公开(公告)号：US20010052659A1

公开(公告)日：2001-12-20

申请号：US09881769

申请日：2001-06-18

Applicant: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD

Inventor： Izuru Nakai ,  Toshiharu Okada ,  Haruhiro Yuki

IPC: B29C035/08 ,  B23K026/38

CPC classification number: B23K26/361 ,  B23K26/382 ,  B23K26/40 ,  B23K2103/16 ,  B23K2103/172 ,  B23K2103/42 ,  B23K2103/50 ,  H05K3/0038 ,  H05K3/427 ,  H05K2201/09827 ,  H05K2203/1476

Abstract: When drilling a multi layered sheet-like material, drilling is first made with pulses having energy that generates an inter-layer pull-off force smaller than the adhesion force between the layers. Then pulses with higher energy are radiated for trimming the shape of the holes, and thus through-holes having a desired shape are drilled without causing delamination of the layers.

Abstract translation: 当钻多层片状材料时，首先用具有生成小于层之间的粘附力的层间拉拔力的能量的脉冲进行钻孔。 然后照射具有较高能量的脉冲以修整孔的形状，因此钻出具有期望形状的通孔而不会引起层的分层。

公开(公告)号：US20020020557A1

公开(公告)日：2002-02-21

申请号：US09976376

申请日：2001-10-12

Applicant: Matsushita Electric Industrial Co., Ltd.

Inventor： Toshihiro Nishii ,  Shigeru Yamane ,  Shinji Nakamura ,  Hidenori Hayashi ,  Toru Fujimoto ,  Toshiharu Okada ,  Izuru Nakai

IPC: H05K001/11

CPC classification number: H05K3/4069 ,  H05K1/0366 ,  H05K3/0032 ,  H05K2201/0278 ,  H05K2201/0355 ,  H05K2201/09581 ,  H05K2203/1136 ,  H05K2203/1461 ,  Y10T29/49165 ,  Y10T428/24917 ,  Y10T428/249953 ,  Y10T428/249996

Abstract: In manufacturing a double-layered or a multi-layered printed wiring board, a layer of metamorphic substance, which is created by transmuting a substrate material, is formed on an inner wall of a hole during a perforation process of the substrate utilizing radiation energy. The layer of metamorphic substance prevents conductive materials constituting electrical connection means formed on the inner wall of the hole from dispersing over a surface of the substrate or permeating into the substrate.

Abstract translation: 在制造双层或多层印刷线路板的过程中，利用辐射能在衬底的穿孔过程中，在孔的内壁上形成通过变换衬底材料产生的变质物质层。 变质物质层防止形成在孔的内壁上的电连接装置的导电材料在基体的表面上分散或渗透到基底中。

公开(公告)号：US20020000430A1

公开(公告)日：2002-01-03

申请号：US09892651

申请日：2001-06-28

Applicant: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.

Inventor： Izuru Nakai ,  Toshiharu Okada ,  Haruhiro Yuki ,  Ken Muneyuki

IPC: B23K026/06

CPC classification number: B23K26/0652 ,  B23K26/0643 ,  B23K26/0648 ,  B23K26/066 ,  H05K3/0026

Abstract: In a laser processing apparatus including a laser oscillator for emitting laser light onto a workpiece through an fnull lens for drilling a hole in the workpiece, a wavelength selector for passing only a light ray having a specific wavelength is disposed between the laser oscillator and the workpiece.

Abstract translation: 在包括激光振荡器的激光加工装置中，激光振荡器用于通过用于在工件中钻孔的透镜用于将工件上的激光发射到工件上，仅在具有特定波长的光线上通过的波长选择器设置在激光振荡器和工件之间 。

公开(公告)号：US20040214006A1

公开(公告)日：2004-10-28

申请号：US10823003

申请日：2004-04-12

Applicant: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.

Inventor： Kumiko Hirayama ,  Fumio Echigo ,  Izuru Nakai ,  Yoji Ueda

IPC: B32B027/38 ,  B32B027/08

CPC classification number: H05K3/4069 ,  H05K1/0201 ,  H05K3/0032 ,  H05K2201/0355 ,  H05K2203/0191 ,  H05K2203/1461 ,  Y10T428/31522

Abstract: A member for a circuit board according to the present invention includes a prepreg and a mold release film that is provided on at lease one side of the prepreg. The mold release film contains or is coated with a heat absorbing substance having a heat absorbing property. A method of manufacturing a member for a circuit board according to the present invention includes allowing a mold release film to adhere to at least one side of a prepreg by heating and pressing. The mold release film contains or is coated with a heat absorbing substance having a heat absorbing property. In the method, the heating is performed at a temperature not lower than a softening point of the prepreg and not higher than an endothermic temperature of the heat absorbing substance. Thus, a member for a circuit board that can prevent or reduce the occurrence of deformation such as contraction of a mold release film even when processing holes using a laser or the like, a method of manufacturing the same, and methods of manufacturing circuit boards are provided.

Abstract translation: 根据本发明的电路板的构件包括预浸料坯和脱模膜，其设置在预浸料的至少一侧。 脱模膜包含或涂覆有具有吸热性的吸热物质。 根据本发明的制造电路板的部件的方法包括通过加热和压制使脱模膜粘附到预浸料坯的至少一侧。 脱模膜包含或涂覆有具有吸热性的吸热物质。 在该方法中，在不低于预浸料坯的软化点的温度下进行加热，且不高于吸热物质的吸热温度。 因此，即使使用激光等来处理孔也能够防止或减少脱模膜的收缩等变形的发生的电路板的构件，其制造方法以及制造电路板的方法是： 提供。

公开(公告)号：US20020020556A1

公开(公告)日：2002-02-21

申请号：US09975780

申请日：2001-10-12

Applicant: Matsushita Electric Industrial Co., Ltd.

Inventor： Toshihiro Nishii ,  Shigeru Yamane ,  Shinji Nakamura ,  Hidenori Hayashi ,  Toru Fujimoto ,  Toshiharu Okada ,  Izuru Nakai

IPC: B32B003/00

CPC classification number: H05K3/4069 ,  H05K1/0366 ,  H05K3/0032 ,  H05K2201/0278 ,  H05K2201/0355 ,  H05K2201/09581 ,  H05K2203/1136 ,  H05K2203/1461 ,  Y10T29/49165 ,  Y10T428/24917 ,  Y10T428/249953 ,  Y10T428/249996

Abstract: In manufacturing a double-layered or a multi-layered printed wiring board, a layer of metamorphic substance, which is created by transmuting a substrate material, is formed on an inner wall of a hole during a perforation process of the substrate utilizing radiation energy. The layer of metamorphic substance prevents conductive materials constituting electrical connection means formed on the inner wall of the hole from dispersing over a surface of the substrate or permeating into the substrate.

Abstract translation: 在制造双层或多层印刷线路板的过程中，利用辐射能在衬底的穿孔过程中，在孔的内壁上形成通过变换衬底材料产生的变质物质层。 变质物质层防止形成在孔的内壁上的电连接装置的导电材料在基体的表面上分散或渗透到基底中。