose amount of discharge of the adhesive agent is smaller than the amount of discharge of the adhesive agent from the central nozzle.

摘要翻译： 模具接合装置设置有用于将粘合剂供应到芯片安装表面的矩形接合区域的喷嘴单元。 喷嘴单元包括用于将粘合剂排放到接合区域的中心的中心喷嘴和围绕中心喷嘴设置的多个周边喷嘴，并且粘合剂的排出量小于粘合剂的排出量 代理从中心喷嘴。