公开(公告)号：US09177881B2

公开(公告)日：2015-11-03

申请号：US14093849

申请日：2013-12-02

Applicant: Kabushiki Kaisha Toshiba

Inventor： Yoshiyuki Ikuma ,  Masatoshi Suzuki

IPC: H01L23/10 ,  H01L23/552 ,  H01L23/66 ,  H01L23/045 ,  H01L23/20

CPC classification number: H01L23/10 ,  H01L23/045 ,  H01L23/20 ,  H01L23/552 ,  H01L23/66 ,  H01L24/73 ,  H01L2224/04042 ,  H01L2224/05553 ,  H01L2224/06135 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2924/1515 ,  H01L2924/15153 ,  H01L2924/16152 ,  H01L2924/16172 ,  H01L2924/16176 ,  H01L2924/16195 ,  H01L2924/16251 ,  H01L2924/00012 ,  H01L2924/00

Abstract: Certain embodiments provide a high-frequency semiconductor package including: a base which is made of metal and is a grounding portion; a multi-layer wiring resin substrate; a first internal conductor film; and a lid. The multi-layer wiring resin substrate is provided on a top surface of the base, and has a frame shape in which a first cavity from which the top surface of the base is exposed is formed. The first internal conductor film covers surfaces which form a top surface of the multi-layer wiring resin substrate and an inner wall surface of the first cavity, and is electrically connected with the base. The lid is attached onto the multi-layer wiring resin substrate, and seals and covers the first cavity.

Abstract translation: 某些实施例提供了一种高频半导体封装，包括：由金属制成并为接地部分的基座; 多层布线树脂基板; 第一内部导体膜; 和盖子。 多层布线树脂基板设置在基座的上表面上，并且具有框架形状，其中形成有暴露基部的顶表面的第一空腔。 第一内部导体膜覆盖形成多层布线树脂基板的顶面的表面和第一空腔的内壁面，并与基底电连接。 将盖附接到多层布线树脂基板上，并密封并覆盖第一空腔。

公开(公告)号：US20160268178A1

公开(公告)日：2016-09-15

申请号：US14434239

申请日：2014-05-14

Applicant: Paul J. Gwin

Inventor： Paul J. Gwin

IPC: H01L23/053 ,  H01L23/06 ,  H01L21/56 ,  H01L23/31 ,  H01L21/50 ,  G06F1/18 ,  H01L23/00 ,  H01L23/08 ,  H01L21/48

CPC classification number: H01L23/053 ,  G06F1/18 ,  H01L21/4803 ,  H01L21/481 ,  H01L21/4817 ,  H01L21/50 ,  H01L21/565 ,  H01L23/04 ,  H01L23/06 ,  H01L23/08 ,  H01L23/10 ,  H01L23/3142 ,  H01L24/16 ,  H01L24/17 ,  H01L24/32 ,  H01L24/73 ,  H01L24/81 ,  H01L2224/16113 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01022 ,  H01L2924/01026 ,  H01L2924/01028 ,  H01L2924/0133 ,  H01L2924/06 ,  H01L2924/0615 ,  H01L2924/0635 ,  H01L2924/065 ,  H01L2924/068 ,  H01L2924/069 ,  H01L2924/0695 ,  H01L2924/0705 ,  H01L2924/10253 ,  H01L2924/1438 ,  H01L2924/1443 ,  H01L2924/15153 ,  H01L2924/16152 ,  H01L2924/16176 ,  H01L2924/1619 ,  H01L2924/19105 ,  H01L2924/00

Abstract: Embodiments of the present disclosure are directed toward a molded composite enclosure for an integrated circuit (IC) assembly. In one embodiment, an enclosure for an integrated circuit (IC) assembly may include a molded lid structure having a body portion, and a side portion that extends from the body portion and forms a cavity configured to house the IC assembly, wherein the body portion and the side portion share a contiguous interior material comprising a polymer and share a contiguous exterior material comprising a metal, the contiguous interior material having an opening formed in the body portion such that the IC assembly can be thermally coupled with the contiguous exterior material through the opening. Other embodiments may be described and/or claimed.

Abstract translation: 本公开的实施例涉及用于集成电路（IC）组件的模制复合外壳。 在一个实施例中，用于集成电路（IC）组件的外壳可以包括具有主体部分的模制盖结构和从主体部分延伸并形成用于容纳IC组件的空腔的侧部，其中主体部分 并且所述侧部共享包含聚合物的连续内部材料并且共享包含金属的连续的外部材料，所述连续内部材料具有形成在所述主体部分中的开口，使得所述IC组件可以通过所述连接的外部材料与所述连接的外部材料热耦合 开放 可以描述和/或要求保护其他实施例。

公开(公告)号：US20170170085A1

公开(公告)日：2017-06-15

申请号：US15431296

申请日：2017-02-13

Applicant: Intel Corporation

Inventor： Paul J. Gwin

IPC: H01L23/053 ,  H01L23/10 ,  H01L23/00 ,  H01L23/06 ,  H01L23/08 ,  H01L21/48 ,  H01L21/50

CPC classification number: H01L23/053 ,  G06F1/18 ,  H01L21/4803 ,  H01L21/481 ,  H01L21/4817 ,  H01L21/50 ,  H01L21/565 ,  H01L23/04 ,  H01L23/06 ,  H01L23/08 ,  H01L23/10 ,  H01L23/3142 ,  H01L24/16 ,  H01L24/17 ,  H01L24/32 ,  H01L24/73 ,  H01L24/81 ,  H01L2224/16113 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01022 ,  H01L2924/01026 ,  H01L2924/01028 ,  H01L2924/0133 ,  H01L2924/06 ,  H01L2924/0615 ,  H01L2924/0635 ,  H01L2924/065 ,  H01L2924/068 ,  H01L2924/069 ,  H01L2924/0695 ,  H01L2924/0705 ,  H01L2924/10253 ,  H01L2924/1438 ,  H01L2924/1443 ,  H01L2924/15153 ,  H01L2924/16152 ,  H01L2924/16176 ,  H01L2924/1619 ,  H01L2924/19105 ,  H01L2924/00

Abstract: Embodiments of the present disclosure are directed toward a molded composite enclosure for an integrated circuit (IC) assembly. In one embodiment, an enclosure for an integrated circuit (IC) assembly may include a molded lid structure having a body portion, and a side portion that extends from the body portion and forms a cavity configured to house the IC assembly, wherein the body portion and the side portion share a contiguous interior material comprising a polymer and share a contiguous exterior material comprising a metal, the contiguous interior material having an opening formed in the body portion such that the IC assembly can be thermally coupled with the contiguous exterior material through the opening. Other embodiments may be described and/or claimed.

公开(公告)号：US09607914B2

公开(公告)日：2017-03-28

申请号：US14434239

申请日：2014-05-15

Applicant: Intel Corporation

Inventor： Paul J. Gwin

IPC: H01L23/053 ,  H01L23/04 ,  H01L23/06 ,  G06F1/18 ,  H01L21/48 ,  H01L21/50 ,  H01L21/56 ,  H01L23/08 ,  H01L23/31 ,  H01L23/00

CPC classification number: H01L23/053 ,  G06F1/18 ,  H01L21/4803 ,  H01L21/481 ,  H01L21/4817 ,  H01L21/50 ,  H01L21/565 ,  H01L23/04 ,  H01L23/06 ,  H01L23/08 ,  H01L23/10 ,  H01L23/3142 ,  H01L24/16 ,  H01L24/17 ,  H01L24/32 ,  H01L24/73 ,  H01L24/81 ,  H01L2224/16113 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01022 ,  H01L2924/01026 ,  H01L2924/01028 ,  H01L2924/0133 ,  H01L2924/06 ,  H01L2924/0615 ,  H01L2924/0635 ,  H01L2924/065 ,  H01L2924/068 ,  H01L2924/069 ,  H01L2924/0695 ,  H01L2924/0705 ,  H01L2924/10253 ,  H01L2924/1438 ,  H01L2924/1443 ,  H01L2924/15153 ,  H01L2924/16152 ,  H01L2924/16176 ,  H01L2924/1619 ,  H01L2924/19105 ,  H01L2924/00

Abstract: Embodiments of the present disclosure are directed toward a molded composite enclosure for an integrated circuit (IC) assembly. In one embodiment, an enclosure for an integrated circuit (IC) assembly may include a molded lid structure having a body portion, and a side portion that extends from the body portion and forms a cavity configured to house the IC assembly, wherein the body portion and the side portion share a contiguous interior material comprising a polymer and share a contiguous exterior material comprising a metal, the contiguous interior material having an opening formed in the body portion such that the IC assembly can be thermally coupled with the contiguous exterior material through the opening. Other embodiments may be described and/or claimed.

公开(公告)号：US10056308B2

公开(公告)日：2018-08-21

申请号：US15431296

申请日：2017-02-13

Applicant: Intel Corporation

Inventor： Paul J. Gwin

IPC: H01L23/12 ,  H01L23/053 ,  H01L23/04 ,  H01L23/06 ,  G06F1/18 ,  H01L21/48 ,  H01L21/50 ,  H01L21/56 ,  H01L23/08 ,  H01L23/31 ,  H01L23/00 ,  H01L23/10

CPC classification number: H01L23/053 ,  G06F1/18 ,  H01L21/4803 ,  H01L21/481 ,  H01L21/4817 ,  H01L21/50 ,  H01L21/565 ,  H01L23/04 ,  H01L23/06 ,  H01L23/08 ,  H01L23/10 ,  H01L23/3142 ,  H01L24/16 ,  H01L24/17 ,  H01L24/32 ,  H01L24/73 ,  H01L24/81 ,  H01L2224/16113 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01022 ,  H01L2924/01026 ,  H01L2924/01028 ,  H01L2924/0133 ,  H01L2924/06 ,  H01L2924/0615 ,  H01L2924/0635 ,  H01L2924/065 ,  H01L2924/068 ,  H01L2924/069 ,  H01L2924/0695 ,  H01L2924/0705 ,  H01L2924/10253 ,  H01L2924/1438 ,  H01L2924/1443 ,  H01L2924/15153 ,  H01L2924/16152 ,  H01L2924/16176 ,  H01L2924/1619 ,  H01L2924/19105 ,  H01L2924/00

Abstract: Embodiments of the present disclosure are directed toward a molded composite enclosure for an integrated circuit (IC) assembly. In one embodiment, an enclosure for an integrated circuit (IC) assembly may include a molded lid structure having a body portion, and a side portion that extends from the body portion and forms a cavity configured to house the IC assembly, wherein the body portion and the side portion share a contiguous interior material comprising a polymer and share a contiguous exterior material comprising a metal, the contiguous interior material having an opening formed in the body portion such that the IC assembly can be thermally coupled with the contiguous exterior material through the opening. Other embodiments may be described and/or claimed.

公开(公告)号：US20140252569A1

公开(公告)日：2014-09-11

申请号：US14093849

申请日：2013-12-02

Applicant: Kabushiki Kaisha Toshiba

Inventor： Yoshiyuki Ikuma ,  Masatoshi Suzuki

IPC: H01L23/10 ,  H01L23/552

CPC classification number: H01L23/10 ,  H01L23/045 ,  H01L23/20 ,  H01L23/552 ,  H01L23/66 ,  H01L24/73 ,  H01L2224/04042 ,  H01L2224/05553 ,  H01L2224/06135 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2924/1515 ,  H01L2924/15153 ,  H01L2924/16152 ,  H01L2924/16172 ,  H01L2924/16176 ,  H01L2924/16195 ,  H01L2924/16251 ,  H01L2924/00012 ,  H01L2924/00

Abstract: Certain embodiments provide a high-frequency semiconductor package including: a base which is made of metal and is a grounding portion; a multi-layer wiring resin substrate; a first internal conductor film; and a lid. The multi-layer wiring resin substrate is provided on a top surface of the base, and has a frame shape in which a first cavity from which the top surface of the base is exposed is formed. The first internal conductor film covers surfaces which form a top surface of the multi-layer wiring resin substrate and an inner wall surface of the first cavity, and is electrically connected with the base. The lid is attached onto the multi-layer wiring resin substrate, and seals and covers the first cavity.

Abstract translation: 某些实施例提供了一种高频半导体封装，包括：由金属制成并为接地部分的基座; 多层布线树脂基板; 第一内部导体膜; 和盖子。 多层布线树脂基板设置在基座的上表面上，并且具有框架形状，其中形成有暴露基部的顶表面的第一空腔。 第一内部导体膜覆盖形成多层布线树脂基板的顶面的表面和第一空腔的内壁面，并与基底电连接。 将盖附接到多层布线树脂基板上，并密封并覆盖第一空腔。

公开(公告)号：US08558377B2

公开(公告)日：2013-10-15

申请号：US13286771

申请日：2011-11-01

Applicant: Jin O Yoo

Inventor： Jin O Yoo

IPC: H01L23/552 ,  H01L23/02 ,  H01L23/34

CPC classification number: H01L23/552 ,  H01L23/13 ,  H01L23/3121 ,  H01L23/49833 ,  H01L25/0655 ,  H01L2224/16225 ,  H01L2924/15151 ,  H01L2924/1531 ,  H01L2924/16172 ,  H01L2924/16176 ,  H01L2924/167

Abstract: There is provided a semiconductor package module capable of minimizing a thickness of the module in spite of including an electronic element having a large size. The semiconductor package module includes: a semiconductor package having a shield formed on an outer surface and a side thereof and at least one receiving part provided in a lower surface thereof, the receiving part having a groove shape; and a main substrate having at least one large element and the semiconductor package mounted on one surface thereof, wherein the large element is received in the receiving part of the semiconductor package and is mounted on the main substrate.

Abstract translation: 提供了尽管包括具有大尺寸的电子元件，能够使模块的厚度最小化的半导体封装模块。 半导体封装模块包括：半导体封装，其具有形成在其外表面和侧面上的屏蔽件和设置在其下表面中的至少一个接收部件，所述接收部件具有凹槽形状; 以及主衬底，其具有至少一个大元件，并且所述半导体封装安装在其一个表面上，其中所述大元件被容纳在所述半导体封装的所述接收部分中并安装在所述主衬底上。

公开(公告)号：US09887166B2

公开(公告)日：2018-02-06

申请号：US15165837

申请日：2016-05-26

Applicant: Invensas Corporation

Inventor： Rajesh Katkar ,  Laura Wills Mirkarimi ,  Arkalgud R. Sitaram ,  Charles G. Woychik

IPC: H01L23/538 ,  H01L23/00 ,  H01L25/065 ,  H01L23/367 ,  H01L21/66 ,  H01L21/78 ,  H01L23/10 ,  H01L23/14 ,  H01L23/498 ,  H01L25/00 ,  H01L21/56 ,  H01L23/31 ,  H01L23/04 ,  H01L21/784 ,  H01L25/18

CPC classification number: H01L23/562 ,  H01L21/561 ,  H01L21/78 ,  H01L21/784 ,  H01L22/32 ,  H01L23/04 ,  H01L23/10 ,  H01L23/147 ,  H01L23/3121 ,  H01L23/3135 ,  H01L23/367 ,  H01L23/3675 ,  H01L23/49827 ,  H01L23/49838 ,  H01L24/05 ,  H01L24/06 ,  H01L24/09 ,  H01L24/13 ,  H01L24/14 ,  H01L24/16 ,  H01L24/17 ,  H01L24/32 ,  H01L24/73 ,  H01L24/83 ,  H01L24/92 ,  H01L24/94 ,  H01L24/97 ,  H01L25/0652 ,  H01L25/0655 ,  H01L25/0657 ,  H01L25/18 ,  H01L25/50 ,  H01L2224/0401 ,  H01L2224/05568 ,  H01L2224/05569 ,  H01L2224/0603 ,  H01L2224/06181 ,  H01L2224/131 ,  H01L2224/1403 ,  H01L2224/14181 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/16238 ,  H01L2224/17181 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/83192 ,  H01L2224/92125 ,  H01L2224/92225 ,  H01L2224/94 ,  H01L2224/97 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/06548 ,  H01L2225/06586 ,  H01L2225/06589 ,  H01L2225/06596 ,  H01L2924/12042 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/1615 ,  H01L2924/16152 ,  H01L2924/16153 ,  H01L2924/16176 ,  H01L2924/16235 ,  H01L2924/16251 ,  H01L2924/1632 ,  H01L2924/164 ,  H01L2924/167 ,  H01L2924/16788 ,  H01L2924/1679 ,  H01L2924/181 ,  H01L2924/351 ,  H01L2924/3511 ,  H01L2224/81 ,  H01L2224/83 ,  H01L2924/014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: An assembly with modules (110, 1310) containing integrated circuits and attached to a wiring substrate (120) is reinforced by one or more reinforcement frames (410) attached to the wiring substrate. The modules are located in openings (e.g. cavities and/or through-holes 414) in the reinforcement frame. Other features are also provided.

公开(公告)号：US20160276294A1

公开(公告)日：2016-09-22

申请号：US15165837

申请日：2016-05-26

Applicant: Invensas Corporation

Inventor： Rajesh KATKAR ,  Laura Wills MIRKARIMI ,  Arkalgud SITARAM ,  Charles G. WOYCHIK

IPC: H01L23/00 ,  H01L21/66 ,  H01L23/367 ,  H01L25/065 ,  H01L25/00

CPC classification number: H01L23/562 ,  H01L21/561 ,  H01L21/78 ,  H01L21/784 ,  H01L22/32 ,  H01L23/04 ,  H01L23/10 ,  H01L23/147 ,  H01L23/3121 ,  H01L23/3135 ,  H01L23/367 ,  H01L23/3675 ,  H01L23/49827 ,  H01L23/49838 ,  H01L24/05 ,  H01L24/06 ,  H01L24/09 ,  H01L24/13 ,  H01L24/14 ,  H01L24/16 ,  H01L24/17 ,  H01L24/32 ,  H01L24/73 ,  H01L24/83 ,  H01L24/92 ,  H01L24/94 ,  H01L24/97 ,  H01L25/0652 ,  H01L25/0655 ,  H01L25/0657 ,  H01L25/18 ,  H01L25/50 ,  H01L2224/0401 ,  H01L2224/05568 ,  H01L2224/05569 ,  H01L2224/0603 ,  H01L2224/06181 ,  H01L2224/131 ,  H01L2224/1403 ,  H01L2224/14181 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/16238 ,  H01L2224/17181 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/83192 ,  H01L2224/92125 ,  H01L2224/92225 ,  H01L2224/94 ,  H01L2224/97 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/06548 ,  H01L2225/06586 ,  H01L2225/06589 ,  H01L2225/06596 ,  H01L2924/12042 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/1615 ,  H01L2924/16152 ,  H01L2924/16153 ,  H01L2924/16176 ,  H01L2924/16235 ,  H01L2924/16251 ,  H01L2924/1632 ,  H01L2924/164 ,  H01L2924/167 ,  H01L2924/16788 ,  H01L2924/1679 ,  H01L2924/181 ,  H01L2924/351 ,  H01L2924/3511 ,  H01L2224/81 ,  H01L2224/83 ,  H01L2924/014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: An assembly with modules (110, 1310) containing integrated circuits and attached to a wiring substrate (120) is reinforced by one or more reinforcement frames (410) attached to the wiring substrate. The modules are located in openings (e.g. cavities and/or through-holes 414) in the reinforcement frame. Other features are also provided.

公开(公告)号：US09355997B2

公开(公告)日：2016-05-31

申请号：US14288064

申请日：2014-05-27

Applicant: Invensas Corporation

Inventor： Rajesh Katkar ,  Laura Wills Mirkarimi ,  Arkalgud Sitaram ,  Charles G. Woychik

IPC: H01L25/065 ,  H01L23/367 ,  H01L21/66 ,  H01L21/78 ,  H01L23/10 ,  H01L23/14 ,  H01L23/498 ,  H01L25/00 ,  H01L21/56 ,  H01L23/31 ,  H01L23/00 ,  H01L23/04 ,  H01L21/784 ,  H01L25/18

CPC classification number: H01L23/562 ,  H01L21/561 ,  H01L21/78 ,  H01L21/784 ,  H01L22/32 ,  H01L23/04 ,  H01L23/10 ,  H01L23/147 ,  H01L23/3121 ,  H01L23/3135 ,  H01L23/367 ,  H01L23/3675 ,  H01L23/49827 ,  H01L23/49838 ,  H01L24/05 ,  H01L24/06 ,  H01L24/09 ,  H01L24/13 ,  H01L24/14 ,  H01L24/16 ,  H01L24/17 ,  H01L24/32 ,  H01L24/73 ,  H01L24/83 ,  H01L24/92 ,  H01L24/94 ,  H01L24/97 ,  H01L25/0652 ,  H01L25/0655 ,  H01L25/0657 ,  H01L25/18 ,  H01L25/50 ,  H01L2224/0401 ,  H01L2224/05568 ,  H01L2224/05569 ,  H01L2224/0603 ,  H01L2224/06181 ,  H01L2224/131 ,  H01L2224/1403 ,  H01L2224/14181 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/16238 ,  H01L2224/17181 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/83192 ,  H01L2224/92125 ,  H01L2224/92225 ,  H01L2224/94 ,  H01L2224/97 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/06548 ,  H01L2225/06586 ,  H01L2225/06589 ,  H01L2225/06596 ,  H01L2924/12042 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/1615 ,  H01L2924/16152 ,  H01L2924/16153 ,  H01L2924/16176 ,  H01L2924/16235 ,  H01L2924/16251 ,  H01L2924/1632 ,  H01L2924/164 ,  H01L2924/167 ,  H01L2924/16788 ,  H01L2924/1679 ,  H01L2924/181 ,  H01L2924/351 ,  H01L2924/3511 ,  H01L2224/81 ,  H01L2224/83 ,  H01L2924/014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: An assembly with modules (110, 1310) containing integrated circuits and attached to a wiring substrate (120) is reinforced by one or more reinforcement frames (410) attached to the wiring substrate. The modules are located in openings (e.g. cavities and/or through-holes 414) in the reinforcement frame. Other features are also provided.

Abstract translation: 包含集成电路并附接到布线基板（120）的模块（110,1310）的组件由附接到布线基板的一个或多个加强框架（410）加强。 模块位于加强框架中的开口（例如空腔和/或通孔414）中。 还提供其他功能。