公开(公告)号：US20150076570A1

公开(公告)日：2015-03-19

申请号：US14127187

申请日：2013-05-27

申请人： NSK LTD.

发明人： Takashi Sunaga ,  Noboru Kaneko ,  Osamu Miyoshi

IPC分类号： H01L23/00 ,  H01L29/78

CPC分类号： H01L24/43 ,  H01L23/3735 ,  H01L23/49811 ,  H01L24/29 ,  H01L24/32 ,  H01L24/33 ,  H01L24/35 ,  H01L24/37 ,  H01L24/40 ,  H01L24/41 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/75 ,  H01L24/77 ,  H01L24/83 ,  H01L24/84 ,  H01L24/85 ,  H01L24/92 ,  H01L25/07 ,  H01L25/072 ,  H01L25/18 ,  H01L29/78 ,  H01L2224/05553 ,  H01L2224/0603 ,  H01L2224/291 ,  H01L2224/29101 ,  H01L2224/29294 ,  H01L2224/293 ,  H01L2224/32225 ,  H01L2224/32227 ,  H01L2224/32238 ,  H01L2224/33181 ,  H01L2224/352 ,  H01L2224/35847 ,  H01L2224/3701 ,  H01L2224/37011 ,  H01L2224/37013 ,  H01L2224/37147 ,  H01L2224/40095 ,  H01L2224/40227 ,  H01L2224/40475 ,  H01L2224/40499 ,  H01L2224/4103 ,  H01L2224/4112 ,  H01L2224/41175 ,  H01L2224/43848 ,  H01L2224/451 ,  H01L2224/48091 ,  H01L2224/48472 ,  H01L2224/494 ,  H01L2224/73263 ,  H01L2224/73265 ,  H01L2224/75272 ,  H01L2224/77272 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/8321 ,  H01L2224/83424 ,  H01L2224/83447 ,  H01L2224/83801 ,  H01L2224/83815 ,  H01L2224/84424 ,  H01L2224/84447 ,  H01L2224/84801 ,  H01L2224/84815 ,  H01L2224/85 ,  H01L2224/85815 ,  H01L2224/9221 ,  H01L2924/00014 ,  H01L2924/00015 ,  H01L2924/01029 ,  H01L2924/014 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/15724 ,  H01L2924/19105 ,  H01L2924/3011 ,  H01L2924/351 ,  H01L2924/3701 ,  H05K1/181 ,  H05K2201/10166 ,  H05K2201/1031 ,  H05K2201/10409 ,  Y02P70/611 ,  H01L2924/00 ,  H01L2224/48 ,  H01L2224/83 ,  H01L2224/84 ,  H01L2224/33 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/48227

摘要： There is provided a semiconductor module and a method for manufacturing the same which make it possible to joint the electrode of the bare-chip transistor and the wiring pattern on the substrate by solder mounting operation, in the same process of solder mounting operation for mounting the bare-chip transistor or other surface mounting devices on the wiring patterns on the substrate. A semiconductor module includes: a plurality of wiring patterns formed on an insulating layer; a bare-chip transistor mounted on one wiring pattern out of the plurality of wiring patterns via a solder; and a copper connector constituted of a copper plate for jointing an electrode formed on a top surface of the bare-chip transistor and another wiring pattern out of the plurality of wiring patterns via a solder.

摘要翻译： 提供了一种半导体模块及其制造方法，其可以通过焊接安装操作将裸芯片晶体管的电极和布线图案与基板上的布线图案相连接，在相同的焊接安装操作过程中， 裸芯片晶体管或其他表面安装器件在基板上的布线图案上。 半导体模块包括：形成在绝缘层上的多个布线图案; 通过焊料在多个布线图案中安装在一个布线图案上的裸芯片晶体管; 以及铜连接器，其由用于通过焊料将形成在裸芯片晶体管的顶表面上的电极和多个布线图案中的另一布线图案连接的铜板构成。

公开(公告)号：US09402311B2

公开(公告)日：2016-07-26

申请号：US14435686

申请日：2013-10-25

申请人： NSK Ltd.

发明人： Takashi Sunaga ,  Noboru Kaneko ,  Osamu Miyoshi

IPC分类号： H05K7/00 ,  H05K1/09 ,  H01L25/07 ,  H01L25/18 ,  H01L23/373 ,  H01L23/498 ,  H01L23/495 ,  H05K1/02 ,  H05K1/05 ,  H05K1/18 ,  H01L23/00

CPC分类号： H05K1/09 ,  H01L23/142 ,  H01L23/3735 ,  H01L23/49582 ,  H01L23/49811 ,  H01L24/29 ,  H01L24/32 ,  H01L24/33 ,  H01L24/35 ,  H01L24/37 ,  H01L24/40 ,  H01L24/41 ,  H01L24/73 ,  H01L24/83 ,  H01L24/84 ,  H01L24/92 ,  H01L25/07 ,  H01L25/072 ,  H01L25/18 ,  H01L2224/05553 ,  H01L2224/0603 ,  H01L2224/291 ,  H01L2224/29294 ,  H01L2224/293 ,  H01L2224/32227 ,  H01L2224/32238 ,  H01L2224/33181 ,  H01L2224/352 ,  H01L2224/35847 ,  H01L2224/3701 ,  H01L2224/37013 ,  H01L2224/37147 ,  H01L2224/40095 ,  H01L2224/40225 ,  H01L2224/40227 ,  H01L2224/40475 ,  H01L2224/40499 ,  H01L2224/4103 ,  H01L2224/4112 ,  H01L2224/48 ,  H01L2224/73263 ,  H01L2224/77272 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/8321 ,  H01L2224/83424 ,  H01L2224/83447 ,  H01L2224/83801 ,  H01L2224/83815 ,  H01L2224/84424 ,  H01L2224/84447 ,  H01L2224/84801 ,  H01L2224/84815 ,  H01L2224/85 ,  H01L2224/9221 ,  H01L2924/014 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/1306 ,  H01L2924/181 ,  H01L2924/19105 ,  H01L2924/3011 ,  H01L2924/351 ,  H05K1/0271 ,  H05K1/05 ,  H05K1/181 ,  H05K3/3431 ,  H05K2201/10166 ,  H05K2201/1028 ,  H05K2201/1031 ,  H05K2201/10409 ,  H05K2201/10946 ,  H05K2201/10962 ,  Y02P70/611 ,  Y02P70/613 ,  H01L2924/00015 ,  H01L2924/00014 ,  H01L2224/83 ,  H01L2224/84 ,  H01L2224/33 ,  H01L2924/00012 ,  H01L2924/00

摘要： A semiconductor module includes a copper connector jointing an electrode formed on a top surface of a bare-chip transistor and a wiring pattern out of plural wiring patterns via a solder. The copper connector includes an electrode jointing portion jointed to the electrode of the bare-chip transistor and a substrate jointing portion arranged to face the electrode-jointing portion and jointed to the wiring pattern. The width W1 of the electrode jointing portion in a direction perpendicular to one direction is smaller than the width W2 of the substrate jointing portion in the direction perpendicular to the one direction.

摘要翻译： 半导体模块包括通过焊料将形成在裸芯片晶体管的顶表面上的电极和多个布线图案中的布线图案连接的铜连接器。 铜连接器包括连接到裸芯片晶体管的电极的电极接合部分和布置成面对电极接合部分并且接合到布线图案的基板接合部分。 电极接合部在与一个方向垂直的方向上的宽度W1小于基板接合部在垂直于该一个方向的方向上的宽度W2。

公开(公告)号：US20160181221A1

公开(公告)日：2016-06-23

申请号：US14910355

申请日：2014-10-06

申请人： NSK LTD.

发明人： Takashi SUNAGA ,  Noboru KANEKO ,  Osamu MIYOSHI ,  Ryoichi SUZUKI

IPC分类号： H01L23/00 ,  H01L23/498 ,  H01L23/492 ,  H01L29/78 ,  H01L29/739

CPC分类号： H01L24/41 ,  H01L23/3735 ,  H01L23/492 ,  H01L23/49811 ,  H01L23/49838 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/33 ,  H01L24/35 ,  H01L24/37 ,  H01L24/40 ,  H01L24/83 ,  H01L24/84 ,  H01L24/92 ,  H01L25/07 ,  H01L25/072 ,  H01L25/18 ,  H01L29/7393 ,  H01L29/78 ,  H01L2224/05553 ,  H01L2224/0603 ,  H01L2224/2732 ,  H01L2224/29101 ,  H01L2224/32227 ,  H01L2224/32238 ,  H01L2224/32245 ,  H01L2224/33181 ,  H01L2224/352 ,  H01L2224/35847 ,  H01L2224/3701 ,  H01L2224/37011 ,  H01L2224/37013 ,  H01L2224/37124 ,  H01L2224/37139 ,  H01L2224/37144 ,  H01L2224/37147 ,  H01L2224/37611 ,  H01L2224/4001 ,  H01L2224/40095 ,  H01L2224/40227 ,  H01L2224/40475 ,  H01L2224/40499 ,  H01L2224/4099 ,  H01L2224/4112 ,  H01L2224/73263 ,  H01L2224/83192 ,  H01L2224/8321 ,  H01L2224/83424 ,  H01L2224/83447 ,  H01L2224/83801 ,  H01L2224/83815 ,  H01L2224/84138 ,  H01L2224/8421 ,  H01L2224/84424 ,  H01L2224/84447 ,  H01L2224/84801 ,  H01L2224/84815 ,  H01L2224/9221 ,  H01L2924/00015 ,  H01L2924/13055 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/15724 ,  H01L2924/19105 ,  H01L2924/35121 ,  H01L2924/365 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2224/291 ,  H01L2924/014 ,  H01L2924/00012 ,  H01L2924/01047 ,  H01L2224/29294 ,  H01L2224/293 ,  H01L2224/48 ,  H01L2224/85 ,  H01L2224/83 ,  H01L2224/84 ,  H01L2924/01029 ,  H01L2924/013 ,  H01L2924/00013

摘要： To provide a semiconductor module that has high reliability of electric connection by a solder and is inexpensive. A joint surface of an electrode jointing portion that is opposed to a surface to be jointed of a gate electrode of a bare-chip FET and a joint surface of a substrate jointing portion that is opposed to a surface to be jointed of another wiring pattern include an outgas releasing mechanism that makes outgas generated from a molten solder during solder jointing of a metal plate connector be released from solders interposed between the joint surfaces and the surfaces to be jointed.

摘要翻译： 提供通过焊料具有高可靠性的电连接并且便宜的半导体模块。 电极接合部的与裸芯片FET的栅电极接合的面相对的基板接合部的接合面与与其他布线图案的被接合面相对的基板接合部的接合面包含 在金属板连接器的焊接期间使从熔融焊料产生的废气从放置在接合面和待接合面之间的焊料脱离的脱气释放机构。

公开(公告)号：US09609775B2

公开(公告)日：2017-03-28

申请号：US14435682

申请日：2013-10-25

申请人： NSK Ltd.

发明人： Takashi Sunaga ,  Noboru Kaneko ,  Osamu Miyoshi

IPC分类号： H05K7/00 ,  H05K7/02 ,  H01L25/07 ,  H01L25/18 ,  H01L23/373 ,  H01L23/498 ,  H01L23/00 ,  H01L23/14

CPC分类号： H05K7/02 ,  H01L23/142 ,  H01L23/3735 ,  H01L23/49811 ,  H01L24/29 ,  H01L24/32 ,  H01L24/33 ,  H01L24/35 ,  H01L24/37 ,  H01L24/40 ,  H01L24/41 ,  H01L24/73 ,  H01L24/83 ,  H01L24/84 ,  H01L24/92 ,  H01L25/07 ,  H01L25/072 ,  H01L25/18 ,  H01L2224/291 ,  H01L2224/29294 ,  H01L2224/293 ,  H01L2224/32227 ,  H01L2224/32238 ,  H01L2224/32245 ,  H01L2224/33181 ,  H01L2224/352 ,  H01L2224/35847 ,  H01L2224/3701 ,  H01L2224/37013 ,  H01L2224/37124 ,  H01L2224/37139 ,  H01L2224/37144 ,  H01L2224/37147 ,  H01L2224/40095 ,  H01L2224/40227 ,  H01L2224/40475 ,  H01L2224/40499 ,  H01L2224/4103 ,  H01L2224/4112 ,  H01L2224/48 ,  H01L2224/73263 ,  H01L2224/77272 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/8321 ,  H01L2224/83424 ,  H01L2224/83447 ,  H01L2224/83801 ,  H01L2224/83815 ,  H01L2224/84424 ,  H01L2224/84447 ,  H01L2224/84801 ,  H01L2224/84815 ,  H01L2224/85 ,  H01L2224/9221 ,  H01L2924/014 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/1306 ,  H01L2924/19105 ,  H01L2924/3011 ,  H01L2924/351 ,  H05K1/181 ,  H05K2201/10166 ,  H05K2201/1031 ,  H05K2201/10409 ,  Y02P70/611 ,  H01L2924/00015 ,  H01L2924/00014 ,  H01L2224/83 ,  H01L2224/84 ,  H01L2224/33 ,  H01L2924/00012 ,  H01L2924/00

摘要： To provide a semiconductor module capable of shortening of the manufacturing tact time, reducing the manufacturing costs, and improving assembility. A semiconductor module (30) includes substrate (31) made of metal, an insulating layer (32) formed on the substrate (31), a plurality of wiring patterns (33a to 33d) formed on the insulating layer (32), a bare-chip transistor (35) mounted on a wiring pattern (33a) via a solder (34a); and a metal plate connector (36a, 36b) jointing an electrode (S, G) of the bare-chip transistor (35) and a wiring pattern (33b, 33c) via a solder (34b, 34c). The metal plate connector (36a, 36b) has a bridge shape, and has a flat surface and a center of gravity at a middle portion of the component.

公开(公告)号：US20150289369A1

公开(公告)日：2015-10-08

申请号：US14435686

申请日：2013-10-25

申请人： NSK Ltd.

发明人： Takashi Sunaga ,  Noboru Kaneko ,  Osamu Miyoshi

IPC分类号： H05K1/09 ,  H05K1/18 ,  H05K1/02 ,  H01L23/495 ,  H05K1/05

CPC分类号： H05K1/09 ,  H01L23/142 ,  H01L23/3735 ,  H01L23/49582 ,  H01L23/49811 ,  H01L24/29 ,  H01L24/32 ,  H01L24/33 ,  H01L24/35 ,  H01L24/37 ,  H01L24/40 ,  H01L24/41 ,  H01L24/73 ,  H01L24/83 ,  H01L24/84 ,  H01L24/92 ,  H01L25/07 ,  H01L25/072 ,  H01L25/18 ,  H01L2224/05553 ,  H01L2224/0603 ,  H01L2224/291 ,  H01L2224/29294 ,  H01L2224/293 ,  H01L2224/32227 ,  H01L2224/32238 ,  H01L2224/33181 ,  H01L2224/352 ,  H01L2224/35847 ,  H01L2224/3701 ,  H01L2224/37013 ,  H01L2224/37147 ,  H01L2224/40095 ,  H01L2224/40225 ,  H01L2224/40227 ,  H01L2224/40475 ,  H01L2224/40499 ,  H01L2224/4103 ,  H01L2224/4112 ,  H01L2224/48 ,  H01L2224/73263 ,  H01L2224/77272 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/8321 ,  H01L2224/83424 ,  H01L2224/83447 ,  H01L2224/83801 ,  H01L2224/83815 ,  H01L2224/84424 ,  H01L2224/84447 ,  H01L2224/84801 ,  H01L2224/84815 ,  H01L2224/85 ,  H01L2224/9221 ,  H01L2924/014 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/1306 ,  H01L2924/181 ,  H01L2924/19105 ,  H01L2924/3011 ,  H01L2924/351 ,  H05K1/0271 ,  H05K1/05 ,  H05K1/181 ,  H05K3/3431 ,  H05K2201/10166 ,  H05K2201/1028 ,  H05K2201/1031 ,  H05K2201/10409 ,  H05K2201/10946 ,  H05K2201/10962 ,  Y02P70/611 ,  Y02P70/613 ,  H01L2924/00015 ,  H01L2924/00014 ,  H01L2224/83 ,  H01L2224/84 ,  H01L2224/33 ,  H01L2924/00012 ,  H01L2924/00

摘要： A semiconductor module includes a copper connector jointing an electrode formed on a top surface of a bare-chip transistor and a wiring pattern out of plural wiring patterns via a solder. The copper connector includes an electrode jointing portion jointed to the electrode of the bare-chip transistor and a substrate jointing portion arranged to face the electrode-jointing portion and jointed to the wiring pattern. The width W1 of the electrode jointing portion in a direction perpendicular to one direction is smaller than the width W2 of the substrate jointing portion in the direction perpendicular to the one direction.

摘要翻译： 半导体模块包括通过焊料将形成在裸芯片晶体管的顶表面上的电极和多个布线图案中的布线图案连接的铜连接器。 铜连接器包括连接到裸芯片晶体管的电极的电极接合部分和布置成面对电极接合部分并且接合到布线图案的基板接合部分。 电极接合部在与一个方向垂直的方向上的宽度W1小于基板接合部在垂直于该一个方向的方向上的宽度W2。

公开(公告)号：US09673118B2

公开(公告)日：2017-06-06

申请号：US15038590

申请日：2014-07-31

申请人： MITSUBISHI ELECTRIC CORPORATION

发明人： Masaki Taya

IPC分类号： H01L23/02 ,  H01L23/053 ,  H01L25/07 ,  H01L25/18 ,  H01L23/373 ,  H01L23/498 ,  H01L21/48 ,  H01L23/29 ,  H01L23/31 ,  H01L23/535 ,  H01L23/24 ,  H01L23/00

CPC分类号： H01L23/053 ,  H01L21/4853 ,  H01L23/24 ,  H01L23/293 ,  H01L23/3142 ,  H01L23/3735 ,  H01L23/49811 ,  H01L23/49844 ,  H01L23/535 ,  H01L24/05 ,  H01L24/29 ,  H01L24/32 ,  H01L24/35 ,  H01L24/37 ,  H01L24/40 ,  H01L24/45 ,  H01L24/48 ,  H01L24/83 ,  H01L24/84 ,  H01L25/07 ,  H01L25/18 ,  H01L2224/04026 ,  H01L2224/05624 ,  H01L2224/05647 ,  H01L2224/291 ,  H01L2224/32227 ,  H01L2224/35847 ,  H01L2224/37005 ,  H01L2224/37011 ,  H01L2224/37012 ,  H01L2224/37032 ,  H01L2224/37124 ,  H01L2224/37147 ,  H01L2224/4007 ,  H01L2224/40137 ,  H01L2224/40245 ,  H01L2224/4046 ,  H01L2224/45014 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/48245 ,  H01L2224/73263 ,  H01L2224/83447 ,  H01L2224/83801 ,  H01L2224/83815 ,  H01L2224/84205 ,  H01L2224/84447 ,  H01L2224/85447 ,  H01L2924/00014 ,  H01L2924/00015 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/35121 ,  H01L2924/00 ,  H01L2224/48 ,  H01L2924/014 ,  H01L2924/00012 ,  H01L2924/207 ,  H01L2924/2076

摘要： A power module providing an improved manufacture yield and having an ensured stable joint strength and accordingly improved reliability is provided. The power module includes: a base portion having one surface on which an electrode portion is formed; a conductor portion disposed to face the one surface of the base portion on which the electrode portion is formed, for making electrical connection with the outside; and an interconnect portion connected to the electrode portion formed on the one surface of the base portion and to the surface of the conductor portion facing the one surface of the base portion for electrically connecting the electrode portion to the conductor portion.

公开(公告)号：US09633967B2

公开(公告)日：2017-04-25

申请号：US14910355

申请日：2014-10-06

申请人： NSK Ltd.

发明人： Takashi Sunaga ,  Noboru Kaneko ,  Osamu Miyoshi ,  Ryoichi Suzuki

IPC分类号： H01L29/66 ,  H01L27/08 ,  H01L23/00 ,  H01L25/07 ,  H01L25/18 ,  H01L23/373 ,  H01L23/498 ,  H01L23/492 ,  H01L29/739 ,  H01L29/78

CPC分类号： H01L24/41 ,  H01L23/3735 ,  H01L23/492 ,  H01L23/49811 ,  H01L23/49838 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/33 ,  H01L24/35 ,  H01L24/37 ,  H01L24/40 ,  H01L24/83 ,  H01L24/84 ,  H01L24/92 ,  H01L25/07 ,  H01L25/072 ,  H01L25/18 ,  H01L29/7393 ,  H01L29/78 ,  H01L2224/05553 ,  H01L2224/0603 ,  H01L2224/2732 ,  H01L2224/29101 ,  H01L2224/32227 ,  H01L2224/32238 ,  H01L2224/32245 ,  H01L2224/33181 ,  H01L2224/352 ,  H01L2224/35847 ,  H01L2224/3701 ,  H01L2224/37011 ,  H01L2224/37013 ,  H01L2224/37124 ,  H01L2224/37139 ,  H01L2224/37144 ,  H01L2224/37147 ,  H01L2224/37611 ,  H01L2224/4001 ,  H01L2224/40095 ,  H01L2224/40227 ,  H01L2224/40475 ,  H01L2224/40499 ,  H01L2224/4099 ,  H01L2224/4112 ,  H01L2224/73263 ,  H01L2224/83192 ,  H01L2224/8321 ,  H01L2224/83424 ,  H01L2224/83447 ,  H01L2224/83801 ,  H01L2224/83815 ,  H01L2224/84138 ,  H01L2224/8421 ,  H01L2224/84424 ,  H01L2224/84447 ,  H01L2224/84801 ,  H01L2224/84815 ,  H01L2224/9221 ,  H01L2924/00015 ,  H01L2924/13055 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/15724 ,  H01L2924/19105 ,  H01L2924/35121 ,  H01L2924/365 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2224/291 ,  H01L2924/014 ,  H01L2924/00012 ,  H01L2924/01047 ,  H01L2224/29294 ,  H01L2224/293 ,  H01L2224/48 ,  H01L2224/85 ,  H01L2224/83 ,  H01L2224/84 ,  H01L2924/01029 ,  H01L2924/013 ,  H01L2924/00013

摘要： To provide a semiconductor module that has high reliability of electric connection by a solder and is inexpensive. A joint surface of an electrode jointing portion that is opposed to a surface to be jointed of a gate electrode of a bare-chip FET and a joint surface of a substrate jointing portion that is opposed to a surface to be jointed of another wiring pattern include an outgas releasing mechanism that makes outgas generated from a molten solder during solder jointing of a metal plate connector be released from solders interposed between the joint surfaces and the surfaces to be jointed.

公开(公告)号：US20150342074A1

公开(公告)日：2015-11-26

申请号：US14435682

申请日：2013-10-25

申请人： NSK LTD.

发明人： Takashi SUNAGA ,  Noboru KANEKO ,  Osamu MIYOSHI

IPC分类号： H05K7/02

CPC分类号： H05K7/02 ,  H01L23/142 ,  H01L23/3735 ,  H01L23/49811 ,  H01L24/29 ,  H01L24/32 ,  H01L24/33 ,  H01L24/35 ,  H01L24/37 ,  H01L24/40 ,  H01L24/41 ,  H01L24/73 ,  H01L24/83 ,  H01L24/84 ,  H01L24/92 ,  H01L25/07 ,  H01L25/072 ,  H01L25/18 ,  H01L2224/291 ,  H01L2224/29294 ,  H01L2224/293 ,  H01L2224/32227 ,  H01L2224/32238 ,  H01L2224/32245 ,  H01L2224/33181 ,  H01L2224/352 ,  H01L2224/35847 ,  H01L2224/3701 ,  H01L2224/37013 ,  H01L2224/37124 ,  H01L2224/37139 ,  H01L2224/37144 ,  H01L2224/37147 ,  H01L2224/40095 ,  H01L2224/40227 ,  H01L2224/40475 ,  H01L2224/40499 ,  H01L2224/4103 ,  H01L2224/4112 ,  H01L2224/48 ,  H01L2224/73263 ,  H01L2224/77272 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/8321 ,  H01L2224/83424 ,  H01L2224/83447 ,  H01L2224/83801 ,  H01L2224/83815 ,  H01L2224/84424 ,  H01L2224/84447 ,  H01L2224/84801 ,  H01L2224/84815 ,  H01L2224/85 ,  H01L2224/9221 ,  H01L2924/014 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/1306 ,  H01L2924/19105 ,  H01L2924/3011 ,  H01L2924/351 ,  H05K1/181 ,  H05K2201/10166 ,  H05K2201/1031 ,  H05K2201/10409 ,  Y02P70/611 ,  H01L2924/00015 ,  H01L2924/00014 ,  H01L2224/83 ,  H01L2224/84 ,  H01L2224/33 ,  H01L2924/00012 ,  H01L2924/00

摘要： To provide a semiconductor module capable of shortening of the manufacturing tact time, reducing the manufacturing costs, and improving assembility. A semiconductor module (30) includes substrate (31) made of metal, an insulating layer (32) formed on the substrate (31), a plurality of wiring patterns (33a to 33d) formed on the insulating layer (32), a bare-chip transistor (35) mounted on a wiring pattern (33a) via a solder (34a); and a metal plate connector (36a, 36b) jointing an electrode (S, G) of the bare-chip transistor (35) and a wiring pattern (33b, 33c) via a solder (34b, 34c). The metal plate connector (36a, 36b) has a bridge shape, and has a flat surface and a center of gravity at a middle portion of the component.

摘要翻译： 提供能够缩短制造节拍时间，降低制造成本，提高组装性的半导体模块。 半导体模块（30）包括由金属制成的基板（31），形成在基板（31）上的绝缘层（32），形成在绝缘层（32）上的多个布线图案（33a〜33d） 通过焊料（34a）安装在布线图案（33a）上的芯片晶体管（35）; 以及通过焊料（34b，34c）将裸芯片晶体管（35）的电极（S，G）和布线图案（33b，33c）接合的金属板连接器（36a，36b）。 金属板连接器（36a，36b）具有桥接形状，并且在部件的中间部分具有平坦表面和重心。

公开(公告)号：US20150221582A1

公开(公告)日：2015-08-06

申请号：US14456722

申请日：2014-08-11

申请人： KABUSHIKI KAISHA TOSHIBA

发明人： Takeshi Miyakawa

IPC分类号： H01L23/495 ,  H01B5/00 ,  H01B1/02 ,  H01L23/31 ,  H01L23/00

CPC分类号： H01L23/49537 ,  H01B1/02 ,  H01B5/00 ,  H01L23/3107 ,  H01L23/49503 ,  H01L23/49524 ,  H01L23/49541 ,  H01L23/49548 ,  H01L23/49562 ,  H01L23/49568 ,  H01L24/29 ,  H01L24/32 ,  H01L24/33 ,  H01L24/35 ,  H01L24/37 ,  H01L24/40 ,  H01L24/41 ,  H01L24/73 ,  H01L24/83 ,  H01L24/84 ,  H01L2224/291 ,  H01L2224/29147 ,  H01L2224/29294 ,  H01L2224/29339 ,  H01L2224/32245 ,  H01L2224/33181 ,  H01L2224/352 ,  H01L2224/35847 ,  H01L2224/3701 ,  H01L2224/37012 ,  H01L2224/37013 ,  H01L2224/37147 ,  H01L2224/40245 ,  H01L2224/40499 ,  H01L2224/4103 ,  H01L2224/41051 ,  H01L2224/73263 ,  H01L2224/83143 ,  H01L2224/83447 ,  H01L2224/83801 ,  H01L2224/83815 ,  H01L2224/84143 ,  H01L2224/84345 ,  H01L2224/84801 ,  H01L2224/84815 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/20645 ,  H01L2924/20646 ,  H01L2924/20647 ,  H01L2924/20648 ,  H01L2924/20649 ,  H01L2924/2065 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2924/014

摘要： According to one embodiment, a connector frame includes a frame part, a first connector projected from the frame part and integrated with the frame part, and a second connector projected from the frame part and integrated with the frame part. The first connector includes a first portion and a second portion provided between the first portion and the frame part. The second portion is thinner than the first portion. The second connector is as thick as the second portion of the first connector.

摘要翻译： 根据一个实施例，连接器框架包括框架部分，从框架部分突出并与框架部分一体化的第一连接器和从框架部分突出并与框架部分一体化的第二连接器。 第一连接器包括设置在第一部分和框架部分之间的第一部分和第二部分。 第二部分比第一部分薄。 第二连接器与第一连接器的第二部分一样厚。

公开(公告)号：US09524929B2

公开(公告)日：2016-12-20

申请号：US14499181

申请日：2014-09-28

申请人： SAMSUNG ELECTRO-MECHANICS CO., LTD.

发明人： Kwang Soo Kim ,  Joon Seok Chae ,  Suk Ho Lee

IPC分类号： H01L23/495 ,  H01L23/538 ,  H01L25/00 ,  H01L25/065 ,  H01L23/433 ,  H01L23/00

CPC分类号： H01L23/49575 ,  H01L23/4334 ,  H01L23/49524 ,  H01L23/49551 ,  H01L23/49562 ,  H01L23/5384 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/35 ,  H01L24/37 ,  H01L24/40 ,  H01L24/48 ,  H01L24/73 ,  H01L24/83 ,  H01L24/84 ,  H01L24/85 ,  H01L24/92 ,  H01L25/0655 ,  H01L25/50 ,  H01L2224/26135 ,  H01L2224/26145 ,  H01L2224/27312 ,  H01L2224/27334 ,  H01L2224/29083 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29291 ,  H01L2224/293 ,  H01L2224/3201 ,  H01L2224/32145 ,  H01L2224/32227 ,  H01L2224/32257 ,  H01L2224/35847 ,  H01L2224/37005 ,  H01L2224/37011 ,  H01L2224/37013 ,  H01L2224/37147 ,  H01L2224/4007 ,  H01L2224/40105 ,  H01L2224/40137 ,  H01L2224/40227 ,  H01L2224/40499 ,  H01L2224/40991 ,  H01L2224/40993 ,  H01L2224/48091 ,  H01L2224/48111 ,  H01L2224/48137 ,  H01L2224/73215 ,  H01L2224/73221 ,  H01L2224/73263 ,  H01L2224/73265 ,  H01L2224/73271 ,  H01L2224/83007 ,  H01L2224/831 ,  H01L2224/83136 ,  H01L2224/83139 ,  H01L2224/83447 ,  H01L2224/83815 ,  H01L2224/84007 ,  H01L2224/84136 ,  H01L2224/84138 ,  H01L2224/84815 ,  H01L2224/92157 ,  H01L2224/92165 ,  H01L2224/92166 ,  H01L2224/92246 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0665 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/15153 ,  H01L2924/181 ,  H01L2224/45099 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/014 ,  H01L2924/06 ,  H01L2224/83 ,  H01L2224/84

摘要： There is provided a semiconductor module package including: a base substrate formed by mounting one or more first semiconductor devices thereon; a lead frame formed on a top surface of the first semiconductor device and having an inlet formed to inject a solder paste; and spaces inserted between the first semiconductor device and the lead frame to form a separation space, wherein the solder paste is filled in the separation space.

摘要翻译： 提供了一种半导体模块封装，包括：通过在其上安装一个或多个第一半导体器件而形成的基底基板; 引线框架，形成在所述第一半导体器件的顶表面上，并且具有形成为用于注入焊膏的入口; 以及插入在第一半导体器件和引线框架之间的空间以形成分离空​​间，其中焊膏填充在分离空间中。