公开(公告)号：US20240347357A1

公开(公告)日：2024-10-17

申请号：US18754815

申请日：2024-06-26

申请人： TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.

发明人： Hsien Yu TSENG ,  Sheng-Feng LIU

IPC分类号： H01L21/67 ,  G06F30/367 ,  G06F30/398 ,  G06F119/08

CPC分类号： H01L21/67248 ,  G06F30/367 ,  G06F30/398 ,  G06F2119/08

摘要： A system for evaluating a heat sensitive structure of an integrated circuit design including a memory for retrieving and storing integrated circuit design layout data, thermal data, process data, and one or more operational parameters, a processor capable of accessing the memory and identifying a target region having a nominal temperature Tnom, a plurality of heat generating structures and/or heat dissipating structures having corresponding impact areas that encompass a portion of the target region, calculating the temperature increases and/or decreases in the target region as a result of thermal coupling between the target region and the heat generating structures and/or heat dissipating structures, and conducting one or more parametric evaluations of the target region at an adjusted evaluation temperature TE after which a network interface transmits the result(s) of the parametric evaluation(s) for use in a design review.

公开(公告)号：US12099792B2

公开(公告)日：2024-09-24

申请号：US18341400

申请日：2023-06-26

申请人： TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.

发明人： Hsien Yu Tseng ,  Amit Kundu ,  Chun-Wei Chang ,  Szu-Lin Liu ,  Sheng-Feng Liu

IPC分类号： G06F30/398 ,  G06F111/20 ,  G06F119/08 ,  G06F119/10 ,  H01L29/78

CPC分类号： G06F30/398 ,  G06F2111/20 ,  G06F2119/08 ,  G06F2119/10 ,  H01L29/785

摘要： An electromigration (EM) sign-off methodology that utilizes a system for analyzing an integrated circuit design layout to identify heat sensitive structures, self-heating effects, heat generating structures, and heat dissipating structures. The EM sign-off methodology includes a memory and a processor configured for calculating adjustments of an evaluation temperature for a heat sensitive structure by calculating the effects of self-heating within the temperature sensitive structure as well as additional heating and/or cooling as a function of thermal coupling to surrounding heat generating structures and/or heat dissipating elements located within a defined thermal coupling volume or range of the heat sensitive structures.

公开(公告)号：US12074198B2

公开(公告)日：2024-08-27

申请号：US17453300

申请日：2021-11-02

申请人： Analog Power Conversion LLC

发明人： Amaury Gendron-Hansen ,  Dumitru Gheorge Sdrulla ,  Leslie Louis Szepesi

IPC分类号： H01L29/06 ,  G06F30/39 ,  H01L29/08 ,  H01L29/10 ,  H01L29/423 ,  H01L29/66 ,  H01L29/78 ,  G06F119/08 ,  H01L29/16

CPC分类号： H01L29/0696 ,  G06F30/39 ,  H01L29/0856 ,  H01L29/1045 ,  H01L29/105 ,  H01L29/42368 ,  H01L29/42376 ,  H01L29/4238 ,  H01L29/66068 ,  H01L29/7802 ,  G06F2119/08 ,  H01L29/1608

摘要： A tub of a semiconductor device includes a cool zone with a first projected operating temperature and a hot zone with a second projected operating temperature greater than the first projected operating temperature. A design parameter has a first value in the cool zone and a second value different from the first value in the hot zone. The difference configures the tub to dissipate less heat in the hot zone during operation of the semiconductor device than would be dissipated if the first and second values were equal. The design parameter may be, for example, a tub width, a source structure width, a JFET region width, a channel length, a channel width, a length of a gate, a displacement of a center of the gate relative to a center of a JFET region, a dopant concentration, or a combination thereof.

公开(公告)号：US12055503B2

公开(公告)日：2024-08-06

申请号：US16980164

申请日：2019-01-18

申请人： KOA Corporation

发明人： Hirotoshi Aoki ,  Koichi Hirasawa

IPC分类号： G01N25/18 ,  G01K7/42 ,  G01N27/18 ,  G06F30/20 ,  G06F30/367 ,  G06F119/08

CPC分类号： G01N25/18 ,  G01K7/427 ,  G01N27/18 ,  G06F30/20 ,  G06F30/367 ,  G06F2119/08

摘要： A thermal analysis model includes an intermediate node that imitates an intermediate portion and a first thermal resistance connecting to the intermediate node, and imitates the terminal portions on both sides. A terminal portion inside node connected to the first thermal resistance is configured to imitate an inside area adjacent to the intermediate portion and serves as a starting point of a first heat dissipation path to the substrate. A terminal outside node is configured to imitate an outside area separated from the intermediate portion and adjacent to the inside area in the terminal portions and serves as a starting point of a second heat dissipation path to the substrate. A second thermal resistance connects the terminal portion inside node and the terminal portion outside node and is arranged parallel to a different element imitating a thermal resistance of an electrode layer in a surface of the substrate.

公开(公告)号：US20240202398A1

公开(公告)日：2024-06-20

申请号：US18547043

申请日：2021-02-18

申请人： Shameran WARDA

发明人： Shameran WARDA

IPC分类号： G06F30/20 ,  G06F30/13 ,  G06F119/08 ,  G06Q50/08

CPC分类号： G06F30/20 ,  G06F30/13 ,  G06Q50/08 ,  G06F2119/08

摘要： A building system with method of data gathering from various sources in various categories, data interaction providing enhanced search results and building characteristic management resulting in effective building, material product data and building characteristic values. Use of the data on defragmentation of a building design into subsets such as 71 to 84 and assessment of the individual subset and then the relative effect of one subset on adjacent subset so as to provide a whole effect of building characteristic values on the reconfigured building design and building construction.

公开(公告)号：US12013291B2

公开(公告)日：2024-06-18

申请号：US17070803

申请日：2020-10-14

申请人： Applied Materials, Inc.

发明人： Shuran Sheng ,  Lin Zhang ,  Joseph C. Werner

IPC分类号： G01K3/00 ,  G01K3/10 ,  G03F7/42 ,  G06F119/08

CPC分类号： G01K3/005 ,  G01K3/10 ,  G03F7/427 ,  G06F2119/08

摘要： Embodiments herein provide methods of monitoring temperatures of fluid delivery conduits for delivering fluids to, and other components external to, a processing volume of a processing chamber used in electronic device fabrication manufacturing, and monitoring systems related thereto. In one embodiment, a method includes receiving, at the temperature monitoring system (TMS) controller, information from a first plurality of temperature sensors and a second plurality of temperature sensors, comparing, using the TMS controller, the temperature information to one or more pre-determined control limits, and communicating, using the TMS controller, an out-of-control event to a user. Generally, the temperature monitoring system features the first and second pluralities of temperature sensors, the TMS controller, a first connection module, and a second connection module.

公开(公告)号：US20240159697A1

公开(公告)日：2024-05-16

申请号：US18504800

申请日：2023-11-08

申请人： PETRÓLEO BRASILEIRO S.A. - PETROBRAS ,  UNIVERSIDADE FEDERAL DO RIO DE JANEIRO

发明人： MARCIA CRISTINA KHALIL DE OLIVEIRA ,  MÁRCIO NELE DE SOUZA ,  ANTONIO MAURICIO CHAGAS MACIEL ,  ANDRÉ DA SILVA GUIMARÃES ,  THIAGO OLIVEIRA MARINHO ,  PRÍAMO ALBUQUERQUE DE MELO JUNIOR

IPC分类号： G01N25/48 ,  G06F30/28 ,  G06F111/10 ,  G06F113/08 ,  G06F119/08 ,  G06F119/14

CPC分类号： G01N25/4873 ,  G06F30/28 ,  G06F2111/10 ,  G06F2113/08 ,  G06F2119/08 ,  G06F2119/14

摘要： The present invention relates to a method for predicting the restart of paraffinic oil flow by being able to estimate the precipitated paraffin fraction under conditions of production stoppage through differential scanning calorimetry (DSC) tests and rheological evaluation, to predict the yield stress (TLE) profiles in pipes containing gelled paraffinic petroleum and the time interval until line blockage formation (available waiting time—TED).

公开(公告)号：US11915142B2

公开(公告)日：2024-02-27

申请号：US17228119

申请日：2021-04-12

申请人： PassiveLogic, Inc.

发明人： Troy Aaron Harvey ,  Jeremy David Fillingim

IPC分类号： G06F30/18 ,  G06N3/084 ,  G06N3/063 ,  G06F9/30 ,  G06N3/04 ,  G05B13/02 ,  G06F17/16 ,  G06N3/08 ,  G06F30/27 ,  F24F11/64 ,  G05B19/042 ,  F24F11/65 ,  G06Q10/067 ,  G05B13/04 ,  G06N3/047 ,  G06N3/048 ,  G06F119/08 ,  F24F120/10 ,  F24F120/20 ,  G06F119/06 ,  F24F140/50

CPC分类号： G06N3/084 ,  F24F11/64 ,  F24F11/65 ,  G05B13/027 ,  G05B13/04 ,  G05B19/042 ,  G06F9/30036 ,  G06F17/16 ,  G06F30/18 ,  G06F30/27 ,  G06N3/04 ,  G06N3/047 ,  G06N3/048 ,  G06N3/063 ,  G06N3/08 ,  G06Q10/067 ,  G06Q50/163 ,  F24F2120/10 ,  F24F2120/20 ,  F24F2140/50 ,  G05B2219/2614 ,  G06F2119/06 ,  G06F2119/08

摘要： A structure thermodynamic model, which models the physical characteristics of a controlled space, inputs a constraint state curve which gives constraints, such as temperature, that a controlled space is to meet; and outputs a state injection time series which is the amount of state needed for the controlled space to optimize the constraint state curve. The state injection time series curve is then used as input into an equipment model, which models equipment behavior in the controlled space. The equipment model outputs equipment control actions per control time (a control sequence) which can be used to control the equipment in the controlled space. Some embodiments train the models using training data.

公开(公告)号：US11853661B2

公开(公告)日：2023-12-26

申请号：US17664241

申请日：2022-05-20

申请人： ANSYS, INC.

发明人： Norman Chang ,  Hsiming Pan ,  Jimin Wen ,  Deqi Zhu ,  Wenbo Xia ,  Akhilesh Kumar ,  Wen-Tze Chuang ,  En-Cih Yang ,  Karthik Srinivasan ,  Ying-Shiun Li

IPC分类号： G06F30/27 ,  G06F119/08 ,  G06F113/18

CPC分类号： G06F30/27 ,  G06F2113/18 ,  G06F2119/08

摘要： Machine assisted systems and methods for enhancing the resolution of an IC thermal profile from a system analysis are described. These systems and methods can use a neural network based predictor, that has been trained to determine a temperature rise across an entire IC. The training of the predictor can include generating a representation of two or more templates identifying different portions of an integrated circuit (IC), each template associated with location parameters to position the template in the IC; performing thermal simulations for each respective template of the IC, each thermal simulation determining an output based on a power pattern of tiles of the respective template, the output indicating a change in temperature of a center tile of the respective template relative to a base temperature of the integrated circuit; and training a neural network. The trained predictor can be used to determine a temperature rise and then can be appended to a system level thermal profile of the IC to generate a detailed thermal profile of the IC.

公开(公告)号：US11829699B1

公开(公告)日：2023-11-28

申请号：US17407094

申请日：2021-08-19

申请人： Kepler Computing Inc.

发明人： Amrita Mathuriya ,  Christopher B. Wilkerson ,  Rajeev Kumar Dokania ,  Debo Olaosebikan ,  Sasikanth Manipatruni

IPC分类号： G06F30/398 ,  G06F1/20 ,  G06F30/392 ,  G06F30/3308 ,  G06F30/367 ,  G06F119/06 ,  G06F119/02 ,  G06F115/10 ,  G06F117/08 ,  G06F119/08

CPC分类号： G06F30/398 ,  G06F1/206 ,  G06F30/3308 ,  G06F30/367 ,  G06F30/392 ,  G06F2115/10 ,  G06F2117/08 ,  G06F2119/02 ,  G06F2119/06 ,  G06F2119/08

摘要： A packaging technology to improve performance of an AI processing system resulting in an ultra-high bandwidth system. An IC package is provided which comprises: a substrate; a first die on the substrate, and a second die stacked over the first die. The first die can be a first logic die (e.g., a compute chip, CPU, GPU, etc.) while the second die can be a compute chiplet comprising ferroelectric or paraelectric logic. Both dies can include ferroelectric or paraelectric logic. The ferroelectric/paraelectric logic may include AND gates, OR gates, complex gates, majority, minority, and/or threshold gates, sequential logic, etc. The IC package can be in a 3D or 2.5D configuration that implements logic-on-logic stacking configuration. The 3D or 2.5D packaging configurations have chips or chiplets designed to have time distributed or spatially distributed processing. The logic of chips or chiplets is segregated so that one chip in a 3D or 2.5D stacking arrangement is hot at a time.