公开(公告)号：US07049687B2

公开(公告)日：2006-05-23

申请号：US10699706

申请日：2003-11-04

Applicant: Yoshikazu Takahashi ,  Kaname Kobayashi

Inventor： Yoshikazu Takahashi ,  Kaname Kobayashi

IPC: H01L23/495 ,  H01L23/06 ,  H01L23/02 ,  H01L23/34 ,  H01L23/28

CPC classification number: H01L24/50 ,  H01L23/49572 ,  H01L23/49575 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/16 ,  H01L2224/451 ,  H01L2224/48137 ,  H01L2224/49175 ,  H01L2224/73229 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/3025 ,  Y10T29/49155 ,  H01L2924/00 ,  H01L2224/05599

Abstract: A tape carrier in which a plurality of semiconductor elements can be mounted. The tape carrier includes a base tape on which device holes are formed and a plurality of leads provided on the base tape, wherein inner lead portions, which extend from the periphery of the device hole toward the center of the device hole, are of different lengths.

公开(公告)号：US20020171130A1

公开(公告)日：2002-11-21

申请号：US10125444

申请日：2002-04-19

Inventor： Yoshikazu Takahashi ,  Kaname Kobayashi

IPC: H01L023/495 ,  H01L023/06 ,  H01L023/02 ,  H01L023/34 ,  H01L023/28

CPC classification number: H01L24/50 ,  H01L23/49572 ,  H01L23/49575 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/16 ,  H01L2224/451 ,  H01L2224/48137 ,  H01L2224/49175 ,  H01L2224/73229 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/3025 ,  Y10T29/49155 ,  H01L2924/00 ,  H01L2224/05599

Abstract: A tape carrier in which a plurality of semiconductor elements can be mounted. The tape carrier includes a base tape on which device holes are formed and a plurality of leads provided on the base tape, wherein inner lead portions, which extend from the periphery of the device hole toward the center of the device hole, are of different lengths.

Abstract translation: 可以安装多个半导体元件的带载体。 带状载体包括在其上形成有器件孔的基带和设置在基带上的多个引线，其中从器件孔的周边朝向器件孔的中心延伸的内部引线部分具有不同的长度 。

公开(公告)号：US20180019222A1

公开(公告)日：2018-01-18

申请号：US15717456

申请日：2017-09-27

Applicant: NXP USA, INC.

Inventor： LAKSHMINARAYAN VISWANATHAN ,  MICHAEL WATTS

IPC: H01L23/00 ,  H01L23/66 ,  H01L23/498 ,  H01L23/057

CPC classification number: H01L24/49 ,  H01L23/057 ,  H01L23/49838 ,  H01L23/4985 ,  H01L23/66 ,  H01L24/13 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/37 ,  H01L24/40 ,  H01L24/48 ,  H01L24/50 ,  H01L24/73 ,  H01L24/86 ,  H01L2224/131 ,  H01L2224/16245 ,  H01L2224/2919 ,  H01L2224/32245 ,  H01L2224/37599 ,  H01L2224/40157 ,  H01L2224/45099 ,  H01L2224/48101 ,  H01L2224/48106 ,  H01L2224/48137 ,  H01L2224/48157 ,  H01L2224/49109 ,  H01L2224/49176 ,  H01L2224/50 ,  H01L2224/73229 ,  H01L2224/83101 ,  H01L2224/8384 ,  H01L2224/84801 ,  H01L2924/00014 ,  H01L2924/1421 ,  H01L2924/161 ,  H01L2924/19105 ,  H01L2924/19107 ,  H01L2924/30111 ,  H01L2924/014 ,  H01L2224/37099

Abstract: A packaged RF device is provided that utilizes flexible circuit leads. The RF device includes at least one integrated circuit (IC) die configured to implement the RF device. The IC die is contained inside a package. In accordance with the embodiments described herein, a flexible circuit is implemented as a lead. Specifically, the flexible circuit lead is coupled to the at least one IC die inside the package and extends to outside the package, the flexible circuit lead thus providing an electrical connection to the at least one IC die inside the package.

公开(公告)号：US09111937B2

公开(公告)日：2015-08-18

申请号：US13903230

申请日：2013-05-28

Applicant: Freescale Semiconductor, Inc.

Inventor： Burton J. Carpenter, Jr. ,  Twila J. Eichman

IPC: H01L23/52 ,  H01L23/532 ,  H01L23/522 ,  H01L23/538

CPC classification number: H01L23/53228 ,  H01L23/5226 ,  H01L23/5329 ,  H01L23/5381 ,  H01L23/5383 ,  H01L23/5387 ,  H01L23/5389 ,  H01L24/50 ,  H01L2224/04105 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73207 ,  H01L2224/73229 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2924/15192 ,  H01L2924/30107

Abstract: Semiconductor devices with multilayer flex interconnect structures. In some embodiments, a semiconductor device may include a semiconductor chip coupled to a planar substrate and a multilayer flex interconnect structure coupled to the semiconductor chip, the multilayer flex interconnect structure including at least: a first conductive layer, a second conductive layer, and a dielectric layer disposed between the first and second conductive layers. The semiconductor device may also include another semiconductor chip coupled to the planar substrate and placed in a side-by-side configuration with respect to the semiconductor chip, where the multilayer flex interconnect structure provides electrical connections between at least two terminals of the semiconductor chip and at least two terminals of the other semiconductor chip.

Abstract translation: 具有多层柔性互连结构的半导体器件。 在一些实施例中，半导体器件可以包括耦合到平面衬底的半导体芯片和耦合到半导体芯片的多层柔性互连结构，所述多层柔性互连结构至少包括：第一导电层，第二导电层和 介电层设置在第一和第二导电层之间。 半导体器件还可以包括耦合到平面衬底并且相对于半导体芯片并排配置的另一个半导体芯片，其中多层柔性互连结构提供半导体芯片的至少两个端子之间的电连接和 另一个半导体芯片的至少两个端子。

公开(公告)号：US09824995B2

公开(公告)日：2017-11-21

申请号：US14500319

申请日：2014-09-29

Applicant: Freescale Semiconductor, Inc.

Inventor： Lakshminarayan Viswanathan ,  Michael E. Watts

IPC: H05K7/00 ,  H01L23/00 ,  H01L23/498 ,  H01L23/66 ,  H01L23/057

CPC classification number: H01L24/49 ,  H01L23/057 ,  H01L23/49838 ,  H01L23/4985 ,  H01L23/66 ,  H01L24/13 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/37 ,  H01L24/40 ,  H01L24/48 ,  H01L24/50 ,  H01L24/73 ,  H01L2224/131 ,  H01L2224/16245 ,  H01L2224/2919 ,  H01L2224/32245 ,  H01L2224/37599 ,  H01L2224/40157 ,  H01L2224/45099 ,  H01L2224/48101 ,  H01L2224/48106 ,  H01L2224/48137 ,  H01L2224/48157 ,  H01L2224/49109 ,  H01L2224/49176 ,  H01L2224/50 ,  H01L2224/73229 ,  H01L2224/83101 ,  H01L2224/8384 ,  H01L2224/84801 ,  H01L2924/00014 ,  H01L2924/1421 ,  H01L2924/161 ,  H01L2924/19105 ,  H01L2924/19107 ,  H01L2924/30111 ,  H01L2924/014 ,  H01L2224/37099

Abstract: A packaged RF device is provided that utilizes flexible circuit leads. The RF device includes at least one integrated circuit (IC) die configured to implement the RF device. The IC die is contained inside a package. In accordance with the embodiments described herein, a flexible circuit is implemented as a lead. Specifically, the flexible circuit lead is coupled to the at least one IC die inside the package and extends to outside the package, the flexible circuit lead thus providing an electrical connection to the at least one IC die inside the package.

公开(公告)号：US20160093587A1

公开(公告)日：2016-03-31

申请号：US14500319

申请日：2014-09-29

Applicant: Freescale Semiconductor, Inc.

Inventor： Lakshminarayan VISWANATHAN ,  Michael E. WATTS

IPC: H01L23/00

CPC classification number: H01L24/49 ,  H01L23/057 ,  H01L23/49838 ,  H01L23/4985 ,  H01L23/66 ,  H01L24/13 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/37 ,  H01L24/40 ,  H01L24/48 ,  H01L24/50 ,  H01L24/73 ,  H01L2224/131 ,  H01L2224/16245 ,  H01L2224/2919 ,  H01L2224/32245 ,  H01L2224/37599 ,  H01L2224/40157 ,  H01L2224/45099 ,  H01L2224/48101 ,  H01L2224/48106 ,  H01L2224/48137 ,  H01L2224/48157 ,  H01L2224/49109 ,  H01L2224/49176 ,  H01L2224/50 ,  H01L2224/73229 ,  H01L2224/83101 ,  H01L2224/8384 ,  H01L2224/84801 ,  H01L2924/00014 ,  H01L2924/1421 ,  H01L2924/161 ,  H01L2924/19105 ,  H01L2924/19107 ,  H01L2924/30111 ,  H01L2924/014 ,  H01L2224/37099

Abstract: A packaged RF device is provided that can provide improved performance and flexibility though the use of flexible circuit leads. The RF device includes at least one integrated circuit (IC) die configured to implement the RF device. The IC die is contained inside a package. In accordance with the embodiments described herein, a flexible circuit is implemented as a lead. Specifically, the flexible circuit lead is coupled to the at least one IC die inside the package and extends to outside the package, the flexible circuit lead thus providing an electrical connection to the at least one IC die inside the package.

Abstract translation: 提供了一种封装的RF器件，可以通过使用柔性电路引线来提供改进的性能和灵活性。 RF装置包括被配置为实现RF装置的至少一个集成电路（IC）管芯。 IC芯片包含在一个封装内。 根据这里描述的实施例，柔性电路被实现为引线。 具体地说，柔性电路引线被耦合到封装内的至少一个IC管芯并且延伸到封装外部，因此柔性电路引线提供与封装内的至少一个IC管芯的电连接。

公开(公告)号：US07217997B2

公开(公告)日：2007-05-15

申请号：US10565044

申请日：2004-07-30

Applicant: Chris Wyland

Inventor： Chris Wyland

IPC: H01L23/34

CPC classification number: H01L24/73 ,  H01L23/04 ,  H01L23/3672 ,  H01L23/49816 ,  H01L23/50 ,  H01L23/552 ,  H01L23/66 ,  H01L24/45 ,  H01L24/48 ,  H01L24/91 ,  H01L2223/6611 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48237 ,  H01L2224/484 ,  H01L2224/48599 ,  H01L2224/73221 ,  H01L2224/73229 ,  H01L2224/73265 ,  H01L2224/85201 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01057 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/16152 ,  H01L2924/1616 ,  H01L2924/1617 ,  H01L2924/163 ,  H01L2924/166 ,  H01L2924/181 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01L2224/32225 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/85399 ,  H01L2224/05599

Abstract: A structure provides for the control of bond wire impedance. In an example embodiment, there is an integrated circuit device comprising a semiconductor device die having a plurality of grounding pads, signal pads, and power pads and a package for mounting the integrated circuit and includes a conductive path having at least one reference trace that surrounds the integrated circuit. A grounding arch is disposed over the semiconductor device die.

Abstract translation: 一种结构提供了对键合线阻抗的控制。 在示例性实施例中，存在集成电路器件，其包括具有多个接地焊盘，信号焊盘和电源焊盘的半导体器件管芯和用于安装集成电路的封装，并且包括具有至少一个参考迹线的导电路径， 集成电路。 接地拱架设置在半导体器件裸片上。

公开(公告)号：US20060180916A1

公开(公告)日：2006-08-17

申请号：US10565044

申请日：2004-07-30

Applicant: Chris Wyland

Inventor： Chris Wyland

IPC: H01L23/52 ,  H01L21/44

CPC classification number: H01L24/73 ,  H01L23/04 ,  H01L23/3672 ,  H01L23/49816 ,  H01L23/50 ,  H01L23/552 ,  H01L23/66 ,  H01L24/45 ,  H01L24/48 ,  H01L24/91 ,  H01L2223/6611 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48237 ,  H01L2224/484 ,  H01L2224/48599 ,  H01L2224/73221 ,  H01L2224/73229 ,  H01L2224/73265 ,  H01L2224/85201 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01057 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/16152 ,  H01L2924/1616 ,  H01L2924/1617 ,  H01L2924/163 ,  H01L2924/166 ,  H01L2924/181 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01L2224/32225 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/85399 ,  H01L2224/05599

Abstract: A structure provides for the control of bond wire impedance. In an example embodiment, there is an integrated circuit device (100) comprising an integrated circuit (130) having a plurality (115) of grounding pads, signal pads, and power pads and a package (110) for mounting the integrated circuit and includes a conductive path having at least one reference trace (140) that surrounds the integrated circuit. A grounding arch (170) formed by a dielectric-coated metal tape is disposed over the integrated circuit and connected to its ground pad in order to provide heat dissipation and EMI shielding.

Abstract translation: 一种结构提供了对键合线阻抗的控制。 在示例实施例中，存在集成电路设备（100），其包括具有多个（115）接地焊盘，信号焊盘和电源焊盘的集成电路（130）和用于安装集成电路的封装（110），并且包括 具有围绕集成电路的至少一个参考迹线（140）的导电路径。 由电介质涂覆的金属带形成的接地拱（170）设置在集成电路上并连接到其接地垫，以提供散热和EMI屏蔽。

公开(公告)号：US06664618B2

公开(公告)日：2003-12-16

申请号：US10125444

申请日：2002-04-19

Applicant: Yoshikazu Takahashi ,  Kaname Kobayashi

Inventor： Yoshikazu Takahashi ,  Kaname Kobayashi

IPC: H01L23495

CPC classification number: H01L24/50 ,  H01L23/49572 ,  H01L23/49575 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/16 ,  H01L2224/451 ,  H01L2224/48137 ,  H01L2224/49175 ,  H01L2224/73229 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/3025 ,  Y10T29/49155 ,  H01L2924/00 ,  H01L2224/05599

Abstract: A tape carrier in which a plurality of semiconductor elements can be mounted. The tape carrier includes a base tape on which device holes are formed and a plurality of leads provided on the base tape, wherein inner lead portions, which extend from the periphery of the device hole toward the center of the device hole, are of different lengths.

Abstract translation: 可以安装多个半导体元件的带载体。 带状载体包括在其上形成有器件孔的基带和设置在基带上的多个引线，其中从器件孔的周边朝向器件孔的中心延伸的内部引线部分具有不同的长度 。

公开(公告)号：US5731962A

公开(公告)日：1998-03-24

申请号：US532885

申请日：1995-09-22

Applicant: Tomoo Imura

Inventor： Tomoo Imura

IPC: H01L21/60 ,  H01L21/56 ,  H01L23/28 ,  H01L23/495 ,  H01L23/50 ,  H01L23/522

CPC classification number: H01L24/91 ,  H01L21/565 ,  H01L23/49524 ,  H01L24/49 ,  H01L24/50 ,  H01L24/73 ,  H01L2224/05554 ,  H01L2224/451 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/4911 ,  H01L2224/73229 ,  H01L24/45 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19107

Abstract: A semiconductor chip mounted on an island is electrically connected to inner leads through tape-automated bonding leads supported by an insulating suspender tape, and a support ring is connected between the insulating suspender tape and suspender pins connected to the island so as to maintain an original relative position between the semiconductor chip and the tape-automated bonding leads during a molding stage.

Abstract translation: 安装在岛上的半导体芯片通过由绝缘悬吊带支撑的带自动接合线电连接到内引线，并且支撑环连接在连接到岛上的绝缘悬吊带和吊杆之间，以保持原始 在模制阶段期间半导体芯片和带自动键合引线之间的相对位置。