Tool measurement device for a machine tool

    公开(公告)号:US12048977B2

    公开(公告)日:2024-07-30

    申请号:US17432014

    申请日:2020-03-11

    Applicant: RENISHAW PLC

    Abstract: An optical tool measurement device for a machine tool is described. The device includes a light source for directing light towards a tool-sensing region and a sensor for detecting light from the tool-sensing region. A shutter assembly for selectively protecting the sensor from contamination is also provided. The shutter assembly is to provide a closed configuration in which the sensor is covered by the shutter assembly thereby preventing contamination of the sensor and an open configuration in which light can pass to the sensor through a first aperture of the shutter assembly. Furthermore, the shutter assembly is configured to additionally provide a constricted configuration in which light can pass to the sensor through a second aperture of the shutter assembly, the second aperture being smaller than the first aperture. In this manner, the device has enhanced resistance to contaminants, such as swarf and coolant, present in the machine tool environment.

    DICING APPARATUS AND METHOD FOR CONTROLLING DICING APPARATUS

    公开(公告)号:US20240246187A1

    公开(公告)日:2024-07-25

    申请号:US18406688

    申请日:2024-01-08

    Inventor: Takashi TAMOGAMI

    CPC classification number: B23Q17/0904 B23Q17/20 B23Q17/2471

    Abstract: Provided is a dicing apparatus and a method for controlling a dicing apparatus that can discover undivided defects in a die attach film.
    A dicing apparatus 10 that performs dicing of a street of a workpiece W attached to a dicing tape 9 via a die attach film (DAF 7) and cuts the workpiece W and the die attach film along the street includes: a cross-sectional profile acquisition unit (a white interference microscope 24 and a processing unit 64) that acquires a cross-sectional profile of a machined groove 19 formed through the dicing; a cut amount detection unit 72 that detects a cut amount Δd into the die attach film obtained through the dicing on the basis of the cross-sectional profile acquired by the cross-sectional profile acquisition unit; and a division determination unit 74 that determines whether or not the die attach film is in an undivided state on the basis of the cut amount detected by the cut amount detection unit 72.

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