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公开(公告)号：US20180047698A1
公开(公告)日：2018-02-15
申请号：US15792398
申请日：2017-10-24
Applicant: ROHM CO., LTD.
Inventor： Mamoru YAMAGAMI , Kenji FUJII
IPC: H01L23/00 , H01L23/495 , H01L23/31 , H01L23/525 , H01L23/532
CPC classification number: H01L24/49 , H01L23/3107 , H01L23/49524 , H01L23/49548 , H01L23/525 , H01L23/53223 , H01L23/53238 , H01L24/05 , H01L24/06 , H01L24/13 , H01L24/14 , H01L24/16 , H01L24/36 , H01L24/37 , H01L24/40 , H01L24/41 , H01L24/45 , H01L24/48 , H01L24/73 , H01L2224/02375 , H01L2224/0346 , H01L2224/0347 , H01L2224/0391 , H01L2224/03914 , H01L2224/0401 , H01L2224/04034 , H01L2224/04042 , H01L2224/05008 , H01L2224/05009 , H01L2224/05022 , H01L2224/05026 , H01L2224/05147 , H01L2224/05164 , H01L2224/05166 , H01L2224/05548 , H01L2224/05554 , H01L2224/05557 , H01L2224/05567 , H01L2224/05571 , H01L2224/05583 , H01L2224/05599 , H01L2224/05624 , H01L2224/05647 , H01L2224/05655 , H01L2224/08245 , H01L2224/13024 , H01L2224/13076 , H01L2224/131 , H01L2224/13147 , H01L2224/13582 , H01L2224/13655 , H01L2224/13664 , H01L2224/1411 , H01L2224/16245 , H01L2224/37147 , H01L2224/40245 , H01L2224/40247 , H01L2224/40479 , H01L2224/40491 , H01L2224/40499 , H01L2224/40993 , H01L2224/4112 , H01L2224/45015 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48177 , H01L2224/48247 , H01L2224/48824 , H01L2224/48847 , H01L2224/48855 , H01L2224/4912 , H01L2224/49177 , H01L2224/73221 , H01L2224/8485 , H01L2924/00012 , H01L2924/00014 , H01L2924/181 , H01L2924/20754 , H01L2924/351 , H01L2924/00 , H01L2924/2075 , H01L2924/20757 , H01L2924/20756 , H01L2924/20758 , H01L2924/20759 , H01L2924/2076 , H01L2924/20755 , H01L2924/014 , H01L2224/051
Abstract: An inventive semiconductor device includes: a semiconductor chip including an integrated circuit; a plurality of electrode pads provided on the semiconductor chip and connected to the integrated circuit; a rewiring to which the electrode pads are electrically connected together, the rewiring being exposed on an outermost surface of the semiconductor chip and having an exposed surface area greater than the total area of the electrode pads; and a resin package which seals the semiconductor chip.
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公开(公告)号：US20240006368A1
公开(公告)日：2024-01-04
申请号：US18469351
申请日：2023-09-18
Applicant: ROHM CO., LTD.
Inventor： Takumi KANDA
IPC: H01L23/00 , H01L25/07 , H01L23/31 , H01L23/495
CPC classification number: H01L24/40 , H01L25/072 , H01L23/3142 , H01L23/49503 , H01L23/49524 , H01L24/41 , H01L24/73 , H01L24/48 , H01L24/32 , H01L2224/32245 , H01L2224/4007 , H01L2224/40137 , H01L2224/40257 , H01L2224/40993 , H01L2224/41051 , H01L2224/48245 , H01L2224/73263 , H01L2924/01013 , H01L2924/13091
Abstract: A semiconductor device includes: a semiconductor element including a first electrode; a conductive member including a first bonding part facing the first electrode; a bonding layer interposed between the first electrode and the first bonding part; and a regulator bonded to at least one of the first electrode and the first bonding part. The regulator faces the bonding layer in a direction orthogonal to a thickness direction of the semiconductor element.
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公开(公告)号：US09076782B2
公开(公告)日：2015-07-07
申请号：US14118112
申请日：2012-06-14
Applicant: Shin Soyano
Inventor： Shin Soyano
IPC: H01L23/495 , H01L23/00 , H01L25/07 , H01L23/373 , H01L23/498 , H01L23/31 , H01L25/18 , H01L23/24
CPC classification number: H01L23/49575 , H01L23/24 , H01L23/3107 , H01L23/3735 , H01L23/49524 , H01L23/49844 , H01L24/06 , H01L24/29 , H01L24/32 , H01L24/37 , H01L24/40 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/81 , H01L24/83 , H01L24/84 , H01L24/85 , H01L24/92 , H01L25/072 , H01L25/18 , H01L2224/04026 , H01L2224/04034 , H01L2224/04042 , H01L2224/0603 , H01L2224/06181 , H01L2224/291 , H01L2224/32225 , H01L2224/37011 , H01L2224/37147 , H01L2224/4007 , H01L2224/40091 , H01L2224/40095 , H01L2224/40137 , H01L2224/40139 , H01L2224/40225 , H01L2224/40227 , H01L2224/40993 , H01L2224/45015 , H01L2224/45124 , H01L2224/45147 , H01L2224/48091 , H01L2224/48137 , H01L2224/48145 , H01L2224/48227 , H01L2224/48465 , H01L2224/48472 , H01L2224/73221 , H01L2224/73263 , H01L2224/73265 , H01L2224/77272 , H01L2224/83815 , H01L2224/84138 , H01L2224/84801 , H01L2224/85001 , H01L2224/85205 , H01L2224/92166 , H01L2224/92247 , H01L2924/00011 , H01L2924/00014 , H01L2924/01015 , H01L2924/01029 , H01L2924/01047 , H01L2924/1203 , H01L2924/1305 , H01L2924/13055 , H01L2924/15787 , H01L2924/351 , H01L2924/00 , H01L2924/01026 , H01L2924/01042 , H01L2924/014 , H01L2924/2076 , H01L2924/00015 , H01L2224/83205 , H01L2924/00012 , H01L2224/85399 , H01L2224/05599
Abstract: A semiconductor device has a plurality of electronic components mounted on an insulating substrate formed with a metal layer, and electrically connected to each other or to the metal layer; a positioning wire member having a predetermined diameter and a predetermined length, and bonded to each of the plurality of electronic components or to the metal layer; a lead frame disposed to bridge and electrically connect the plurality of electronic components to each other or between the metal layer and the electronic components; and an opening having a size capable of inserting the wire member therethrough formed to penetrate through the lead frame, to join the lead frame to each of the electronic components or the metal layer at a predetermined position therein. The lead frame is positioned on the insulating substrate by inserting the wire member into the opening.
Abstract translation: 半导体器件具有安装在形成有金属层的绝缘基板上并且彼此电连接或与金属层电连接的多个电子部件; 定位线构件，其具有预定直径和预定长度，并且结合到所述多个电子部件中的每一个或所述金属层; 引线框架，其设置成将所述多个电子部件彼此之间或所述金属层与所述电子部件电连接; 以及具有能够插入穿过引线框架的线材的尺寸的开口，以将引线框架连接到每个电子部件或金属层上的预定位置。 引线框架通过将线材插入开口而位于绝缘基板上。
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Patent Agency Ranking
公开(公告)号：US09831212B2
公开(公告)日：2017-11-28
申请号：US14503148
申请日：2014-09-30
Applicant: ROHM CO., LTD.
Inventor： Mamoru Yamagami , Kenji Fujii
IPC: H01L23/492 , H01L23/00 , H01L23/495 , H01L23/31 , H01L23/525 , H01L23/532
CPC classification number: H01L24/49 , H01L23/3107 , H01L23/49524 , H01L23/49548 , H01L23/525 , H01L23/53223 , H01L23/53238 , H01L24/05 , H01L24/06 , H01L24/13 , H01L24/14 , H01L24/16 , H01L24/36 , H01L24/37 , H01L24/40 , H01L24/41 , H01L24/45 , H01L24/48 , H01L24/73 , H01L2224/02375 , H01L2224/0346 , H01L2224/0347 , H01L2224/0391 , H01L2224/03914 , H01L2224/0401 , H01L2224/04034 , H01L2224/04042 , H01L2224/05008 , H01L2224/05009 , H01L2224/05022 , H01L2224/05026 , H01L2224/05147 , H01L2224/05164 , H01L2224/05166 , H01L2224/05548 , H01L2224/05554 , H01L2224/05557 , H01L2224/05567 , H01L2224/05571 , H01L2224/05583 , H01L2224/05599 , H01L2224/05624 , H01L2224/05647 , H01L2224/05655 , H01L2224/08245 , H01L2224/13024 , H01L2224/13076 , H01L2224/131 , H01L2224/13147 , H01L2224/13582 , H01L2224/13655 , H01L2224/13664 , H01L2224/1411 , H01L2224/16245 , H01L2224/37147 , H01L2224/40245 , H01L2224/40247 , H01L2224/40479 , H01L2224/40491 , H01L2224/40499 , H01L2224/40993 , H01L2224/4112 , H01L2224/45015 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48177 , H01L2224/48247 , H01L2224/48824 , H01L2224/48847 , H01L2224/48855 , H01L2224/4912 , H01L2224/49177 , H01L2224/73221 , H01L2224/8485 , H01L2924/00012 , H01L2924/00014 , H01L2924/181 , H01L2924/20754 , H01L2924/351 , H01L2924/00 , H01L2924/2075 , H01L2924/20757 , H01L2924/20756 , H01L2924/20758 , H01L2924/20759 , H01L2924/2076 , H01L2924/20755 , H01L2924/014 , H01L2224/051
Abstract: An inventive semiconductor device includes: a semiconductor chip including an integrated circuit; a plurality of electrode pads provided on the semiconductor chip and connected to the integrated circuit; a rewiring to which the electrode pads are electrically connected together, the rewiring being exposed on an outermost surface of the semiconductor chip and having an exposed surface area greater than the total area of the electrode pads; and a resin package which seals the semiconductor chip.
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公开(公告)号：US20150091164A1
公开(公告)日：2015-04-02
申请号：US14503148
申请日：2014-09-30
Applicant: ROHM CO., LTD.
Inventor： Mamoru YAMAGAMI , Kenji FUJII
IPC: H01L23/31 , H01L23/492 , H01L23/00 , H01L23/29
CPC classification number: H01L24/49 , H01L23/3107 , H01L23/49524 , H01L23/49548 , H01L23/525 , H01L23/53223 , H01L23/53238 , H01L24/05 , H01L24/06 , H01L24/13 , H01L24/14 , H01L24/16 , H01L24/36 , H01L24/37 , H01L24/40 , H01L24/41 , H01L24/45 , H01L24/48 , H01L24/73 , H01L2224/02375 , H01L2224/0346 , H01L2224/0347 , H01L2224/0391 , H01L2224/03914 , H01L2224/0401 , H01L2224/04034 , H01L2224/04042 , H01L2224/05008 , H01L2224/05009 , H01L2224/05022 , H01L2224/05026 , H01L2224/05147 , H01L2224/05164 , H01L2224/05166 , H01L2224/05548 , H01L2224/05554 , H01L2224/05557 , H01L2224/05567 , H01L2224/05571 , H01L2224/05583 , H01L2224/05599 , H01L2224/05624 , H01L2224/05647 , H01L2224/05655 , H01L2224/08245 , H01L2224/13024 , H01L2224/13076 , H01L2224/131 , H01L2224/13147 , H01L2224/13582 , H01L2224/13655 , H01L2224/13664 , H01L2224/1411 , H01L2224/16245 , H01L2224/37147 , H01L2224/40245 , H01L2224/40247 , H01L2224/40479 , H01L2224/40491 , H01L2224/40499 , H01L2224/40993 , H01L2224/4112 , H01L2224/45015 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48177 , H01L2224/48247 , H01L2224/48824 , H01L2224/48847 , H01L2224/48855 , H01L2224/4912 , H01L2224/49177 , H01L2224/73221 , H01L2224/8485 , H01L2924/00012 , H01L2924/00014 , H01L2924/181 , H01L2924/20754 , H01L2924/351 , H01L2924/00 , H01L2924/2075 , H01L2924/20757 , H01L2924/20756 , H01L2924/20758 , H01L2924/20759 , H01L2924/2076 , H01L2924/20755 , H01L2924/014 , H01L2224/051
Abstract: An inventive semiconductor device includes: a semiconductor chip including an integrated circuit; a plurality of electrode pads provided on the semiconductor chip and connected to the integrated circuit; a rewiring to which the electrode pads are electrically connected together, the rewiring being exposed on an outermost surface of the semiconductor chip and having an exposed surface area greater than the total area of the electrode pads; and a resin package which seals the semiconductor chip.
Abstract translation: 本发明的半导体器件包括：包括集成电路的半导体芯片; 设置在半导体芯片上并连接到集成电路的多个电极焊盘; 重新布线，其中电极焊盘电连接在一起，重新布线暴露在半导体芯片的最外表面上，并具有大于电极焊盘总面积的暴露表面积; 以及密封半导体芯片的树脂封装。
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公开(公告)号：US09524929B2
公开(公告)日：2016-12-20
申请号：US14499181
申请日：2014-09-28
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Kwang Soo Kim , Joon Seok Chae , Suk Ho Lee
IPC: H01L23/495 , H01L23/538 , H01L25/00 , H01L25/065 , H01L23/433 , H01L23/00
CPC classification number: H01L23/49575 , H01L23/4334 , H01L23/49524 , H01L23/49551 , H01L23/49562 , H01L23/5384 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/35 , H01L24/37 , H01L24/40 , H01L24/48 , H01L24/73 , H01L24/83 , H01L24/84 , H01L24/85 , H01L24/92 , H01L25/0655 , H01L25/50 , H01L2224/26135 , H01L2224/26145 , H01L2224/27312 , H01L2224/27334 , H01L2224/29083 , H01L2224/2919 , H01L2224/2929 , H01L2224/29291 , H01L2224/293 , H01L2224/3201 , H01L2224/32145 , H01L2224/32227 , H01L2224/32257 , H01L2224/35847 , H01L2224/37005 , H01L2224/37011 , H01L2224/37013 , H01L2224/37147 , H01L2224/4007 , H01L2224/40105 , H01L2224/40137 , H01L2224/40227 , H01L2224/40499 , H01L2224/40991 , H01L2224/40993 , H01L2224/48091 , H01L2224/48111 , H01L2224/48137 , H01L2224/73215 , H01L2224/73221 , H01L2224/73263 , H01L2224/73265 , H01L2224/73271 , H01L2224/83007 , H01L2224/831 , H01L2224/83136 , H01L2224/83139 , H01L2224/83447 , H01L2224/83815 , H01L2224/84007 , H01L2224/84136 , H01L2224/84138 , H01L2224/84815 , H01L2224/92157 , H01L2224/92165 , H01L2224/92166 , H01L2224/92246 , H01L2224/92247 , H01L2924/00014 , H01L2924/01014 , H01L2924/01015 , H01L2924/01028 , H01L2924/01029 , H01L2924/0665 , H01L2924/13055 , H01L2924/13091 , H01L2924/15153 , H01L2924/181 , H01L2224/45099 , H01L2924/00 , H01L2924/00012 , H01L2924/014 , H01L2924/06 , H01L2224/83 , H01L2224/84
Abstract: There is provided a semiconductor module package including: a base substrate formed by mounting one or more first semiconductor devices thereon; a lead frame formed on a top surface of the first semiconductor device and having an inlet formed to inject a solder paste; and spaces inserted between the first semiconductor device and the lead frame to form a separation space, wherein the solder paste is filled in the separation space.
Abstract translation: 提供了一种半导体模块封装，包括：通过在其上安装一个或多个第一半导体器件而形成的基底基板; 引线框架，形成在所述第一半导体器件的顶表面上，并且具有形成为用于注入焊膏的入口; 以及插入在第一半导体器件和引线框架之间的空间以形成分离空间，其中焊膏填充在分离空间中。
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公开(公告)号：US20150270207A1
公开(公告)日：2015-09-24
申请号：US14499181
申请日：2014-09-28
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Kwang Soo KIM , Joon Seok Chae , Suk Ho Lee
IPC: H01L23/495 , H01L23/00 , H01L25/00 , H01L25/065 , H01L21/768 , H01L23/538
CPC classification number: H01L23/49575 , H01L23/4334 , H01L23/49524 , H01L23/49551 , H01L23/49562 , H01L23/5384 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/35 , H01L24/37 , H01L24/40 , H01L24/48 , H01L24/73 , H01L24/83 , H01L24/84 , H01L24/85 , H01L24/92 , H01L25/0655 , H01L25/50 , H01L2224/26135 , H01L2224/26145 , H01L2224/27312 , H01L2224/27334 , H01L2224/29083 , H01L2224/2919 , H01L2224/2929 , H01L2224/29291 , H01L2224/293 , H01L2224/3201 , H01L2224/32145 , H01L2224/32227 , H01L2224/32257 , H01L2224/35847 , H01L2224/37005 , H01L2224/37011 , H01L2224/37013 , H01L2224/37147 , H01L2224/4007 , H01L2224/40105 , H01L2224/40137 , H01L2224/40227 , H01L2224/40499 , H01L2224/40991 , H01L2224/40993 , H01L2224/48091 , H01L2224/48111 , H01L2224/48137 , H01L2224/73215 , H01L2224/73221 , H01L2224/73263 , H01L2224/73265 , H01L2224/73271 , H01L2224/83007 , H01L2224/831 , H01L2224/83136 , H01L2224/83139 , H01L2224/83447 , H01L2224/83815 , H01L2224/84007 , H01L2224/84136 , H01L2224/84138 , H01L2224/84815 , H01L2224/92157 , H01L2224/92165 , H01L2224/92166 , H01L2224/92246 , H01L2224/92247 , H01L2924/00014 , H01L2924/01014 , H01L2924/01015 , H01L2924/01028 , H01L2924/01029 , H01L2924/0665 , H01L2924/13055 , H01L2924/13091 , H01L2924/15153 , H01L2924/181 , H01L2224/45099 , H01L2924/00 , H01L2924/00012 , H01L2924/014 , H01L2924/06 , H01L2224/83 , H01L2224/84
Abstract: There is provided a semiconductor module package including: a base substrate formed by mounting one or more first semiconductor devices thereon; a lead frame formed on a top surface of the first semiconductor device and having an inlet formed to inject a solder paste; and spaces inserted between the first semiconductor device and the lead frame to form a separation space, wherein the solder paste is filled in the separation space.
Abstract translation: 提供了一种半导体模块封装，包括：通过在其上安装一个或多个第一半导体器件而形成的基底基板; 引线框架，形成在所述第一半导体器件的顶表面上，并且具有形成为用于注入焊膏的入口; 以及插入在第一半导体器件和引线框架之间的空间以形成分离空间，其中焊膏填充在分离空间中。
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公开(公告)号：US20140084438A1
公开(公告)日：2014-03-27
申请号：US14118112
申请日：2012-06-14
Applicant: Shin Soyano
Inventor： Shin Soyano
IPC: H01L23/495 , H01L23/00
CPC classification number: H01L23/49575 , H01L23/24 , H01L23/3107 , H01L23/3735 , H01L23/49524 , H01L23/49844 , H01L24/06 , H01L24/29 , H01L24/32 , H01L24/37 , H01L24/40 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/81 , H01L24/83 , H01L24/84 , H01L24/85 , H01L24/92 , H01L25/072 , H01L25/18 , H01L2224/04026 , H01L2224/04034 , H01L2224/04042 , H01L2224/0603 , H01L2224/06181 , H01L2224/291 , H01L2224/32225 , H01L2224/37011 , H01L2224/37147 , H01L2224/4007 , H01L2224/40091 , H01L2224/40095 , H01L2224/40137 , H01L2224/40139 , H01L2224/40225 , H01L2224/40227 , H01L2224/40993 , H01L2224/45015 , H01L2224/45124 , H01L2224/45147 , H01L2224/48091 , H01L2224/48137 , H01L2224/48145 , H01L2224/48227 , H01L2224/48465 , H01L2224/48472 , H01L2224/73221 , H01L2224/73263 , H01L2224/73265 , H01L2224/77272 , H01L2224/83815 , H01L2224/84138 , H01L2224/84801 , H01L2224/85001 , H01L2224/85205 , H01L2224/92166 , H01L2224/92247 , H01L2924/00011 , H01L2924/00014 , H01L2924/01015 , H01L2924/01029 , H01L2924/01047 , H01L2924/1203 , H01L2924/1305 , H01L2924/13055 , H01L2924/15787 , H01L2924/351 , H01L2924/00 , H01L2924/01026 , H01L2924/01042 , H01L2924/014 , H01L2924/2076 , H01L2924/00015 , H01L2224/83205 , H01L2924/00012 , H01L2224/85399 , H01L2224/05599
Abstract: A semiconductor device has a plurality of electronic components mounted on an insulating substrate formed with a metal layer, and electrically connected to each other or to the metal layer; a positioning wire member having a predetermined diameter and a predetermined length, and bonded to each of the plurality of electronic components or to the metal layer; a lead frame disposed to bridge and electrically connect the plurality of electronic components to each other or between the metal layer and the electronic components; and an opening having a size capable of inserting the wire member therethrough formed to penetrate through the lead frame, to join the lead frame to each of the electronic components or the metal layer at a predetermined position therein. The lead frame is positioned on the insulating substrate by inserting the wire member into the opening.
Abstract translation: 半导体器件具有安装在形成有金属层的绝缘基板上并且彼此电连接或与金属层电连接的多个电子部件; 定位线构件，其具有预定直径和预定长度，并且结合到所述多个电子部件中的每一个或所述金属层; 引线框架，其设置成将所述多个电子部件彼此之间或所述金属层与所述电子部件电连接; 以及具有能够插入穿过引线框架的线材的尺寸的开口，以将引线框架连接到每个电子部件或金属层上的预定位置。 引线框架通过将线材插入开口而位于绝缘基板上。
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