知搜-全球专利检索

  1. 登录
  2. 注册

搜索结果

641 条记录 (耗时 0.021 秒)

    FUSION BONDED LIQUID CRYSTAL POLYMER CIRCUIT STRUCTURE
    41.
    发明申请
    FUSION BONDED LIQUID CRYSTAL POLYMER CIRCUIT STRUCTURE 审中-公开
    熔融粘结液晶聚合物电路结构

    公开(公告)号：US20160014908A1

    公开(公告)日：2016-01-14

    申请号：US14864215

    申请日：2015-09-24

    申请人： HSIO TECHNOLOGIES, LLC

    发明人： JAMES RATHBURN

    IPC分类号： H05K3/46 ,  B23K1/19 ,  B23K1/00 ,  H05K3/42 ,  B23K26/40 ,  C25D7/12 ,  C25D3/38 ,  B23K26/382 ,  B23K26/402

    CPC分类号： H05K3/4623 ,  B23K2103/12 ,  B23K2103/30 ,  C23C18/1653 ,  C23C18/1689 ,  C23C18/38 ,  C25D5/022 ,  C25D7/123 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/15311 ,  H05K1/0393 ,  H05K3/421 ,  H05K3/429 ,  H05K3/4635 ,  H05K3/4679 ,  H05K2201/0141 ,  H05K2201/09563 ,  Y10T29/49002 ,  H01L2924/00014

    摘要： A method of making a multilayered, fusion bonded circuit structure. A first circuitry layer is attached to a first major surface of a first LCP substrate. A plurality of first recesses are formed that extend from a second major surface of the first substrate to the first circuitry layer. The first recesses are then plated to form a plurality of first conductive pillars of solid metal that substantially fill the first recesses. A plurality of second recesses are formed in a second LCP substrate corresponding to a plurality of the first conductive pillars. The second recess are plated to form a plurality of second conductive structures that extend between first and second major surfaces of the second substrate. The second major surface of the first substrate is positioned adjacent to the second major surface of the second substrate. The first conductive pillars are aligned with the second conductive structures. The stack is then fusion bonded to mechanically couple the first conductive pillars to the second conductive structures.

    摘要翻译： 一种制造多层熔接电路结构的方法。 第一电路层附接到第一LCP衬底的第一主表面。 形成从第一基板的第二主表面延伸到第一电路层的多个第一凹槽。 然后电镀第一凹槽以形成基本上填充第一凹槽的多个固体金属的第一导电柱。 在对应于多个第一导电柱的第二LCP衬底中形成多个第二凹部。 电镀第二凹槽以形成在第二基底的第一和第二主表面之间延伸的多个第二导电结构。 第一基板的第二主表面邻近第二基板的第二主表面定位。 第一导电柱与第二导电结构对准。 然后将堆叠熔合以将第一导电柱机械地耦合到第二导电结构。

    MULTILAYER BOARD
    42.
    发明申请
    MULTILAYER BOARD 有权
    多层板

    公开(公告)号：US20160014893A1

    公开(公告)日：2016-01-14

    申请号：US14859625

    申请日：2015-09-21

    申请人： Murata Manufacturing Co., Ltd.

    发明人： Kuniaki YOSUI

    IPC分类号： H05K1/03 ,  H05K1/02

    CPC分类号： H05K1/0346 ,  H05K1/028 ,  H05K1/0333 ,  H05K3/4632 ,  H05K3/4691 ,  H05K2201/0129 ,  H05K2201/0141 ,  H05K2201/0154

    摘要： In a flexible board including laminated resin layers containing the same thermoplastic resin as a principal material, a rigid portion includes a region in which a first resin layer is disposed between a second resin layer defining an upper principal surface and a third resin layer defining a lower principal surface so that the rigid portion has a large thickness, and a flexible portion includes a region in which the first resin layer is not disposed between the second and third resin layers so that the flexible portion has flexibility, a step portion at which a thickness changes is between the rigid and flexible portions, and the second and third resin layers extend in a region from the rigid portion beyond the step portion to the flexible portion.

    摘要翻译： 在包含含有与主要材料相同的热塑性树脂的层叠树脂层的柔性基板中，刚性部分包括第一树脂层设置在限定上主表面的第二树脂层和限定下主面的第三树脂层之间的区域 主表面，使得刚性部分具有大的厚度，并且柔性部分包括第一树脂层未设置在第二和第三树脂层之间的区域，使得柔性部分具有柔性，阶梯部分的厚度 在刚性部分和柔性部分之间变化，并且第二和第三树脂层在从刚性部分超过台阶部分到柔性部分的区域中延伸。

    HYBRID PRINTED CIRCUIT BOARD CONSTRUCTION
    46.
    发明申请
    HYBRID PRINTED CIRCUIT BOARD CONSTRUCTION 有权
    混合印刷电路板结构

    公开(公告)号：US20150289368A1

    公开(公告)日：2015-10-08

    申请号：US14248108

    申请日：2014-04-08

    申请人： FINISAR CORPORATION

    发明人： Henry Meyer Daghighian ,  Steven C. Bird ,  Gerald Douglas Babel

    IPC分类号： H05K1/03 ,  H05K1/09 ,  H05K1/02

    CPC分类号： H05K3/4688 ,  H01L2224/48227 ,  H01L2224/85464 ,  H05K1/024 ,  H05K1/0366 ,  H05K3/244 ,  H05K2201/0141 ,  H05K2201/0154 ,  H05K2201/0191

    摘要： A hybrid printed circuit board is described. The hybrid printed circuit board may include a top layer, a bottom layer, and a plurality of internal layers stacked up between the top layer and the bottom layer. The plurality of internal layers may include a first internal layer below the top layer and a second internal layer above the bottom layer. The hybrid printed circuit board may include first unreinforced laminate placed between the top layer and the first internal layer. The hybrid circuit board may additionally include second unreinforced laminate placed between the second internal layer and the bottom layer. The hybrid printed circuit board may include third laminate placed between adjacent internal layers of the plurality of internal layers.

    摘要翻译： 描述了混合印刷电路板。 混合印刷电路板可以包括顶层，底层和堆叠在顶层和底层之间的多个内层。 多个内层可以包括在顶层下面的第一内层和在底层之上的第二内层。 混合印刷电路板可以包括放置在顶层和第一内层之间的第一未加强的层压材料。 混合电路板可以另外包括放置在第二内层和底层之间的第二未加强层叠体。 混合印刷电路板可以包括放置在多个内层的相邻内层之间的第三层压体。