公开(公告)号：US11990455B2

公开(公告)日：2024-05-21

申请号：US17596060

申请日：2020-06-19

申请人： ROHM CO., LTD.

发明人： Hiroyuki Sakairi ,  Yusuke Nakakohara ,  Ken Nakahara

IPC分类号： H01L25/16 ,  H01L23/00 ,  H01L23/495 ,  H02M1/08 ,  H02M3/00

CPC分类号： H01L25/16 ,  H01L23/4951 ,  H01L23/49562 ,  H01L23/49575 ,  H01L23/49589 ,  H01L24/06 ,  H01L24/38 ,  H01L24/41 ,  H01L24/49 ,  H01L24/73 ,  H02M1/08 ,  H02M3/003 ,  H01L24/40 ,  H01L24/48 ,  H01L2224/0603 ,  H01L2224/06051 ,  H01L2224/0615 ,  H01L2224/38 ,  H01L2224/4009 ,  H01L2224/40106 ,  H01L2224/40245 ,  H01L2224/41175 ,  H01L2224/48108 ,  H01L2224/48137 ,  H01L2224/48245 ,  H01L2224/4903 ,  H01L2224/49112 ,  H01L2224/4912 ,  H01L2224/49175 ,  H01L2224/73221 ,  H01L2924/10272 ,  H01L2924/10329 ,  H01L2924/1033 ,  H01L2924/1067 ,  H01L2924/13055 ,  H01L2924/13064 ,  H01L2924/13091

摘要： A semiconductor device includes a conductive member including first, second and third conductors mutually spaced, a first semiconductor element having a first obverse surface provided with a first drain electrode, a first source electrode and a first gate electrode, and a second semiconductor element having a second obverse surface provided with a second drain electrode, a second source electrode and a second gate electrode. The first conductor is electrically connected to the first source electrode and the second drain electrode. The second conductor is electrically connected to the second source electrode. As viewed in a first direction crossing the first obverse surface, the second conductor is adjacent to the first conductor in a second direction crossing the first direction. The third conductor is electrically connected to the first drain electrode and is adjacent to the first conductor and the second conductor as viewed in the first direction.

公开(公告)号：US09362219B2

公开(公告)日：2016-06-07

申请号：US14787103

申请日：2013-05-09

申请人： Mitsubishi Electric Corporation

发明人： Tatsuya Kawase ,  Mikio Ishihara ,  Noboru Miyamoto

IPC分类号： H01L23/34 ,  H01L23/498 ,  H01L23/473 ,  H01L23/31 ,  H01L25/07 ,  H01L23/373 ,  H01L21/48 ,  H01L23/053 ,  H01L23/367 ,  H01L23/00 ,  H01L23/40

CPC分类号： H01L23/49844 ,  H01L21/4871 ,  H01L23/053 ,  H01L23/3107 ,  H01L23/3677 ,  H01L23/3735 ,  H01L23/3736 ,  H01L23/4006 ,  H01L23/473 ,  H01L24/37 ,  H01L24/40 ,  H01L24/41 ,  H01L25/072 ,  H01L2224/291 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/33181 ,  H01L2224/37124 ,  H01L2224/40137 ,  H01L2224/40247 ,  H01L2224/41175 ,  H01L2224/73263 ,  H01L2224/83801 ,  H01L2224/84801 ,  H01L2924/13055 ,  H01L2924/181 ,  H01L2924/014 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/00

摘要： A heat sink has a fixation surface and a heat release surface opposite from the fixation surface. A fin is provided in a central portion of the heat release surface. An insulating member is provided on the fixation surface of the heat sink. An electroconductive member is provided on the insulating member. A semiconductor chip is provided on the electroconductive member. A metal frame is connected to the semiconductor chip. A molding resin covers the heat sink, the insulating member, the electroconductive member, the semiconductor chip, and the metal frame so that the fin is exposed to outside. A hole extends through a peripheral portion of the heat sink and a peripheral portion of the molding resin. The semiconductor module is mounted on a cooling jacket by passing a screw through the hole.

摘要翻译： 散热器具有与固定表面相对的固定表面和放热表面。 散热片设置在放热表面的中心部分。 绝热构件设置在散热器的固定表面上。 导电构件设置在绝缘构件上。 在导电构件上设置半导体芯片。 金属框架连接到半导体芯片。 模制树脂覆盖散热器，绝缘构件，导电构件，半导体芯片和金属框架，使得翅片暴露于外部。 孔延伸穿过散热器的周边部分和模制树脂的周边部分。 通过使螺钉穿过孔将半导体模块安装在冷却套上。

公开(公告)号：US20240120308A1

公开(公告)日：2024-04-11

申请号：US17960871

申请日：2022-10-06

申请人： Texas Instruments Incorporated

发明人： Kwang-Soo Kim ,  Makoto Shibuya ,  Woochan Kim ,  Vivek Arora

IPC分类号： H01L23/00 ,  H01L25/16

CPC分类号： H01L24/40 ,  H01L24/41 ,  H01L24/48 ,  H01L24/73 ,  H01L24/84 ,  H01L25/16 ,  H01L2224/4001 ,  H01L2224/40095 ,  H01L2224/40225 ,  H01L2224/4103 ,  H01L2224/41052 ,  H01L2224/41175 ,  H01L2224/48157 ,  H01L2224/73221 ,  H01L2224/84815 ,  H01L2924/1033 ,  H01L2924/1426 ,  H01L2924/19041 ,  H01L2924/30107

摘要： An electronic device includes a substrate having first and second conductive traces, a semiconductor die having a transistor with a first terminal and a second terminal, and first and second metal clips. The first metal clip has a first end portion coupled to the first terminal of the transistor, and a second end portion coupled to the first conductive trace of the substrate. The second metal clip has a first end portion coupled to the second terminal of the transistor and a second end portion coupled to the second conductive trace of the substrate, and a middle portion of the second metal clip is spaced apart from and at least partially overlying a portion of the first metal clip.

公开(公告)号：US20150076570A1

公开(公告)日：2015-03-19

申请号：US14127187

申请日：2013-05-27

申请人： NSK LTD.

发明人： Takashi Sunaga ,  Noboru Kaneko ,  Osamu Miyoshi

IPC分类号： H01L23/00 ,  H01L29/78

CPC分类号： H01L24/43 ,  H01L23/3735 ,  H01L23/49811 ,  H01L24/29 ,  H01L24/32 ,  H01L24/33 ,  H01L24/35 ,  H01L24/37 ,  H01L24/40 ,  H01L24/41 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/75 ,  H01L24/77 ,  H01L24/83 ,  H01L24/84 ,  H01L24/85 ,  H01L24/92 ,  H01L25/07 ,  H01L25/072 ,  H01L25/18 ,  H01L29/78 ,  H01L2224/05553 ,  H01L2224/0603 ,  H01L2224/291 ,  H01L2224/29101 ,  H01L2224/29294 ,  H01L2224/293 ,  H01L2224/32225 ,  H01L2224/32227 ,  H01L2224/32238 ,  H01L2224/33181 ,  H01L2224/352 ,  H01L2224/35847 ,  H01L2224/3701 ,  H01L2224/37011 ,  H01L2224/37013 ,  H01L2224/37147 ,  H01L2224/40095 ,  H01L2224/40227 ,  H01L2224/40475 ,  H01L2224/40499 ,  H01L2224/4103 ,  H01L2224/4112 ,  H01L2224/41175 ,  H01L2224/43848 ,  H01L2224/451 ,  H01L2224/48091 ,  H01L2224/48472 ,  H01L2224/494 ,  H01L2224/73263 ,  H01L2224/73265 ,  H01L2224/75272 ,  H01L2224/77272 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/8321 ,  H01L2224/83424 ,  H01L2224/83447 ,  H01L2224/83801 ,  H01L2224/83815 ,  H01L2224/84424 ,  H01L2224/84447 ,  H01L2224/84801 ,  H01L2224/84815 ,  H01L2224/85 ,  H01L2224/85815 ,  H01L2224/9221 ,  H01L2924/00014 ,  H01L2924/00015 ,  H01L2924/01029 ,  H01L2924/014 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/15724 ,  H01L2924/19105 ,  H01L2924/3011 ,  H01L2924/351 ,  H01L2924/3701 ,  H05K1/181 ,  H05K2201/10166 ,  H05K2201/1031 ,  H05K2201/10409 ,  Y02P70/611 ,  H01L2924/00 ,  H01L2224/48 ,  H01L2224/83 ,  H01L2224/84 ,  H01L2224/33 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/48227

摘要： There is provided a semiconductor module and a method for manufacturing the same which make it possible to joint the electrode of the bare-chip transistor and the wiring pattern on the substrate by solder mounting operation, in the same process of solder mounting operation for mounting the bare-chip transistor or other surface mounting devices on the wiring patterns on the substrate. A semiconductor module includes: a plurality of wiring patterns formed on an insulating layer; a bare-chip transistor mounted on one wiring pattern out of the plurality of wiring patterns via a solder; and a copper connector constituted of a copper plate for jointing an electrode formed on a top surface of the bare-chip transistor and another wiring pattern out of the plurality of wiring patterns via a solder.

摘要翻译： 提供了一种半导体模块及其制造方法，其可以通过焊接安装操作将裸芯片晶体管的电极和布线图案与基板上的布线图案相连接，在相同的焊接安装操作过程中， 裸芯片晶体管或其他表面安装器件在基板上的布线图案上。 半导体模块包括：形成在绝缘层上的多个布线图案; 通过焊料在多个布线图案中安装在一个布线图案上的裸芯片晶体管; 以及铜连接器，其由用于通过焊料将形成在裸芯片晶体管的顶表面上的电极和多个布线图案中的另一布线图案连接的铜板构成。

公开(公告)号：US09312234B2

公开(公告)日：2016-04-12

申请号：US14127187

申请日：2013-05-27

申请人： NSK Ltd.

发明人： Takashi Sunaga ,  Noboru Kaneko ,  Osamu Miyoshi

IPC分类号： H01L29/76 ,  H01L23/00 ,  H01L25/07 ,  H01L25/18 ,  H01L29/78 ,  H01L23/373 ,  H01L23/498

CPC分类号： H01L24/43 ,  H01L23/3735 ,  H01L23/49811 ,  H01L24/29 ,  H01L24/32 ,  H01L24/33 ,  H01L24/35 ,  H01L24/37 ,  H01L24/40 ,  H01L24/41 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/75 ,  H01L24/77 ,  H01L24/83 ,  H01L24/84 ,  H01L24/85 ,  H01L24/92 ,  H01L25/07 ,  H01L25/072 ,  H01L25/18 ,  H01L29/78 ,  H01L2224/05553 ,  H01L2224/0603 ,  H01L2224/291 ,  H01L2224/29101 ,  H01L2224/29294 ,  H01L2224/293 ,  H01L2224/32225 ,  H01L2224/32227 ,  H01L2224/32238 ,  H01L2224/33181 ,  H01L2224/352 ,  H01L2224/35847 ,  H01L2224/3701 ,  H01L2224/37011 ,  H01L2224/37013 ,  H01L2224/37147 ,  H01L2224/40095 ,  H01L2224/40227 ,  H01L2224/40475 ,  H01L2224/40499 ,  H01L2224/4103 ,  H01L2224/4112 ,  H01L2224/41175 ,  H01L2224/43848 ,  H01L2224/451 ,  H01L2224/48091 ,  H01L2224/48472 ,  H01L2224/494 ,  H01L2224/73263 ,  H01L2224/73265 ,  H01L2224/75272 ,  H01L2224/77272 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/8321 ,  H01L2224/83424 ,  H01L2224/83447 ,  H01L2224/83801 ,  H01L2224/83815 ,  H01L2224/84424 ,  H01L2224/84447 ,  H01L2224/84801 ,  H01L2224/84815 ,  H01L2224/85 ,  H01L2224/85815 ,  H01L2224/9221 ,  H01L2924/00014 ,  H01L2924/00015 ,  H01L2924/01029 ,  H01L2924/014 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/15724 ,  H01L2924/19105 ,  H01L2924/3011 ,  H01L2924/351 ,  H01L2924/3701 ,  H05K1/181 ,  H05K2201/10166 ,  H05K2201/1031 ,  H05K2201/10409 ,  Y02P70/611 ,  H01L2924/00 ,  H01L2224/48 ,  H01L2224/83 ,  H01L2224/84 ,  H01L2224/33 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/48227

摘要： There is provided a semiconductor module and a method for manufacturing the same which make it possible to joint the electrode of the bare-chip transistor and the wiring pattern on the substrate by solder mounting operation, in the same process of solder mounting operation for mounting the bare-chip transistor or other surface mounting devices on the wiring patterns on the substrate. A semiconductor module includes: a plurality of wiring patterns formed on an insulating layer; a bare-chip transistor mounted on one wiring pattern out of the plurality of wiring patterns via a solder; and a copper connector constituted of a copper plate for jointing an electrode formed on a top surface of the bare-chip transistor and another wiring pattern out of the plurality of wiring patterns via a solder.

摘要翻译： 提供了一种半导体模块及其制造方法，其可以通过焊接安装操作将裸芯片晶体管的电极和布线图案与基板上的布线图案相连接，在相同的焊接安装操作过程中， 裸芯片晶体管或其他表面安装器件在基板上的布线图案上。 半导体模块包括：形成在绝缘层上的多个布线图案; 通过焊料在多个布线图案中安装在一个布线图案上的裸芯片晶体管; 以及铜连接器，其由用于通过焊料将形成在裸芯片晶体管的顶表面上的电极和多个布线图案中的另一布线图案连接的铜板构成。

公开(公告)号：US20080088008A1

公开(公告)日：2008-04-17

申请号：US11858244

申请日：2007-09-20

申请人： Hyun-A KIM ,  Dong-Han KIM

发明人： Hyun-A KIM ,  Dong-Han KIM

IPC分类号： H01L23/52

CPC分类号： H01L23/50 ,  H01L23/4985 ,  H01L24/06 ,  H01L24/41 ,  H01L2224/05554 ,  H01L2224/06154 ,  H01L2224/41175 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2224/37099

摘要： A semiconductor package includes a semiconductor chip, multiple first outer connection pads positioned along a first edge of the semiconductor chip in a first direction, and multiple first outer connection leads electrically connected to the first outer connection pads. Multiple first power pads extend from the first edge of the semiconductor chip in a second direction substantially perpendicular to the first direction. A first power lead is electrically connected to the first power pads.

摘要翻译： 半导体封装包括半导体芯片，沿着第一方向沿着半导体芯片的第一边缘定位的多个第一外部连接焊盘以及电连接到第一外部连接焊盘的多个第一外部连接引线。 多个第一电源焊盘从基本上垂直于第一方向的第二方向从半导体芯片的第一边缘延伸。 第一电源引线电连接到第一电源焊盘。

公开(公告)号：US09397030B2

公开(公告)日：2016-07-19

申请号：US14435690

申请日：2013-10-25

申请人： NSK Ltd.

发明人： Takashi Sunaga ,  Noboru Kaneko ,  Osamu Miyoshi

IPC分类号： H01L23/495 ,  B62D5/04 ,  H01L25/18 ,  H01L23/00 ,  H01L25/07

CPC分类号： H01L23/49551 ,  B62D5/0406 ,  H01L23/49524 ,  H01L23/49562 ,  H01L24/29 ,  H01L24/32 ,  H01L24/33 ,  H01L24/35 ,  H01L24/37 ,  H01L24/40 ,  H01L24/41 ,  H01L24/73 ,  H01L24/83 ,  H01L24/84 ,  H01L24/92 ,  H01L25/07 ,  H01L25/072 ,  H01L25/18 ,  H01L2224/29101 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/33181 ,  H01L2224/352 ,  H01L2224/3701 ,  H01L2224/37011 ,  H01L2224/37013 ,  H01L2224/37147 ,  H01L2224/40095 ,  H01L2224/40106 ,  H01L2224/40159 ,  H01L2224/40225 ,  H01L2224/4103 ,  H01L2224/41175 ,  H01L2224/73263 ,  H01L2224/77272 ,  H01L2224/83192 ,  H01L2224/8321 ,  H01L2224/83424 ,  H01L2224/83447 ,  H01L2224/83801 ,  H01L2224/83815 ,  H01L2224/84095 ,  H01L2224/84424 ,  H01L2224/84447 ,  H01L2224/84801 ,  H01L2224/84815 ,  H01L2224/92246 ,  H01L2224/92247 ,  H01L2924/014 ,  H01L2924/13055 ,  H01L2924/1306 ,  H01L2924/15724 ,  H01L2924/19041 ,  H01L2924/19105 ,  H01L2924/351 ,  H01L2924/00 ,  H01L2924/1305 ,  H01L2924/00012 ,  H01L2924/00014

摘要： A semiconductor module is provided for shortening a manufacturing tact time, reducing manufacturing costs and for ensuring reliability of a bonding portion. The semiconductor module includes a substrate formed of a metal, an insulating layer formed on the substrate, a plurality of wiring patterns formed on the insulating layer, a bare-chip transistor mounted on one wiring pattern via a solder, and copper connectors that connect electrodes formed on the bear-chip transistor and other wiring patterns via a solder. The copper connectors have a bridge shape, have a width-reduced portion formed in the vicinity of the bonding face to the electrodes, and have a stress-reducing portion formed on the bonding face bonded to the electrode.

摘要翻译： 提供了一种半导体模块，用于缩短制造节拍时间，降低制造成本并确保结合部的可靠性。 半导体模块包括由金属形成的基板，形成在基板上的绝缘层，形成在绝缘层上的多个布线图案，通过焊料安装在一个布线图案上的裸芯片晶体管和连接电极的铜连接器 通过焊料形成在承载芯片晶体管和其它布线图案上。 铜连接器具有桥接形状，在与电极的接合面附近形成有宽度减小部，并且在与电极接合的接合面上形成有应力减小部。

公开(公告)号：US08582317B2

公开(公告)日：2013-11-12

申请号：US12787861

申请日：2010-05-26

申请人： Yenting Wen ,  Kisun Lee ,  Michael Stapleton ,  Gary H. Loechelt

发明人： Yenting Wen ,  Kisun Lee ,  Michael Stapleton ,  Gary H. Loechelt

IPC分类号： H05K7/02 ,  H01L21/50 ,  H01L23/48 ,  H01L21/77

CPC分类号： H01L24/97 ,  H01L23/49562 ,  H01L23/49575 ,  H01L23/49589 ,  H01L23/49593 ,  H01L24/06 ,  H01L24/29 ,  H01L24/32 ,  H01L24/37 ,  H01L24/40 ,  H01L24/41 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L25/16 ,  H01L2224/04026 ,  H01L2224/04034 ,  H01L2224/04042 ,  H01L2224/05554 ,  H01L2224/06181 ,  H01L2224/291 ,  H01L2224/2919 ,  H01L2224/32245 ,  H01L2224/37124 ,  H01L2224/37144 ,  H01L2224/37147 ,  H01L2224/40106 ,  H01L2224/40245 ,  H01L2224/41175 ,  H01L2224/45014 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48106 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2224/49175 ,  H01L2224/73215 ,  H01L2224/73221 ,  H01L2224/73263 ,  H01L2224/73265 ,  H01L2224/83801 ,  H01L2224/8385 ,  H01L2224/84801 ,  H01L2224/97 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/1306 ,  H01L2924/13062 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19104 ,  H01L2924/30107 ,  H01L2224/85 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/83

摘要： A semiconductor component and a method of manufacturing the semiconductor component that reduces parasitic elements. A semiconductor chip is coupled to a semiconductor chip receiving area of a support structure. The semiconductor chip has at least two power semiconductor devices. A drain contact of a first power semiconductor device is coupled to a source contact of a second power semiconductor device and the drain and source contacts of the first and second power semiconductor devices are joined to the semiconductor chip receiving area. Another semiconductor chip may be bonded to a second semiconductor chip receiving area of the support structure. An energy storage element may be coupled between the source contact of the first power semiconductor device and the drain contact of the second semiconductor device. A protective structure may be formed over the semiconductor chips and the energy storage element.

摘要翻译： 半导体元件和减少寄生元件的半导体元件的制造方法。 半导体芯片耦合到支撑结构的半导体芯片接收区域。 半导体芯片具有至少两个功率半导体器件。 第一功率半导体器件的漏极接触耦合到第二功率半导体器件的源极接触，并且第一和第二功率半导体器件的漏极和源极触点接合到半导体芯片接收区域。 另一个半导体芯片可以结合到支撑结构的第二半导体芯片接收区域。 能量存储元件可以耦合在第一功率半导体器件的源极触点和第二半导体器件的漏极触点之间。 可以在半导体芯片和能量存储元件上形成保护结构。

公开(公告)号：US20160079155A1

公开(公告)日：2016-03-17

申请号：US14787103

申请日：2013-05-09

申请人： MITSUBISHI ELECTRIC CORPORATION

发明人： Tatsuya KAWASE ,  Mikio ISHIHARA ,  Noboru MIYAMOTO

IPC分类号： H01L23/498 ,  H01L23/373 ,  H01L23/053 ,  H01L23/367

CPC分类号： H01L23/49844 ,  H01L21/4871 ,  H01L23/053 ,  H01L23/3107 ,  H01L23/3677 ,  H01L23/3735 ,  H01L23/3736 ,  H01L23/4006 ,  H01L23/473 ,  H01L24/37 ,  H01L24/40 ,  H01L24/41 ,  H01L25/072 ,  H01L2224/291 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/33181 ,  H01L2224/37124 ,  H01L2224/40137 ,  H01L2224/40247 ,  H01L2224/41175 ,  H01L2224/73263 ,  H01L2224/83801 ,  H01L2224/84801 ,  H01L2924/13055 ,  H01L2924/181 ,  H01L2924/014 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/00

摘要： A heat sink has a fixation surface and a heat release surface opposite from the fixation surface. A fin is provided in a central portion of the heat release surface. An insulating member is provided on the fixation surface of the heat sink. An electroconductive member is provided on the insulating member . A semiconductor chip is provided on the electroconductive member. A metal frame is connected to the semiconductor chip. A molding resin covers the heat sink, the insulating member, the electroconductive member, the semiconductor chip, and the metal frame so that the fin is exposed to outside. A hole extends through a peripheral portion of the heat sink and a peripheral portion of the molding resin. The semiconductor module is mounted on a cooling jacket by passing a screw through the hole.

摘要翻译： 散热器具有与固定表面相对的固定表面和放热表面。 散热片设置在放热表面的中心部分。 绝热构件设置在散热器的固定表面上。 导电构件设置在绝缘构件上。 在导电构件上设置半导体芯片。 金属框架连接到半导体芯片。 模制树脂覆盖散热器，绝缘构件，导电构件，半导体芯片和金属框架，使得翅片暴露于外部。 孔延伸穿过散热器的周边部分和模制树脂的周边部分。 通过使螺钉穿过孔将半导体模块安装在冷却套上。

公开(公告)号：US20150270199A1

公开(公告)日：2015-09-24

申请号：US14435690

申请日：2013-10-25

申请人： NSK LTD.

发明人： Takashi Sunaga ,  Noboru Kaneko ,  Osamu Miyoshi

IPC分类号： H01L23/495

CPC分类号： H01L23/49551 ,  B62D5/0406 ,  H01L23/49524 ,  H01L23/49562 ,  H01L24/29 ,  H01L24/32 ,  H01L24/33 ,  H01L24/35 ,  H01L24/37 ,  H01L24/40 ,  H01L24/41 ,  H01L24/73 ,  H01L24/83 ,  H01L24/84 ,  H01L24/92 ,  H01L25/07 ,  H01L25/072 ,  H01L25/18 ,  H01L2224/29101 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/33181 ,  H01L2224/352 ,  H01L2224/3701 ,  H01L2224/37011 ,  H01L2224/37013 ,  H01L2224/37147 ,  H01L2224/40095 ,  H01L2224/40106 ,  H01L2224/40159 ,  H01L2224/40225 ,  H01L2224/4103 ,  H01L2224/41175 ,  H01L2224/73263 ,  H01L2224/77272 ,  H01L2224/83192 ,  H01L2224/8321 ,  H01L2224/83424 ,  H01L2224/83447 ,  H01L2224/83801 ,  H01L2224/83815 ,  H01L2224/84095 ,  H01L2224/84424 ,  H01L2224/84447 ,  H01L2224/84801 ,  H01L2224/84815 ,  H01L2224/92246 ,  H01L2224/92247 ,  H01L2924/014 ,  H01L2924/13055 ,  H01L2924/1306 ,  H01L2924/15724 ,  H01L2924/19041 ,  H01L2924/19105 ,  H01L2924/351 ,  H01L2924/00 ,  H01L2924/1305 ,  H01L2924/00012 ,  H01L2924/00014

摘要： A semiconductor module is provided for shortening a manufacturing tact time, reducing manufacturing costs and for ensuring reliability of a bonding portion. The semiconductor module includes a substrate formed of a metal, an insulating layer formed on the substrate, a plurality of wiring patterns formed on the insulating layer, a bare-chip transistor mounted on one wiring pattern via a solder, and copper connectors that connect electrodes formed on the bear-chip transistor and other wiring patterns via a solder. The copper connectors have a bridge shape, have a width-reduced portion formed in the vicinity of the bonding face to the electrodes, and have a stress-reducing portion formed on the bonding face bonded to the electrode.

摘要翻译： 提供了一种半导体模块，用于缩短制造节拍时间，降低制造成本并确保结合部的可靠性。 半导体模块包括由金属形成的基板，形成在基板上的绝缘层，形成在绝缘层上的多个布线图案，通过焊料安装在一个布线图案上的裸芯片晶体管和连接电极的铜连接器 通过焊料形成在承载芯片晶体管和其它布线图案上。 铜连接器具有桥接形状，在与电极的接合面附近形成有宽度减小部，并且在与电极接合的接合面上形成有应力减小部。