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    Method and components for bonding a silicon carbide molded part to another such part or to a metallic part
    5.
    发明授权
    Method and components for bonding a silicon carbide molded part to another such part or to a metallic part 失效
    用于将碳化硅模制部件接合到另一个这种部件或金属部件的方法和部件

    公开(公告)号：US4961529A

    公开(公告)日：1990-10-09

    申请号：US287342

    申请日：1988-12-20

    Applicant: Bernd Gottselig ,  Erno Gyarmati ,  Aristides Naoumidis

    Inventor： Bernd Gottselig ,  Erno Gyarmati ,  Aristides Naoumidis

    IPC: B23K20/00 ,  C04B37/00 ,  C04B37/02

    CPC classification number: C04B35/645 ,  C04B37/003 ,  C04B37/005 ,  C04B37/025 ,  C04B2235/6562 ,  C04B2235/6582 ,  C04B2235/963 ,  C04B2237/083 ,  C04B2237/365 ,  C04B2237/405 ,  C04B2237/406 ,  C04B2237/52 ,  C04B2237/567 ,  C04B2237/568 ,  C04B2237/60 ,  C04B2237/708 ,  Y10T428/264 ,  Y10T428/266

    Abstract: A layer of titanium carbosilicide Ti.sub.3 SiC.sub.2 on a silicon carbide surface polished for making a joint makes it possible to join silicon carbide bodies together in a hot pressing procedure and obtaining a joint strength comparable to the strength of the silicon carbide material. Such a layer on silicon carbide also makes possible brazed juoints with steel alloy or nickel based alloy parts. The layer may be applied directly by a powder dispersion in a volatile but viscous glycol or by sputtering or else the layer can be made in place from a powder mixture of components, especially TiC.sub.0,8 and Tisi.sub.2 (5:1) or a titanium layer of a thickness in the range of 1 to 3 .mu.m that reacts with the silicon carbide surface. When silicon carbide parts are joined together, the heating up to make the joint also serves to convert a titanium layer into titanium carbosilicide. When silicon carbide is to be joined with metal, a preliminary heating step is necessary to at first convert a powder mixture or a titanium layer on the silicon carbide surface to Ti.sub.3 SiC.sub.2. Alternatively a Ti.sub.3 SiC.sub. 2 surface layer can be formed by a sputtering process. The Ti.sub.3 SiC.sub.2 layer favors brazing of the metal part to the silicon carbide surface as treated. The heating requires reaching a temperature in the region from 1200.degree. to 1600.degree. C. for periods between a half hour to about three hours in the presence of a reducing protective gas.

    Abstract translation: 在用于制造接头的碳化硅表面上的碳化硅硅钛酸Ti3SiC2层可以在热压步骤中将碳化硅体连接在一起，并获得与碳化硅材料的强度相当的接合强度。 这种碳化硅层也可以用钢合金或镍基合金部件进行铜焊接。 该层可以通过粉末分散体直接施加在挥发性但粘稠的二醇中或通过溅射，或者可以从组分的粉末混合物，特别是TiC0,8和Tisi2（5:1）的粉末混合物或钛层 厚度在1至3μm的范围内，与碳化硅表面反应。 当碳化硅部分接合在一起时，加热至接合还用于将钛层转化为碳硅化钛。 当碳化硅与金属接合时，需要预加热步骤，以便首先将碳化硅表面上的粉末混合物或钛层转化为Ti 3 SiC 2。 或者，可以通过溅射工艺形成Ti 3 SiC 2表面层。 Ti3SiC2层有利于金属部分对被处理的碳化硅表面的钎焊。 加热需要在还原保护气体的存在下，在1200℃至1600℃的温度范围内达到半小时至约3小时。

    Greensheet carriers and processing thereof
    8.
    发明申请
    Greensheet carriers and processing thereof 失效
    格林板载体及其加工

    公开(公告)号：US20030203175A1

    公开(公告)日：2003-10-30

    申请号：US10411906

    申请日：2003-04-11

    Applicant: International Business Machines Corporation

    Inventor： John U. Knickerbocker ,  Govindarajan Natarajan

    IPC: B32B003/00 ,  B32B009/00 ,  B32B003/02

    CPC classification number: B32B18/00 ,  B32B37/22 ,  B32B38/04 ,  B32B2038/042 ,  B32B2305/38 ,  B32B2305/77 ,  C04B2237/341 ,  C04B2237/343 ,  C04B2237/366 ,  C04B2237/38 ,  C04B2237/50 ,  C04B2237/56 ,  C04B2237/561 ,  C04B2237/567 ,  C04B2237/62 ,  C04B2237/66 ,  C04B2237/68 ,  C04B2237/702 ,  C04B2237/704 ,  H01L21/4857 ,  H05K1/0306 ,  H05K3/00 ,  H05K3/4061 ,  H05K3/4611 ,  H05K3/4629 ,  H05K2203/0169 ,  Y10T156/1052 ,  Y10T156/1057 ,  Y10T156/108 ,  Y10T428/161 ,  Y10T428/23 ,  Y10T428/24793 ,  Y10T428/24926

    Abstract: A method of processing greensheets for use as microelectronic substrates comprises providing a greensheet having a width, a length and a thickness, bonding to the greensheet, within the greensheet width and length, a frame adapted to constrain movement of the greensheet within the frame, processing the greensheet and bonded frame, and removing the frame from the processed greensheet. The processing of the greensheet and bonded frame may include punching vias in the greensheet, filling the vias in the greensheet with conductive material, patterning the greensheet by applying conductive paste to the vias and greensheet surface, stacking the patterned greensheet and bonded frame with at least one other patterned greensheet and bonded frame, and laminating the greensheets. The frame is preferably removed from the processed greensheet after laminating the greensheets, and before the laminated greensheets are subsequently sintered. The bonding of the frame to the greensheet may be by lamination or by an adhesive, or by other means. Preferably, the frame has a thickness less than the greensheet thickness. The frame preferably has a plurality of members subdividing the greensheet into a plurality of areas, with each area being completely surrounded by frame members. The frame may be applied to one side of the greensheet, and pressed into the greensheet side such that that the frame and greensheet side are substantially coplanar.

    Abstract translation: 处理用作微电子基板的纸屑的方法包括在毛坯宽度和长度内提供具有宽度，长度和厚度粘合到毛坯上的毛坯，适于限制毛坯在框架内的移动的框架，加工 毛坯和粘合框架，并从加工的毛坯上移除框架。 毛坯和粘合框架的加工可以包括毛坯中的穿孔，用导电材料填充毛坯中的通孔，通过将导电浆涂布到通孔和毛坯表面来图案化毛坯，至少堆叠图案化的毛坯和粘合的框架 一个其他图案化的毛坯和粘合框架，并且层压绿叶片。 在层压毛坯之后，并且在随后烧结层压的刮板之前，优选地将骨架从加工的毛坯板上去除。 框架与毛坯的接合可以通过层压或通过粘合剂或其它方式进行。 优选地，框架具有小于毛坯厚度的厚度。 框架优选地具有将毛坯细分成多个区域的多个构件，每个区域被框架构件完全包围。 框架可以施加到毛坯的一侧，并被压入毛坯一侧，使得框架和毛坯侧面基本上是共面的。

    Greensheet carriers and processing thereof
    9.
    发明授权
    Greensheet carriers and processing thereof 失效
    格林板载体及其加工

    公开(公告)号：US06607620B2

    公开(公告)日：2003-08-19

    申请号：US09757071

    申请日：2001-01-08

    Applicant: John U. Knickerbocker ,  Govindarajan Natarajan

    Inventor： John U. Knickerbocker ,  Govindarajan Natarajan

    IPC: B32B3118

    CPC classification number: B32B18/00 ,  B32B37/22 ,  B32B38/04 ,  B32B2038/042 ,  B32B2305/38 ,  B32B2305/77 ,  C04B2237/341 ,  C04B2237/343 ,  C04B2237/366 ,  C04B2237/38 ,  C04B2237/50 ,  C04B2237/56 ,  C04B2237/561 ,  C04B2237/567 ,  C04B2237/62 ,  C04B2237/66 ,  C04B2237/68 ,  C04B2237/702 ,  C04B2237/704 ,  H01L21/4857 ,  H05K1/0306 ,  H05K3/00 ,  H05K3/4061 ,  H05K3/4611 ,  H05K3/4629 ,  H05K2203/0169 ,  Y10T156/1052 ,  Y10T156/1057 ,  Y10T156/108 ,  Y10T428/161 ,  Y10T428/23 ,  Y10T428/24793 ,  Y10T428/24926

    Abstract: A method of processing greensheets for use as microelectronic substrates comprises providing a greensheet having a width, a length and a thickness, bonding to the greensheet, within the greensheet width and length, a frame adapted to constrain movement of the greensheet within the frame, processing the greensheet and bonded frame, and removing the frame from the processed greensheet. The processing of the greensheet and bonded frame may include punching vias in the greensheet, filling the vias in the greensheet with conductive material, patterning the greensheet by applying conductive paste to the vias and greensheet surface, stacking the patterned greensheet and bonded frame with at least one other patterned greensheet and bonded frame, and laminating the greensheets. The frame is preferably removed from the processed greensheet after laminating the greensheets, and before the laminated greensheets are subsequently sintered. The bonding of the frame to the greensheet may be by lamination or by an adhesive, or by other means. Preferably, the frame has a thickness less than the greensheet thickness. The frame preferably has a plurality of members subdividing the greensheet into a plurality of areas, with each area being completely surrounded by frame members. The frame may be applied to one side of the greensheet, and pressed into the greensheet side such that the frame and greensheet side are substantially coplanar.

    Abstract translation: 处理用作微电子基板的纸屑的方法包括在毛坯宽度和长度内提供具有宽度，长度和厚度粘合到毛坯上的毛坯，适于限制毛坯在框架内的移动的框架，加工 毛坯和粘合框架，并从加工的毛坯上移除框架。 毛坯和粘合框架的加工可以包括毛坯中的穿孔，用导电材料填充毛坯中的通孔，通过将导电浆涂布到通孔和毛坯表面来图案化毛坯，至少堆叠图案化的毛坯和粘合的框架 一个其他图案化的毛坯和粘合框架，并且层压绿叶片。 在层压毛坯之后，并且在随后烧结层压的刮板之前，优选地将骨架从加工的毛坯板上去除。 框架与毛坯的接合可以通过层压或通过粘合剂或其他方式进行。 优选地，框架具有小于毛坯厚度的厚度。 框架优选地具有将毛坯细分成多个区域的多个构件，每个区域被框架构件完全包围。 框架可以施加到毛坯的一侧，并且被压入毛坯一侧，使得框架和毛坯面基本上共面。

    GREENSHEET CARRIERS AND PROCESSING THEREOF
    10.
    发明申请
    GREENSHEET CARRIERS AND PROCESSING THEREOF 失效
    绿色植物及其加工

    公开(公告)号：US20030096085A1

    公开(公告)日：2003-05-22

    申请号：US09757071

    申请日：2001-01-08

    Applicant: International Business Machines Corporation

    Inventor： John U. Knickerbocker ,  Govindarajan Natarajan

    IPC: B32B023/02

    CPC classification number: B32B18/00 ,  B32B37/22 ,  B32B38/04 ,  B32B2038/042 ,  B32B2305/38 ,  B32B2305/77 ,  C04B2237/341 ,  C04B2237/343 ,  C04B2237/366 ,  C04B2237/38 ,  C04B2237/50 ,  C04B2237/56 ,  C04B2237/561 ,  C04B2237/567 ,  C04B2237/62 ,  C04B2237/66 ,  C04B2237/68 ,  C04B2237/702 ,  C04B2237/704 ,  H01L21/4857 ,  H05K1/0306 ,  H05K3/00 ,  H05K3/4061 ,  H05K3/4611 ,  H05K3/4629 ,  H05K2203/0169 ,  Y10T156/1052 ,  Y10T156/1057 ,  Y10T156/108 ,  Y10T428/161 ,  Y10T428/23 ,  Y10T428/24793 ,  Y10T428/24926

    Abstract: A method of processing greensheets for use as microelectronic substrates comprises providing a greensheet having a width, a length and a thickness, bonding to the greensheet, within the greensheet width and length, a frame adapted to constrain movement of the greensheet within the frame, processing the greensheet and bonded frame, and removing the frame from the processed greensheet. The processing of the greensheet and bonded frame may include punching vias in the greensheet, filling the vias in the greensheet with conductive material, patterning the greensheet by applying conductive paste to the vias and greensheet surface, stacking the patterned greensheet and bonded frame with at least one other patterned greensheet and bonded frame, and laminating the greensheets. The frame is preferably removed from the processed greensheet after laminating the greensheets, and before the laminated greensheets are subsequently sintered. The bonding of the frame to the greensheet may be by lamination or by an adhesive, or by other means. Preferably, the frame has a thickness less than the greensheet thickness. The frame preferably has a plurality of members subdividing the greensheet into a plurality of areas, with each area being completely surrounded by frame members. The frame may be applied to one side of the greensheet, and pressed into the greensheet side such that that the frame and greensheet side are substantially coplanar.

    Abstract translation: 处理用作微电子基板的纸屑的方法包括在毛坯宽度和长度内提供具有宽度，长度和厚度粘合到毛坯上的毛坯，适于限制毛坯在框架内的移动的框架，加工 毛坯和粘合框架，并从加工的毛坯上移除框架。 毛坯和粘合框架的加工可以包括毛坯中的穿孔，用导电材料填充毛坯中的通孔，通过将导电浆涂布到通孔和毛坯表面来图案化毛坯，至少堆叠图案化的毛坯和粘合的框架 一个其他图案化的毛坯和粘合框架，并且层压绿叶片。 在层压毛坯之后，并且在随后烧结层压的刮板之前，优选地将骨架从加工的毛坯板上去除。 框架与毛坯的接合可以通过层压或通过粘合剂或其他方式进行。 优选地，框架具有小于毛坯厚度的厚度。 框架优选地具有将毛坯细分成多个区域的多个构件，每个区域被框架构件完全包围。 框架可以施加到毛坯的一侧，并被压入毛坯一侧，使得框架和毛坯侧面基本上是共面的。

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