公开(公告)号：US20040066478A1

公开(公告)日：2004-04-08

申请号：US10263851

申请日：2002-10-03

Applicant: International Business Machines Corporation

Inventor： Donald S. Farquhar ,  Mark D. Poliks

IPC: G02F001/1335

CPC classification number: H05K3/4632 ,  B32B7/04 ,  B32B37/00 ,  B32B37/0046 ,  B32B2037/0092 ,  B32B2305/34 ,  B32B2305/55 ,  B32B2307/204 ,  B32B2307/3065 ,  B32B2307/5825 ,  B32B2309/02 ,  B32B2311/00 ,  C09K19/00 ,  H05K1/0313 ,  H05K3/4641 ,  H05K2201/0141 ,  H05K2201/0195 ,  H05K2201/09318 ,  Y10T428/24273 ,  Y10T428/24331

Abstract: A multi-layered structure and method of formation. A page is generated by stacking N substructures (Nnull2) in an ordered sequence. A first substructure of each pair of adjacent substructures comprises liquid crystal polymer (LCP) dielectric material to be bonded with a second substructure of a pair of the adjacent substructure. The page is subjected to a temperature less than the lowest nematic-to-isotropic transition temperature of the LCP dielectric materials within the page. The dwell time and elevated pressure are sufficient to cause all LCP dielectric material within the page to plastically deform and laminate each pair of adjacent substructures without any extrinsic adhesive layer disposed between the first and second substructures of each pair of adjacent substructures.

Abstract translation: 多层结构和形成方法。 通过以有序的顺序堆叠N个子结构（N> = 2）来生成页面。 每对相邻子结构的第一子结构包括要与一对相邻子结构的第二子结构结合的液晶聚合物（LCP）电介质材料。 该页面经受低于页内LCP介电材料的最低向列 - 各向同性转变温度的温度。 停留时间和升高的压力足以使页内的所有LCP电介质材料塑性变形并层压每对相邻的子结构，而不会在每对相邻子结构的第一和第二子结构之间设置任何外在粘合剂层。

公开(公告)号：US20020150741A1

公开(公告)日：2002-10-17

申请号：US09834281

申请日：2001-04-12

Applicant: International Business Machines Corporation

Inventor： Brian E. Curcio ,  Donald S. Farquhar ,  Konstantinos I. Papathomas ,  Mark D. Poliks

IPC: B32B003/00

CPC classification number: H05K3/462 ,  H05K3/386 ,  H05K3/4069 ,  H05K3/4623 ,  H05K3/4641 ,  H05K2201/0959 ,  H05K2201/096 ,  H05K2201/10378 ,  H05K2203/0353 ,  H05K2203/0384 ,  H05K2203/0554 ,  H05K2203/063 ,  Y10T29/49002 ,  Y10T29/49117 ,  Y10T29/49124 ,  Y10T428/24917

Abstract: A method of forming a core for and forming a composite wiring board. The core has an electrically conductive coating on at least one face of a dielectric substrate. At least one opening is formed through the substrate extending from one face to the other and through each conductive coating. An electrically conductive material is dispensed in each of the openings extending through the conducting coating. At least a portion of the surface of the conductive coating on one face is removed to allow a nub of the conductive material to extend above the substrate face and any remaining conductive material to thereby form a core that can be electrically joined face-to-face with a second core member or other circuitized structure.

Abstract translation: 一种形成用于和形成复合布线板的芯的方法。 芯在电介质基板的至少一个表面上具有导电涂层。 至少一个开口形成穿过衬底，从一个面延伸到另一个面并穿过每个导电涂层。 在穿过导电涂层的每个开口中分配导电材料。 去除一个表面上的导电涂层的表面的至少一部分，以允许导电材料的一个部分在基板表面上方延伸，并且任何剩余的导电材料形成可以面对面地电连接的芯 具有第二芯构件或其他电路结构。

公开(公告)号：US20040052945A1

公开(公告)日：2004-03-18

申请号：US10657483

申请日：2003-09-08

Applicant: International Business Machines Corporation

Inventor： Brian E. Curcio ,  Donald S. Farquhar ,  Konstantinos I. Papathomas ,  Mark D. Poliks

IPC: B05D003/00

CPC classification number: H05K3/462 ,  H05K3/386 ,  H05K3/4069 ,  H05K3/4623 ,  H05K3/4641 ,  H05K2201/0959 ,  H05K2201/096 ,  H05K2201/10378 ,  H05K2203/0353 ,  H05K2203/0384 ,  H05K2203/0554 ,  H05K2203/063 ,  Y10T29/49002 ,  Y10T29/49117 ,  Y10T29/49124 ,  Y10T428/24917

Abstract: A method of forming a core for and forming a composite wiring board. The core has an electrically conductive coating on at least one face of a dielectric substrate. At least one opening is formed through the substrate extending from one face to the other and through each conductive coating. An electrically conductive material is dispensed in each of the openings extending through the conducting coating. At least a portion of the surface of the conductive coating on one face is removed to allow a nub of the conductive material to extend above the substrate face and any remaining conductive material to thereby form a core that can be electrically joined face-to-face with a second core member or other circuitized structure.

Abstract translation: 一种形成用于和形成复合布线板的芯的方法。 芯在电介质基板的至少一个表面上具有导电涂层。 至少一个开口形成穿过衬底，从一个面延伸到另一个面并穿过每个导电涂层。 在穿过导电涂层的每个开口中分配导电材料。 去除一个表面上的导电涂层的表面的至少一部分，以允许导体材料的一部分在衬底表面上延伸，并且任何剩余的导电材料形成可以面对面地电连接的芯 具有第二芯构件或其他电路结构。

公开(公告)号：US20030147227A1

公开(公告)日：2003-08-07

申请号：US10263849

申请日：2002-10-03

Applicant: International Business Machines Corporation

Inventor： Frank D. Egitto ,  Donald S. Farquhar ,  Voya R. Markovich ,  Mark D. Poliks ,  Douglas O. Powell

IPC: H05K001/11 ,  H05K001/14

CPC classification number: H01L21/4853 ,  H01L23/3735 ,  H01L23/49822 ,  H01L2224/16225 ,  H01L2924/01004 ,  H01L2924/01019 ,  H01L2924/01046 ,  H01L2924/01068 ,  H01L2924/01078 ,  H01L2924/01322 ,  H01L2924/15311 ,  H01L2924/3011 ,  H01L2924/3025 ,  H05K1/114 ,  H05K3/429 ,  H05K3/4602 ,  H05K3/4608 ,  H05K3/462 ,  H05K3/4623 ,  H05K3/4626 ,  H05K3/4632 ,  H05K3/4641 ,  H05K3/4688 ,  H05K2201/0141 ,  H05K2201/0191 ,  H05K2201/068 ,  H05K2201/09509 ,  H05K2201/09536 ,  H05K2201/09554 ,  H05K2201/0959 ,  H05K2201/096 ,  H05K2201/10378 ,  Y10T29/49126 ,  Y10T29/49155 ,  Y10T29/49165 ,  Y10T156/1092

Abstract: A multi-layered interconnect structure and method of formation. In a first embodiment, first and second liquid crystal polymer (LCP) dielectric layers are directly bonded, respectively, to first and second opposing surface of a thermally conductive layer, with no extrinsic adhesive material bonding the thermally conductive layer with either the first or second LCP dielectric layer. In a second embodiment, first and second 2S1P substructures are directly bonded, respectively, to first and second opposing surfaces of a LCP dielectric joining layer, with no extrinsic adhesive material bonding the LCP dielectric joining layer with either the first or second 2S1P substructures.

Abstract translation: 多层互连结构和形成方法。 在第一实施例中，第一和第二液晶聚合物（LCP）电介质层分别直接接合到导热层的第一和第二相对表面，没有外在粘合材料将导热层与第一或第二液晶聚合物 LCP电介质层。 在第二实施例中，第一和第二2S1P子结构分别直接接合到LCP电介质接合层的第一和第二相对表面，没有外部粘合材料将LCP电介质接合层与第一或第二2S1P子结构结合。

公开(公告)号：US20030041966A1

公开(公告)日：2003-03-06

申请号：US09944284

申请日：2001-08-31

Applicant: International Business Machines Corporation

Inventor： Jon A. Casey ,  Brian E. Curcio ,  John U. Knickerbocker ,  Voya R. Markovich ,  Mark D. Poliks

IPC: C09J005/10 ,  B05D005/12

CPC classification number: H05K3/462 ,  H05K3/4069 ,  H05K2201/09536 ,  H05K2201/0959 ,  H05K2201/096 ,  H05K2201/10378

Abstract: A method of forming a laminated composite printed wiring structure of a plurality of at least three superimposed subcomposites having organic substrates is provided. Via openings in the subcomposite structures having conductive paste therein are positioned to align with openings in at least one adjacent subcomposite structure also filled with conductive paste that is to be joined thereto. Printed wiring is provided on at least one face of one subcomposite structure. A fixture with pins which extends through index openings in the composites are provided to mount masks for screening paste and stacking of the composites is provided. After screening of paste, and partially curing of the paste, in each composite, a group of composites is placed on the fixture and the pastes are fully cured to form a unitary structure.

Abstract translation: 提供一种形成具有有机基板的多个至少三个叠加的子复合材料的叠层复合印刷布线结构的方法。 通过其中具有导电膏的子复合结构中的开口被定位成与至少一个相邻的子复合结构中的开口对准，其中还填充有要与其连接的导电浆料。 印刷线路设置在一个子复合结构的至少一个面上。 提供了一种具有延伸穿过复合材料中的折痕开口的销钉的固定器，用于安装用于筛分浆料的掩模并提供复合材料的堆叠。 在糊状物筛选和部分固化糊料之后，在每个复合材料中，将一组复合材料放置在夹具上，并且糊料被完全固化以形成整体结构。

公开(公告)号：US20030003305A1

公开(公告)日：2003-01-02

申请号：US09818458

申请日：2001-03-27

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Robert Maynard Japp ,  Konstantinos I. Papathomas ,  Mark D. Poliks

IPC: B32B027/38 ,  C08F008/00

CPC classification number: B32B15/08 ,  B32B27/281 ,  B32B27/38 ,  B32B2457/08 ,  C08G59/304 ,  C08G59/3254 ,  C08L63/00 ,  C08L79/04 ,  C08L79/085 ,  H05K1/0373 ,  H05K2201/012 ,  Y10T428/2938 ,  Y10T428/31511 ,  Y10T428/31529 ,  C08L2666/20

Abstract: A halogen-free dielectric resin mixture is described for use in microvia and other similar applications. The resin mixture contains a cyanate ester monomer or prepolymer a bismaleimide, an epoxy and a flame inhibiting compound selected from the group consisting of a phosphinic acid anhydride, a phosphonic acid andydride and a phosphonic acid half-ester. The flame inhibitor is present in an amount wherein the elemental phosphorus content is between about 2% and about 20% by weight, based on the weight of the resin mixture. The resin mixture can also include one or more coloring, fluorescent and UV absorbing agents. Prepregs based on the resin mixture with inorganic or organic reinforcing agents, as well as circuit boards and chip carriers made from the prepregs are also described. A resin coated article for use in microvia laser applications is likewise included.

公开(公告)号：US20020192444A1

公开(公告)日：2002-12-19

申请号：US10213646

申请日：2002-08-06

Applicant: International Business Machines Corporation

Inventor： Brian E. Curcio ,  Donald S. Farquhar ,  Konstantinos I. Papathomas ,  Mark D. Poliks

IPC: B32B003/00

CPC classification number: H05K3/462 ,  H05K3/386 ,  H05K3/4069 ,  H05K3/4623 ,  H05K3/4641 ,  H05K2201/0959 ,  H05K2201/096 ,  H05K2201/10378 ,  H05K2203/0353 ,  H05K2203/0384 ,  H05K2203/0554 ,  H05K2203/063 ,  Y10T29/49002 ,  Y10T29/49117 ,  Y10T29/49124 ,  Y10T428/24917

Abstract: A method of forming a core for and forming a composite wiring board. The core has an electrically conductive coating on at least one face of a dielectric substrate. At least one opening is formed through the substrate extending from one face to the other and through each conductive coating. An electrically conductive material is dispensed in each of the openings extending through the conducting coating. At least a portion of the surface of the conductive coating on one face is removed to allow a nub of the conductive material to extend above the substrate face and any remaining conductive material to thereby form a core that can be electrically joined face-to-face with a second core member or other circuitized structure.

Abstract translation: 一种形成用于和形成复合布线板的芯的方法。 芯在电介质基板的至少一个表面上具有导电涂层。 至少一个开口形成穿过衬底，从一个面延伸到另一个面并穿过每个导电涂层。 在穿过导电涂层的每个开口中分配导电材料。 去除一个表面上的导电涂层的表面的至少一部分，以允许导体材料的一部分在衬底表面上延伸，并且任何剩余的导电材料形成可以面对面地电连接的芯 具有第二芯构件或其他电路结构。