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    Low-cost high-density gang-punch
    2.
    发明申请
    Low-cost high-density gang-punch 审中-公开
    低成本高密度组合冲孔

    公开(公告)号：US20020043556A1

    公开(公告)日：2002-04-18

    申请号：US09837643

    申请日：2001-04-18

    申请人： International Business Machines Corporation

    发明人： Mark J. LaPlante ,  James G. Balz ,  Ferdinand D. DiMaria ,  John U. Knickerbocker ,  David C. Long ,  Thomas Weiss ,  Robert P. Westerfield JR.

    IPC分类号： B26F001/14

    CPC分类号： B26F1/04 ,  B26F2210/08 ,  H05K1/0306 ,  H05K3/005 ,  Y10T83/04 ,  Y10T83/8727 ,  Y10T83/883 ,  Y10T83/943

    摘要： A gang-punch pin apparatus for punching selected hole patterns in thin sheet materials such as greensheets is provided. The gang-punch pin apparatus uses program plates in the punch apparatus which plates are positioned intermediate the non-punching end of the punch pins and a clearance plate wherein punch pins not used for punching a particular layer of the MLC are retracted into during punching. At the other punch pin locations, the punch pins, upon activation of the punch apparatus by compressing an expandable chamber, usually by application of a force on the punch apparatus, are extended through the lower portion of the punch apparatus to form vias in a greensheet. A die apparatus is also provided for use with the punch assembly to form the vias and to remove the punched material (slugs) from the die apparatus. The gang punch-pin may be shorter than conventional pins and be made at a low cost because of the thin sheet metal plates preferably used to make the component parts of the punch and die apparatus.

    摘要翻译： 提供了一种用于冲压薄片材料如绿叶片中的选定孔图案的组合打孔针装置。 组合打孔针装置使用打孔装置中的程序板，其中板位于冲头销的非冲孔端之间，间隙板，其中不用于冲压MLC的特定层的冲头不会在冲压期间缩回。 在另一冲头销位置，通常通过在冲压装置上施加力来压缩可膨胀室而使冲压装置激活时，冲头穿过冲头装置的下部，以形成毛坯中的通孔 。 还提供了一种模具设备，用于与冲头组件一起使用以形成通孔并且将冲压材料（芯棒）从模具设备移除。 由于薄板金属板优选用于制造冲头和模具装置的组成部件，所以组合打孔销可能比传统的销子更短，并且制造成本低。

    OPTICAL BACKPLANE ARRAY CONNECTOR
    3.
    发明申请
    OPTICAL BACKPLANE ARRAY CONNECTOR 有权
    光学背板阵列连接器

    公开(公告)号：US20040208453A1

    公开(公告)日：2004-10-21

    申请号：US10272694

    申请日：2002-10-16

    申请人： International Business Machines Corporation

    发明人： Lawrence Jacobowitz ,  Christoph Berger ,  Cameron J. Brooks ,  Casimer M. DeCusatis ,  Phillip G. Emma ,  John U. Knickerbocker

    IPC分类号： G02B006/26

    CPC分类号： G02B6/30 ,  G02B6/2826 ,  G02B6/3817 ,  G02B6/3829 ,  G02B6/3839 ,  G02B6/43

    摘要： An apparatus and method for forming a staircase arrangement for the connection of optical waveguides between a card and backplane. A card having optical waveguides and electrical conductors embedded in the card has an edge ending in a staircase arrangement with optical fiber-ribbons protruding from the edge. A guidance structure is connected to the edge and contains channels to guide and align the optical fiber-ribbons. A backplane having embedded optical waveguides and electrical conductors also has an edge ending in a staircase arrangement with a guidance structure connected to the edge and tapered openings which receive and guide the optical fiber-ribbons into close proximity with the optical waveguides and forming a staircase arrangement of connected waveguides between a card and backplane.

    摘要翻译： 一种用于形成用于在卡和背板之间连接光波导的阶梯布置的装置和方法。 具有嵌入在卡中的光波导和电导体的卡具有终止于从边缘突出的光纤带的阶梯结构的边缘。 引导结构连接到边缘并且包含用于引导和对准光纤带的通道。 具有嵌入式光波导和电导体的背板还具有以阶梯结构结束的边缘，其具有连接到边缘的引导结构和锥形开口，其将光纤带接收并引导到光波导附近并形成阶梯布置 在卡和背板之间连接的波导。

    Optical land grid array interposer
    6.
    发明申请
    Optical land grid array interposer 失效
    光栅阵列插入器

    公开(公告)号：US20040047538A1

    公开(公告)日：2004-03-11

    申请号：US10242152

    申请日：2002-09-11

    申请人： International Business Machines Corporation

    发明人： Stephen R. Howland ,  John U. Knickerbocker ,  Steven P. Ostrander ,  Martin L. Schmatz

    IPC分类号： G02B006/12

    CPC分类号： G02B6/43 ,  G02B6/12002 ,  G02B6/4204

    摘要： An apparatus for integrating optical devices between a module and a circuit board comprising a carrier having optical waveguides, a module having optical ports on a surface of the module, the surface of the module connected to the carrier such that the optical waveguides are in communication with the optical ports; and a circuit board having optical ports on a surface of the circuit board, the surface of the circuit board connected to the carrier such that the optical waveguides are in communication with the optical ports. The apparatus may also integrate electrical ports on the surface of the module, the surface of the circuit board, and electrical connections on the carrier. The apparatus may also integrate circuit chips having optical ports for communication with the optical waveguides.

    摘要翻译： 一种用于在模块和电路板之间集成光学器件的装置，包括具有光波导的载体，在模块的表面上具有光学端口的模块，模块的表面连接到载体，使得光波导与 光口; 以及电路板，其在所述电路板的表面上具有光学端口，所述电路板的表面连接到所述载体，使得所述光波导与所述光学端口连通。 该装置还可以集成在模块表面上的电气端口，电路板的表面以及载体上的电连接。 该装置还可以集成具有用于与光波导通信的光端口的电路芯片。

    Redundant configurable VCSEL laser array optical light source
    7.
    发明申请
    Redundant configurable VCSEL laser array optical light source 有权
    冗余可配置VCSEL激光阵列光源

    公开(公告)号：US20040042737A1

    公开(公告)日：2004-03-04

    申请号：US10235435

    申请日：2002-09-04

    申请人： INTERNATIONAL BUSINESS MACHINES CORPORATION

    发明人： William T. Devine ,  Jeffrey A. Kash ,  John U. Knickerbocker ,  Steven P. Ostrander ,  Jeannine M. Trewhella ,  Ronald P. Luijten

    IPC分类号： G02B006/42

    CPC分类号： H01S5/423 ,  H01S5/02248 ,  H01S5/02284

    摘要： A redundant configurable VCSEL laser array optical light source which provides for integrating optical communications capabilities into manufacturing processes for a substrate or submount such as a silicon or ceramic substrate, a multi-chip module, a package board, backplane or similar component. Multiple, spatially proximate lasers and photodetectors are provided as part of an optical transmitter or receiver module to simplify assembly of the module, particularly alignment of a laser or photodetector to an optical fiber or waveguide. A feedback loop and control logic select those laser(s) or photodiodes(s) which are most strongly coupled to the transmission medium to produce the best signals. This approach greatly simplifies optical alignment, to improve yield and relax mechanical tolerances, leading to lower assembly costs and higher manufacturing yields.

    摘要翻译： 冗余可配置的VCSEL激光阵列光学光源，其提供将光通信能力集成到诸如硅或陶瓷衬底，多芯片模块，封装板，背板或类似部件的衬底或衬底的制造工艺中。 提供多个空间贴近的激光器和光电检测器作为光发射器或接收器模块的一部分，以简化模块的组装，特别是将激光或光电检测器对准光纤或波导。 反馈回路和控制逻辑选择那些最强耦合到传输介质以产生最佳信号的激光器或光电二极管。 这种方法大大简化了光学对准，以提高产量并放宽机械公差，从而降低组装成本和提高制造成本。

    Dielectric interposer for chip to substrate soldering
    8.
    发明申请
    Dielectric interposer for chip to substrate soldering 失效
    用于芯片到基板焊接的介质插入器

    公开(公告)号：US20030193093A1

    公开(公告)日：2003-10-16

    申请号：US10427459

    申请日：2003-05-01

    申请人： International Business Machines Corporation

    发明人： Peter J. Brofman ,  Shaji Farooq ,  John U. Knickerbocker ,  Scott I. Langenthal ,  Sudipta K. Ray ,  Kathleen A. Stalter

    IPC分类号： H01L023/48 ,  H05K003/34

    CPC分类号： H05K3/3436 ,  H01L23/49827 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2924/00014 ,  H01L2924/09701 ,  H05K2201/10378 ,  H05K2201/10424 ,  H05K2201/10674 ,  H05K2203/0415 ,  Y02P70/613 ,  Y10T29/49144 ,  Y10T29/49149 ,  H01L2224/05599

    摘要： A method of and device for preventing short circuits between solder joints in flip chip packaging. The dielectric interposer of the present invention has a plurality of apertures or vias which correspond to the I/O pads on a chip and substrate. Preferably, the interposer comprises a polyester film, glass, alumina, polyimide, a heat curable polymer or an inorganic powder filler in an organic material. More preferably, the interposer contains an adhesive or has adhesive layers disposed on the linear surfaces of the interposer. Cone shaped solder elements are formed within the apertures of the interposer. The dielectric interposer is positioned between a chip and substrate in an electronic module and thermally reflowed to create an electrical and mechanical interconnection. The interposer prohibits contact between the solder joints by isolating each of the joints and corresponding bonding pads. The interposer also prevents over compression of the solder joints by acting as a stand off.

    摘要翻译： 一种用于防止倒装芯片封装中焊点之间短路的方法和装置。 本发明的电介质插入件具有与芯片和衬底上的I / O焊盘对应的多个孔或通孔。 优选地，中间层包括有机材料中的聚酯膜，玻璃，氧化铝，聚酰亚胺，可热固化聚合物或无机粉末填料。 更优选地，插入件包含粘合剂或者具有设置在插入件的线性表面上的粘合剂层。 锥形焊料元件形成在插入件的孔内。 电介质插入件位于电子模块中的芯片和衬底之间并被热回流以产生电气和机械互连。 插入器通过隔离每个接头和相应的接合焊盘来禁止焊点之间的接触。 插入器还通过作为支架来防止焊点的过度压缩。

    Method of joining laminates for z-axis interconnection
    9.
    发明申请
    Method of joining laminates for z-axis interconnection 审中-公开
    连接z轴互连的层压板的方法

    公开(公告)号：US20030041966A1

    公开(公告)日：2003-03-06

    申请号：US09944284

    申请日：2001-08-31

    申请人： International Business Machines Corporation

    发明人： Jon A. Casey ,  Brian E. Curcio ,  John U. Knickerbocker ,  Voya R. Markovich ,  Mark D. Poliks

    IPC分类号： C09J005/10 ,  B05D005/12

    CPC分类号： H05K3/462 ,  H05K3/4069 ,  H05K2201/09536 ,  H05K2201/0959 ,  H05K2201/096 ,  H05K2201/10378

    摘要： A method of forming a laminated composite printed wiring structure of a plurality of at least three superimposed subcomposites having organic substrates is provided. Via openings in the subcomposite structures having conductive paste therein are positioned to align with openings in at least one adjacent subcomposite structure also filled with conductive paste that is to be joined thereto. Printed wiring is provided on at least one face of one subcomposite structure. A fixture with pins which extends through index openings in the composites are provided to mount masks for screening paste and stacking of the composites is provided. After screening of paste, and partially curing of the paste, in each composite, a group of composites is placed on the fixture and the pastes are fully cured to form a unitary structure.

    摘要翻译： 提供一种形成具有有机基板的多个至少三个叠加的子复合材料的叠层复合印刷布线结构的方法。 通过其中具有导电膏的子复合结构中的开口被定位成与至少一个相邻的子复合结构中的开口对准，其中还填充有要与其连接的导电浆料。 印刷线路设置在一个子复合结构的至少一个面上。 提供了一种具有延伸穿过复合材料中的折痕开口的销钉的固定器，用于安装用于筛分浆料的掩模并提供复合材料的堆叠。 在糊状物筛选和部分固化糊料之后，在每个复合材料中，将一组复合材料放置在夹具上，并且糊料被完全固化以形成整体结构。

    GANG PUNCH TOOL ASSEMBLY
    10.
    发明申请
    GANG PUNCH TOOL ASSEMBLY 失效
    GANG PUNCH工具组装

    公开(公告)号：US20020029670A1

    公开(公告)日：2002-03-14

    申请号：US09906199

    申请日：2001-07-16

    申请人： International Business Machines Corporation

    发明人： David C. Long ,  John U. Knickerbocker ,  Mark J. LaPlante ,  Thomas Weiss ,  Robert P. Westerfield JR.

    IPC分类号： B26F001/02

    CPC分类号： B26D7/26 ,  B26F1/02 ,  B26F2210/08 ,  H05K1/0306 ,  H05K3/005 ,  Y10T83/04 ,  Y10T83/0448 ,  Y10T83/0481 ,  Y10T83/857 ,  Y10T83/8699 ,  Y10T83/8828 ,  Y10T83/8835 ,  Y10T83/8845 ,  Y10T83/8855

    摘要： A gang punch tool assembly and method is provided for punching holes in a plurality of greensheets which are processed sequentially through the assembly. The punch mechanism is a gang punch cooperating with a corresponding die and the greensheet is automatically fed to the gang punch and die, the greensheet punched and then the punched greensheet removed from the punch area and another greensheet positioned for punching. Operation of the gang punch apparatus is efficient and effective and has a high greensheet throughput. A preferred gang punch uses a pressurizable air chamber for controlling punching of the greensheet without damage to the greensheets or gang punch mechanism.

    摘要翻译： 提供了一种组合冲孔工具组合件和方法，用于对多个通过组件顺序处理的多个刮板中的孔进行冲孔。 冲头机构是与相应的模具配合的组合冲头，并且毛坯自动进给组合冲头和模具，冲切毛坯，然后将冲孔毛坯从冲头区域移除，另一个毛坯定位用于冲压。 组合打孔装置的操作是高效和有效的并且具有高的毛坯生产量。 优选的组合冲头使用可加压空气室来控制毛坯的冲压而不损坏刮板或组合冲头机构。