公开(公告)号：US20040265597A1

公开(公告)日：2004-12-30

申请号：US10873379

申请日：2004-06-21

Inventor： Hans-Josef Laas ,  Christoph Gurtler ,  Reinhard Halpaap ,  Michael Grahl ,  Peter Thometzek ,  James Rawlins

IPC: B32B027/38 ,  C08L063/00 ,  B32B027/30

CPC classification number: C09D5/03 ,  C08G59/18 ,  C08G59/42 ,  Y10S525/934 ,  Y10T428/31511 ,  Y10T428/31935 ,  Y10T428/31938

Abstract: The invention relates to the use of special mixtures of at least two polycarboxylic acids as crosslinker components for thermally curing powder-lacquer binding agents having groups that are capable of reacting with carboxyl groups. The mixtures include at least two polycarboxylic acids each melting above 95null C. and having up to 20 carbon atoms and consist of at least 5 wt. %, of the polycarboxylic acid with the lowest melting point and at least 10 wt. %, of the polycarboxylic acid with the highest melting point of all polycarboxylic acids present in the mixture to at least 5 wt. %. Additionally, the polycarboxylic acid mixture is a solid below 40null C. and a liquid above 160null C.

Abstract translation: 本发明涉及使用至少两种多元羧酸的特殊混合物作为交联剂组分，用于热固化具有能够与羧基反应的基团的粉末 - 粘合剂。 所述混合物包括至少两种各自在95℃以上熔融且具有至多20个碳原子并且由至少5wt。 ％的具有最低熔点的聚羧酸和至少10wt。 ％，所述混合物中存在的所有多元羧酸的熔点最高的多元羧酸为至少5重量％ ％。 此外，多元羧酸混合物是低于40℃的固体和高于160℃的液体

公开(公告)号：US20040224163A1

公开(公告)日：2004-11-11

申请号：US10832947

申请日：2004-04-26

Applicant: POLYMATECH CO., LTD.

Inventor： Masayuki Tobita ,  Toru Kimura ,  Tsukasa Ishigaki ,  Naoyuki Shimoyama ,  Hisashi Aoki ,  Mitsukazu Ochi ,  Miyuki Harada

IPC: B32B027/38 ,  B29C071/02

CPC classification number: C08G59/28 ,  C08G59/5033 ,  Y10T428/31 ,  Y10T428/31511

Abstract: A thermally-conductive epoxy resin molded article comprises an epoxy resin having molecular chains that contain an azomethine group (nullCHnullNnull). The molded article has a thermal conductivity in a range of 0.5 to 30 W/(mnullK). It is preferred that the molecular chains of the epoxy resin are oriented in a specific direction, and in that direction, the molded article has a thermal conductivity in a range of 0.5 to 30 W/(mnullK). The thermally-conductive epoxy resin molded article is produced by applying a magnetic field to the epoxy resin composition to orient the molecular chains of the epoxy resin in a specific direction and then curing the epoxy resin composition.

Abstract translation: 导热性环氧树脂成型体包含具有含有偶氮甲碱基（-CH = N-）的分子链的环氧树脂。 成型品的导热率为0.5〜30W /（m·K）。 优选环氧树脂的分子链沿特定方向取向，在该方向上，成型品的导热率为0.5〜30W /（m·K）。 通过向环氧树脂组合物施加磁场，将环氧树脂的分子链沿特定方向取向，然后使环氧树脂组合物固化，制造导热性环氧树脂成型体。

公开(公告)号：US20040214006A1

公开(公告)日：2004-10-28

申请号：US10823003

申请日：2004-04-12

Applicant: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.

Inventor： Kumiko Hirayama ,  Fumio Echigo ,  Izuru Nakai ,  Yoji Ueda

IPC: B32B027/38 ,  B32B027/08

CPC classification number: H05K3/4069 ,  H05K1/0201 ,  H05K3/0032 ,  H05K2201/0355 ,  H05K2203/0191 ,  H05K2203/1461 ,  Y10T428/31522

Abstract: A member for a circuit board according to the present invention includes a prepreg and a mold release film that is provided on at lease one side of the prepreg. The mold release film contains or is coated with a heat absorbing substance having a heat absorbing property. A method of manufacturing a member for a circuit board according to the present invention includes allowing a mold release film to adhere to at least one side of a prepreg by heating and pressing. The mold release film contains or is coated with a heat absorbing substance having a heat absorbing property. In the method, the heating is performed at a temperature not lower than a softening point of the prepreg and not higher than an endothermic temperature of the heat absorbing substance. Thus, a member for a circuit board that can prevent or reduce the occurrence of deformation such as contraction of a mold release film even when processing holes using a laser or the like, a method of manufacturing the same, and methods of manufacturing circuit boards are provided.

Abstract translation: 根据本发明的电路板的构件包括预浸料坯和脱模膜，其设置在预浸料的至少一侧。 脱模膜包含或涂覆有具有吸热性的吸热物质。 根据本发明的制造电路板的部件的方法包括通过加热和压制使脱模膜粘附到预浸料坯的至少一侧。 脱模膜包含或涂覆有具有吸热性的吸热物质。 在该方法中，在不低于预浸料坯的软化点的温度下进行加热，且不高于吸热物质的吸热温度。 因此，即使使用激光等来处理孔也能够防止或减少脱模膜的收缩等变形的发生的电路板的构件，其制造方法以及制造电路板的方法是： 提供。

公开(公告)号：US20040202864A1

公开(公告)日：2004-10-14

申请号：US10792859

申请日：2004-03-05

Applicant: JAPAN EPOXY RESINS CO., LTD.

Inventor： Yasuyuki Murata ,  Atsuhito Hayakawa ,  Akihiro Itou

IPC: B32B027/38 ,  C08L063/00

CPC classification number: C08G59/04 ,  Y10T428/24264 ,  Y10T428/24322 ,  Y10T428/24331 ,  Y10T428/31511

Abstract: A granular epoxy resin is made by pulverizing an epoxy resin which is solid at ordinary temperature and can exhibit excellent fluidity during molding because of its low melt viscosity in which the total content of components having a molecular weight of 500 or less among components of n1null0 in the following general formula (1) and/or components of n2null0 in the following general formula (2) is 50% by mass or more of the entire epoxy resin, or, the total content of components having a molecular weight 400 or less among components of n1null0 in the following general formula (1) and/or components of n2null0 in the following general formula (2) is 20% by mass or more of the entire epoxy resin. The content of low molecular weight compounds having a molecular weight 200 or less in the granular epoxy resin is 0.3% by mass or less. The granular epoxy resin allows easy handling because it hardly causes blocking during storage and transportation. 1

Abstract translation: 颗粒状环氧树脂通过在常温下粉碎固体的环氧树脂制成，并且由于其熔体粘度低，其中分子量为500以下的组分的总含量为n < 以下通式（1）中的1≤0= 0，和/或以下通式（2）中n 2 = 0的成分为全部环氧树脂的50质量％以上， 以下通式（1）中n 1 = 0的成分中的分子量为400以下的成分和/或下述通式（2）中的n 2 = 0的成分为20质量％ 更多的是整个环氧树脂。 粒状环氧树脂中分子量为200以下的低分子量化合物的含量为0.3质量％以下。 颗粒状环氧树脂容易处理，因为它在储存和运输过程中几乎不会堵塞。

公开(公告)号：US20040191524A1

公开(公告)日：2004-09-30

申请号：US10779111

申请日：2004-02-13

Inventor： James Anthony Lodge

IPC: B05D001/18 ,  B32B027/38

CPC classification number: B05D5/061 ,  A47G19/025 ,  A47G19/12 ,  A47G19/2227 ,  A47G2200/163 ,  B44F1/10 ,  C09D11/50 ,  Y10T428/31511 ,  Y10T428/31525

Abstract: A method of decorating a ceramic article, includes the steps of mixing a thermochromic pigment with a first coating material to form a first coating mixture, applying the first coating mixture directly onto a part or substantially the whole outer surface of the tableware article and, once the first coating mixture is cured, applying a second coating material over the first coating mixture, the second coating material being substantially dishwasher proof.

Abstract translation: 一种装饰陶瓷制品的方法包括以下步骤：将热变色颜料与第一涂料混合以形成第一涂料混合物，将第一涂料混合物直接施用到餐具制品的一部分或基本上整个外表面上，一次 第一涂料混合物固化，在第一涂料混合物上施加第二涂料，第二涂料基本上是洗碗机证明。

公开(公告)号：US20040086720A1

公开(公告)日：2004-05-06

申请号：US10609090

申请日：2003-06-27

Inventor： Joseph Gan ,  John P. Everett

IPC: B32B027/38

CPC classification number: C08G59/42 ,  C08G59/18 ,  C08L63/00 ,  Y10T428/31511 ,  C08L2666/04

Abstract: The invention relates to epoxy resin compositions. More specifically, the invention is a composition suitable to cure an epoxy resin, preferably in a solvent, incorporating a cross-linking compound of a polycarboxylic acid anhydride or a copolymer of styrene and hydroxystyrene. Also, the invention relates to an epoxy resin composition comprising an inhibitor effective to extend the gel time of the composition at curing temperatures from 150null C. to 170null C., and a cross-linking compound as described.

Abstract translation: 本发明涉及环氧树脂组合物。 更具体地说，本发明是一种适用于固化环氧树脂，优选在溶剂中固化的组合物，其中加入多元羧酸酐的交联化合物或苯乙烯与羟基苯乙烯的共聚物。 此外，本发明涉及一种环氧树脂组合物，其包含在150℃至170℃的固化温度下有效延长组合物凝胶时间的抑制剂和如上所述的交联化合物。

公开(公告)号：US20040058160A1

公开(公告)日：2004-03-25

申请号：US10254990

申请日：2002-09-25

Inventor： Hiroshi Nagata ,  Yoshiyuki Goh

IPC: B32B027/38

CPC classification number: H01L23/293 ,  C08G59/621 ,  C08G59/688 ,  C08K5/50 ,  H01L2924/0002 ,  Y10S428/901 ,  Y10T428/287 ,  Y10T428/31511 ,  C08L63/00 ,  H01L2924/00

Abstract: An epoxy resin molding material which comprises as essential components thereof (A) a compound having at least two epoxy groups in one molecule, (B) a compound having at least two phenolic hydroxyl groups in one molecule, (C) a molecular compound represented by any one of general formulae (1) and (2) and (D) an inorganic filler. The material exhibits an increased curing rate and an excellent storage stability. 1 (P represents phosphorus atom, R1, R2, R3 and R4 each represent a substituted or unsubstituted aromatic group or an alkyl group, A1 and A2 each represent a divalent aromatic group, B1 represents a single bond, a divalent group selected from ether groups, sulfone groups, sulfide groups and carbonyl groups or a divalent organic group having 1 to 13 carbon atoms and 0nullmnull0.75.)

Abstract translation: 一种环氧树脂成型材料，其包括作为其主要成分的（A）在一个分子中具有至少两个环氧基的化合物，（B）在一个分子中具有至少两个酚羟基的化合物，（C）由 通式（1）和（2）中任一项和（D）无机填料。 该材料具有提高的固化速度和优异的储存稳定性。 （P表示磷原子，R1，R2，R3和R4各自表示取代或未取代的芳基或烷基，A1和A2各自表示二价芳基，B1表示单键，选自醚基的二价基， 砜基，硫醚基和羰基或具有1至13个碳原子且0 <= m <= 0.75的二价有机基团）

公开(公告)号：US20040053061A1

公开(公告)日：2004-03-18

申请号：US10433956

申请日：2003-10-24

Inventor： Koji Yonezawa ,  Koichi Shibayama ,  Masao Fushimi ,  Hideyuki Takahashi ,  Koji Taniguchi ,  Motohiro Yagi

IPC: B32B015/08 ,  B32B027/38

CPC classification number: H01B3/30 ,  B32B15/08 ,  C08K3/34 ,  C08K7/00 ,  H01L23/145 ,  H01L2924/0002 ,  H05K1/0373 ,  H05K2201/0129 ,  H05K2201/0154 ,  Y10T428/265 ,  Y10T428/31518 ,  Y10T428/31522 ,  Y10T428/31678 ,  Y10T428/31681 ,  H01L2924/00

Abstract: It is an object of the invention to provide a material for insulating substrate, a printed board, a laminate, copper foil with resin, a copper-clad laminate, a polyimide film, a film for TAB and a prepreg, which are excellent in physical properties, dimensional stability, heat resistance, flame retardancy etc. and exhibit an excellent flame retardant effect particularly by a shape retention effect at the time of combustion The invention provides a material for insulating substrate, comprising 100 parts by weight of a thermoplastic resin or a mixture of a thermoplastic resin and a thermosetting resin and 0.1 to 100 parts by weight of a layered silicate.

Abstract translation: 本发明的目的是提供一种用于绝缘基板，印刷电路板，层压板，具有树脂的铜箔，覆铜层压板，聚酰亚胺膜，用于TAB的膜和预浸料的材料，其物理性质优异 特性，尺寸稳定性，耐热性，阻燃性等，特别是通过燃烧时的形状保持效果而显示优异的阻燃效果本发明提供一种绝缘基材的材料，其包含100重量份的热塑性树脂或 热塑性树脂和热固性树脂的混合物和0.1至100重量份层状硅酸盐。

公开(公告)号：US20030211327A1

公开(公告)日：2003-11-13

申请号：US10421696

申请日：2003-04-24

Applicant: NITTO DENKO CORPORATION

Inventor： Hideyuki Usui ,  Satoshi Okuda ,  Minoru Nakao

IPC: B32B027/38

CPC classification number: C08L63/04 ,  Y10T428/31511 ,  C08L2666/02

Abstract: An epoxy resin composition for semiconductor encapsulation comprising (A) an epoxy resin, (B) a phenolic resin, and (C) butadiene rubber particles having an average particle size of secondary particles of 100 nullm or smaller and having such a size distribution that the proportion of secondary particles having a particle size of 250 nullm or smaller is 97% by weight or more, and the proportion of secondary particles having a particle size of 150 nullM or smaller is 80% by weight or more. Component (C) is uniformly dispersed in the composition without forming coarse agglomerates to secure low stress properties.

Abstract translation: 一种半导体封装用环氧树脂组合物，其包含（A）环氧树脂，（B）酚醛树脂和（C）二次粒子的平均粒径为100μm以下的具有如下尺寸分布的丁二烯橡胶粒子， 粒径250μm以下的二次粒子的比例为97重量％以上，粒径为150μm以下的二次粒子的比例为80重量％以上。 组分（C）均匀分散在组合物中，而不形成粗团块以确保低应力性能。

公开(公告)号：US20030207117A1

公开(公告)日：2003-11-06

申请号：US10427610

申请日：2003-04-30

Inventor： Hirotaka Ueda ,  Masaki Mizutani

IPC: B32B027/38

CPC classification number: H01L21/6835 ,  C09J163/00 ,  H01L21/563 ,  H01L21/6836 ,  H01L24/27 ,  H01L24/28 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2221/68377 ,  H01L2224/16225 ,  H01L2224/274 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01025 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01057 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/10329 ,  H01L2924/14 ,  H01L2924/351 ,  Y10T428/1352 ,  Y10T428/31511 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2224/0401

Abstract: A sheet resin composition is adhered to a silicon wafer. The sheet resin composition supports the silicon wafer during back grinding and dicing into chips. Further, the sheet resin composition interfacial underfills between a chip from the wafer and a substrate during subsequent fabrication of a semiconductor device, the chip being flip chip mounted to the substrate.