Invention Grant
- Patent Title: Integrated circuit assemblies with reinforcement frames, and methods of manufacture
- Patent Title (中): 具有加强框架的集成电路组件和制造方法
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Application No.: US14288064Application Date: 2014-05-27
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Publication No.: US09355997B2Publication Date: 2016-05-31
- Inventor: Rajesh Katkar , Laura Wills Mirkarimi , Arkalgud Sitaram , Charles G. Woychik
- Applicant: Invensas Corporation
- Applicant Address: US CA San Jose
- Assignee: Invensas Corporation
- Current Assignee: Invensas Corporation
- Current Assignee Address: US CA San Jose
- Agency: Haynes and Boone, LLP
- Main IPC: H01L25/065
- IPC: H01L25/065 ; H01L23/367 ; H01L21/66 ; H01L21/78 ; H01L23/10 ; H01L23/14 ; H01L23/498 ; H01L25/00 ; H01L21/56 ; H01L23/31 ; H01L23/00 ; H01L23/04 ; H01L21/784 ; H01L25/18
Abstract:
An assembly with modules (110, 1310) containing integrated circuits and attached to a wiring substrate (120) is reinforced by one or more reinforcement frames (410) attached to the wiring substrate. The modules are located in openings (e.g. cavities and/or through-holes 414) in the reinforcement frame. Other features are also provided.
Public/Granted literature
- US20150262972A1 INTEGRATED CIRCUIT ASSEMBLIES WITH REINFORCEMENT FRAMES, AND METHODS OF MANUFACTURE Public/Granted day:2015-09-17
Information query
IPC分类:
