公开(公告)号：US20230352376A1

公开(公告)日：2023-11-02

申请号：US18004860

申请日：2021-06-21

Applicant: ROHM CO., LTD.

Inventor： Takumi KANDA

IPC: H01L23/495 ,  H01L23/00

CPC classification number: H01L23/49562 ,  H01L23/49524 ,  H01L23/49551 ,  H01L24/37 ,  H01L24/40 ,  H01L24/32 ,  H01L24/73 ,  H01L24/05 ,  H01L24/48 ,  H01L24/29 ,  H01L2924/13091 ,  H01L2924/351 ,  H01L2224/37147 ,  H01L2224/32245 ,  H01L2224/48247 ,  H01L2224/04026 ,  H01L2224/04034 ,  H01L2224/05155 ,  H01L2224/05164 ,  H01L2224/05644 ,  H01L2224/29116 ,  H01L2224/37011 ,  H01L2224/40245 ,  H01L2224/73263

Abstract: A semiconductor device includes a first die pad having a first obverse face oriented in a thickness direction, a semiconductor element having an electrode located on a side to which the first obverse face is oriented in the thickness direction, the semiconductor element being connected to the first obverse face, a conductive material electrically connected to the electrode, and a first bonding layer electrically connecting the conductive material and the electrode. The conductive material includes a main portion, a first connecting portion electrically connected to the electrode via the first bonding layer, a first joint portion connecting the main portion and the first connecting portion, and a distal end portion spaced apart from the first joint portion, and connected to the first connecting portion. As viewed along an in-plane direction of the first obverse face, the distal end portion is inclined so as to be farther from the electrode, in a direction away from the first connecting portion. As viewed along the thickness direction, the electrode includes an expanded region, protruding from the conductive material to an opposite side of the first connecting portion in the in-plane direction, with respect to the distal end portion.

公开(公告)号：US20210098347A1

公开(公告)日：2021-04-01

申请号：US17044443

申请日：2019-05-14

Applicant: ROHM CO., LTD.

Inventor： Masashi HAYASHIGUCHI ,  Takumi KANDA

IPC: H01L23/495 ,  H01L23/31 ,  H01L23/50

Abstract: A semiconductor module includes a semiconductor device and bus bar. The device includes an insulating substrate, conductive member, switching elements, and first/second input terminals. The substrate has main/back surfaces opposite in a thickness direction, with the conductive member disposed on the main surface. The switching elements are connected to the conductive member. The first input terminal, including a first terminal portion, is connected to the conductive member. The second input terminal, including a second terminal portion overlapping with the first terminal portion in the thickness direction, is connected to the switching elements. The second input terminal is separate from the first input terminal and conductive member in the thickness direction. The bus bar includes first/second terminals. The second terminal, separate from the first terminal in the thickness direction, partially overlaps with the first terminal in the thickness direction. The first/second terminals are connected to the first/second terminal portions, respectively.

公开(公告)号：US20240079296A1

公开(公告)日：2024-03-07

申请号：US18307775

申请日：2023-04-26

Applicant: ROHM CO., LTD.

Inventor： Takumi KANDA ,  Masaaki MATSUO ,  Soichiro TAKAHASHI ,  Yoshitoki INAMI ,  Kaito INOUE

IPC: H01L23/495

CPC classification number: H01L23/49562 ,  H01L23/49524 ,  H01L23/49579

Abstract: A semiconductor device includes a first conductive plate, a second conductive plate, first switching elements, second switching elements, a first supply terminal and a second supply terminal. The first and second conductive plates are spaced apart from each other in a first direction. The first switching elements are bonded to the first conductive plate, and are electrically connected to the second conductive plate. The second switching elements are bonded to the second conductive plate. The first supply terminal is bonded to the first conductive plate. The second supply terminal has a region that overlaps with the first supply terminal as viewed in a plan view. The second supply terminal is spaced apart from the first conductive plate and the first supply terminal in a thickness direction perpendicular to the first direction. The second supply terminal is electrically connected to the second switching elements.

公开(公告)号：US20230275009A1

公开(公告)日：2023-08-31

申请号：US18302699

申请日：2023-04-18

Applicant: ROHM CO., LTD.

Inventor： Masashi HAYASHIGUCHI ,  Takumi KANDA

IPC: H01L23/495 ,  H01L23/31 ,  H01L23/50

CPC classification number: H01L23/49575 ,  H01L23/3107 ,  H01L23/49506 ,  H01L23/4952 ,  H01L23/49562 ,  H01L23/49568 ,  H01L23/49589 ,  H01L23/50

Abstract: A semiconductor module includes a semiconductor device and bus bar. The device includes an insulating substrate, conductive member, switching elements, and first/second input terminals. The substrate has main/back surfaces opposite in a thickness direction, with the conductive member disposed on the main surface. The switching elements are connected to the conductive member. The first input terminal, including a first terminal portion, is connected to the conductive member. The second input terminal, including a second terminal portion overlapping with the first terminal portion in the thickness direction, is connected to the switching elements. The second input terminal is separate from the first input terminal and conductive member in the thickness direction. The bus bar includes first/second terminals. The second terminal, separate from the first terminal in the thickness direction, partially overlaps with the first terminal in the thickness direction. The first/second terminals are connected to the first/second terminal portions, respectively.

公开(公告)号：US20230245959A1

公开(公告)日：2023-08-03

申请号：US18002592

申请日：2021-06-23

Applicant: ROHM CO., LTD.

Inventor： Kenji HAYASHI ,  Takumi KANDA ,  Noriaki KAWAMOTO

IPC: H01L23/495 ,  H01L23/31 ,  H01L23/00

CPC classification number: H01L23/49575 ,  H01L23/49513 ,  H01L23/3107 ,  H01L24/48 ,  H01L24/40 ,  H01L2224/48175 ,  H01L2224/40175

Abstract: A semiconductor device includes a first die pad having a main surface, a second die pad having a second main surface, a first switching element connected to the first main surface, a second switching element connected to the second main surface, a first connecting member connecting the first main surface electrode of the first switching element to the second die pad, an encapsulation resin encapsulating the first switching element, the second switching element, the first die pad, the second die pad, and the first connecting member, and leads projecting out of one of the resin side surfaces of the encapsulation resin.

公开(公告)号：US20220384297A1

公开(公告)日：2022-12-01

申请号：US17755842

申请日：2020-12-24

Applicant: ROHM CO., LTD.

Inventor： Takumi KANDA

IPC: H01L23/367 ,  H01L25/07 ,  H01L23/31 ,  H01L23/498 ,  H01L23/00 ,  H01L23/15

Abstract: A semiconductor device includes a first insulation member, a first drive conductive layer, a first semiconductor element, a second insulation member, a second drive conductive layer, a second semiconductor element, a connection member, and an encapsulation resin. The encapsulation resin encapsulates the first semiconductor element, the second semiconductor element, and the connection member. The connection member has a higher thermal conductivity than the encapsulation resin. The connection member forms a heat conduction path between the first insulation member and/or the first drive conductive layer and the second insulation member and/or the second drive conductive layer. The connection member has a higher thermal conductivity than the encapsulation resin.

公开(公告)号：US20220084900A1

公开(公告)日：2022-03-17

申请号：US17419025

申请日：2020-01-10

Applicant: ROHM CO., LTD.

Inventor： Takumi KANDA

IPC: H01L23/367 ,  H01L23/498 ,  H01L25/07

Abstract: A semiconductor device includes an insulating substrate, wiring layers, heat dissipation layers, a semiconductor element, and a sealing resin. The wiring layers each have a first obverse face and a first reverse face oriented in opposite directions in a thickness direction of the substrate. The first reverse faces of the wiring layers are connected to the substrate. The heat dissipation layers each have a second obverse face oriented in the same direction as the first obverse face, and a second reverse face oriented opposite to the second obverse face in the thickness direction. The heat dissipation layers are located opposite to the plurality of wiring layers in the thickness direction with respect to the substrate. The second obverse faces of the heat dissipation layers are connected to the substrate. The semiconductor element is connected to one of the first obverse faces of the wiring layers. The sealing resin covers the substrate, the wiring layers, and the semiconductor element. As viewed in the thickness direction, the wiring layers overlap with the heat dissipation layers, respectively.

公开(公告)号：US20240006368A1

公开(公告)日：2024-01-04

申请号：US18469351

申请日：2023-09-18

Applicant: ROHM CO., LTD.

Inventor： Takumi KANDA

IPC: H01L23/00 ,  H01L25/07 ,  H01L23/31 ,  H01L23/495

CPC classification number: H01L24/40 ,  H01L25/072 ,  H01L23/3142 ,  H01L23/49503 ,  H01L23/49524 ,  H01L24/41 ,  H01L24/73 ,  H01L24/48 ,  H01L24/32 ,  H01L2224/32245 ,  H01L2224/4007 ,  H01L2224/40137 ,  H01L2224/40257 ,  H01L2224/40993 ,  H01L2224/41051 ,  H01L2224/48245 ,  H01L2224/73263 ,  H01L2924/01013 ,  H01L2924/13091

Abstract: A semiconductor device includes: a semiconductor element including a first electrode; a conductive member including a first bonding part facing the first electrode; a bonding layer interposed between the first electrode and the first bonding part; and a regulator bonded to at least one of the first electrode and the first bonding part. The regulator faces the bonding layer in a direction orthogonal to a thickness direction of the semiconductor element.

公开(公告)号：US20230420321A1

公开(公告)日：2023-12-28

申请号：US18464509

申请日：2023-09-11

Applicant: ROHM CO., LTD.

Inventor： Takumi KANDA

IPC: H01L23/31 ,  H01L23/00 ,  H01L23/495 ,  H01L25/07

CPC classification number: H01L23/3121 ,  H01L2224/73265 ,  H01L24/32 ,  H01L24/73 ,  H01L24/40 ,  H01L23/49513 ,  H01L23/49568 ,  H01L23/49562 ,  H01L25/072 ,  H01L2924/13091 ,  H01L2224/48245 ,  H01L2224/32245 ,  H01L2224/4001 ,  H01L2224/32013 ,  H01L2224/40245 ,  H01L2224/73221 ,  H01L2224/73213 ,  H01L2224/73215 ,  H01L2224/73263 ,  H01L24/48

Abstract: A semiconductor device includes: first and second die pads spaced from each other in a first direction; a semiconductor element mounted on at least one of the first and the second die pads; and a sealing resin. The sealing resin is longer in the first direction than in a second direction. The first die pad has a first end surface, a second end surface, and a first corner end surface. The first corner end surface is a flat surface that is covered with the sealing resin, and that is inclined relative to the first end surface and the second end surface. The first corner end surface has a first inclination angle relative to the first end surface and a second inclination angle relative to the second end surface. Either the first inclination angle or the second inclination angle is in the range of 60° to 85° both inclusive.

公开(公告)号：US20220246507A1

公开(公告)日：2022-08-04

申请号：US17721869

申请日：2022-04-15

Applicant: ROHM CO., LTD.

Inventor： Masashi HAYASHIGUCHI ,  Takumi KANDA

IPC: H01L23/495 ,  H01L23/31 ,  H01L23/50

Abstract: A semiconductor module includes a semiconductor device and bus bar. The device includes an insulating substrate, conductive member, switching elements, and first/second input terminals. The substrate has main/back surfaces opposite in a thickness direction, with the conductive member disposed on the main surface. The switching elements are connected to the conductive member. The first input terminal, including a first terminal portion, is connected to the conductive member. The second input terminal, including a second terminal portion overlapping with the first terminal portion in the thickness direction, is connected to the switching elements. The second input terminal is separate from the first input terminal and conductive member in the thickness direction. The bus bar includes first/second terminals. The second terminal, separate from the first terminal in the thickness direction, partially overlaps with the first terminal in the thickness direction. The first/second terminals are connected to the first/second terminal portions, respectively.