A semiconductor device includes a first die pad having a first obverse face oriented in a thickness direction, a semiconductor element having an electrode located on a side to which the first obverse face is oriented in the thickness direction, the semiconductor element being connected to the first obverse face, a conductive material electrically connected to the electrode, and a first bonding layer electrically connecting the conductive material and the electrode. The conductive material includes a main portion, a first connecting portion electrically connected to the electrode via the first bonding layer, a first joint portion connecting the main portion and the first connecting portion, and a distal end portion spaced apart from the first joint portion, and connected to the first connecting portion. As viewed along an in-plane direction of the first obverse face, the distal end portion is inclined so as to be farther from the electrode, in a direction away from the first connecting portion. As viewed along the thickness direction, the electrode includes an expanded region, protruding from the conductive material to an opposite side of the first connecting portion in the in-plane direction, with respect to the distal end portion.