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    Printed circuit board and method of manufacturing the same
    3.
    发明申请
    Printed circuit board and method of manufacturing the same 有权
    印刷电路板及其制造方法

    公开(公告)号：US20010052425A1

    公开(公告)日：2001-12-20

    申请号：US09879385

    申请日：2001-06-12

    Applicant: Matsushita Electric Industrial Co., Ltd.,

    Inventor： Daizo Andoh ,  Fumio Echigo ,  Tadashi Nakamura ,  Yasuhiro Nakatani ,  Yoji Ueda ,  Tousaku Nishiyama ,  Shozo Ochi

    IPC: B32B005/00

    CPC classification number: H05K3/4069 ,  H05K1/0366 ,  H05K1/0373 ,  H05K3/4614 ,  H05K3/462 ,  H05K3/4652 ,  H05K2201/0266 ,  H05K2201/0355 ,  H05K2201/10378 ,  H05K2203/0191 ,  H05K2203/1461 ,  Y10T29/49126 ,  Y10T29/49155 ,  Y10T29/49165 ,  Y10T428/24917

    Abstract: The present invention provides a printed circuit board, which includes a dielectric substrate having via holes formed in the thickness direction, and a conductor including a conductive filler is filled in the via holes. The dielectric substrate has patterned wiring layers on both surfaces, and the wiring layers are connected electrically with each other by the conductor. The dielectric substrate is made of a glass cloth or a glass nonwoven fabric impregnated with a thermosetting epoxy resin mixed with fine particles, and the conductive filler in the conductor has an average particle diameter larger than that of the fine particles. Accordingly, the printed circuit board has an improved moisture resistance as a whole and also excellent connection reliability and repair resistance. In addition, the dielectric substrate of the printed circuit board has an improved mechanical strength such as flexural rigidity. The present invention also provides a method of manufacturing such a printed circuit board.

    Abstract translation: 本发明提供了一种印刷电路板，其包括具有沿厚度方向形成的通孔的电介质基板，并且包含导电填料的导体填充在通孔中。 电介质基板在两表面上具有图案化的布线层，并且布线层通过导体彼此电连接。 电介质基板由玻璃布或浸渍有与微粒混合的热固性环氧树脂的玻璃无纺布制成，并且导体中的导电填料的平均粒径大于微粒的平均粒径。 因此，印刷电路板整体上具有改善的耐湿性，并且还具有优异的连接可靠性和修复电阻。 此外，印刷电路板的电介质基板具有改善的机械强度，例如弯曲刚度。 本发明还提供一种制造这种印刷电路板的方法。

    Printed wiring board and method of manufacturing the same
    5.
    发明申请
    Printed wiring board and method of manufacturing the same 审中-公开
    印刷电路板及其制造方法

    公开(公告)号：US20030137815A1

    公开(公告)日：2003-07-24

    申请号：US10340041

    申请日：2003-01-09

    Applicant: Matsushita Electric Industrial Co., Ltd.

    Inventor： Shozo Ochi ,  Fumio Echigo ,  Yoji Ueda ,  Yasushi Nakagiri ,  Takeshi Suzuki

    IPC: H05K001/11 ,  H05K001/14

    CPC classification number: H05K3/4069 ,  H05K3/386 ,  H05K3/4614 ,  H05K3/4652 ,  H05K2201/0209 ,  H05K2201/0212 ,  H05K2201/0355 ,  H05K2203/0191 ,  H05K2203/1461

    Abstract: An electrically insulating base material includes a core layer 102, a resin layer 101 on each surface of the core layer 102 and a conductive material 105 filled into through holes 104 formed in a thickness direction. On each surface of the electrically insulating base material, a metal foil 106 is laminated, and a laminate thus obtained is heated and pressed. A conductive filler in the conductive material 105 has a mean particle diameter equal to or larger than a thickness of the resin layer 101, and thus the conductive filler can be prevented from being diffused into the resin layer 101 in a heating and pressing process. As a result, the conductive filler can be densified, thereby allowing a printed wiring board with via hole connection having high connection reliability to be obtained.

    Abstract translation: 电绝缘基材包括芯层102，芯层102的每个表面上的树脂层101和填充在厚度方向形成的通孔104中的导电材料105。 在电绝缘基材的每个表面上层压金属箔106，并将如此获得的层压体加热并加压。 导电材料105中的导电填料具有等于或大于树脂层101的厚度的平均粒径，因此可以防止导电填料在加热和加压过程中扩散到树脂层101中。 结果，导电填料可以被致密化，从而可以获得具有高连接可靠性的通孔连接的印刷电路板。

    Capacitor sheet, method for producing the same, board with built-in capacitors, and semiconductor device
    6.
    发明申请
    Capacitor sheet, method for producing the same, board with built-in capacitors, and semiconductor device 失效
    电容器片，其制造方法，具有内置电容器的板和半导体器件

    公开(公告)号：US20020182804A1

    公开(公告)日：2002-12-05

    申请号：US10155700

    申请日：2002-05-24

    Applicant: Matsushita Electric Industrial Co. Ltd.

    Inventor： Fumio Echigo ,  Tadashi Nakamura ,  Daizo Andoh

    IPC: H01L021/8242

    CPC classification number: H05K1/162 ,  H01L28/60 ,  H05K1/141 ,  H05K3/4069 ,  H05K3/429 ,  H05K2201/09309 ,  H05K2201/09581

    Abstract: A capacitor sheet includes a laminate sheet, interface-connection feedthrough conductors for electrically connecting faces of the laminate sheet, and capacitor-connection feedthrough conductors. The laminate sheet has at least one laminate which is composed of a power source layer electrode, a grounding layer electrode, and a dielectric layer interposed between the power source layer electrode and the grounding layer electrode. The interface-connection feedthrough conductors are formed in through holes that pass through the dielectric layer, the power source layer electrode, and the grounding layer electrode, and are insulated by insulation walls from the power source layer electrode and the grounding layer electrode provided inside. The capacitor-connection feedthrough conductors are formed in regions where only either the power source layer electrode or the grounding layer electrode is provided, and are connected electrically with either the power source layer electrode or the grounding layer electrode. This configuration makes the electric connection for employing the capacitors and the electric connection between faces of the sheet independent from each other. Thus, it is possible to provide a capacitor sheet in which the adverse effects of inductances of vias are minimized.

    Abstract translation: 电容器片包括层压片，用于电连接层压片的表面的接口连接馈通导体和电容器连接馈通导体。 层叠片具有至少一层由电源层电极，接地层电极和插在电源层电极和接地层电极之间的电介质层构成的层叠体。 界面连接馈通导体形成在穿过电介质层，电源层电极和接地层电极的通孔中，并且由设置在内部的电源层电极和接地层电极的绝缘壁绝缘。 电容器连接馈通导体形成在仅设置电源层电极或接地层电极的区域中，并且与电源层电极或接地层电极电连接。 这种构造使得用于采用电容器的电连接和片材的面之间的电连接彼此独立。 因此，可以提供一种电容器片，其中通孔的电感的不利影响被最小化。

    Member for a circuit board, method of manufacturing the same, and methods of manufacturing circuit boards
    7.
    发明申请
    Member for a circuit board, method of manufacturing the same, and methods of manufacturing circuit boards 审中-公开
    电路板的构件，其制造方法以及制造电路板的方法

    公开(公告)号：US20040214006A1

    公开(公告)日：2004-10-28

    申请号：US10823003

    申请日：2004-04-12

    Applicant: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.

    Inventor： Kumiko Hirayama ,  Fumio Echigo ,  Izuru Nakai ,  Yoji Ueda

    IPC: B32B027/38 ,  B32B027/08

    CPC classification number: H05K3/4069 ,  H05K1/0201 ,  H05K3/0032 ,  H05K2201/0355 ,  H05K2203/0191 ,  H05K2203/1461 ,  Y10T428/31522

    Abstract: A member for a circuit board according to the present invention includes a prepreg and a mold release film that is provided on at lease one side of the prepreg. The mold release film contains or is coated with a heat absorbing substance having a heat absorbing property. A method of manufacturing a member for a circuit board according to the present invention includes allowing a mold release film to adhere to at least one side of a prepreg by heating and pressing. The mold release film contains or is coated with a heat absorbing substance having a heat absorbing property. In the method, the heating is performed at a temperature not lower than a softening point of the prepreg and not higher than an endothermic temperature of the heat absorbing substance. Thus, a member for a circuit board that can prevent or reduce the occurrence of deformation such as contraction of a mold release film even when processing holes using a laser or the like, a method of manufacturing the same, and methods of manufacturing circuit boards are provided.

    Abstract translation: 根据本发明的电路板的构件包括预浸料坯和脱模膜，其设置在预浸料的至少一侧。 脱模膜包含或涂覆有具有吸热性的吸热物质。 根据本发明的制造电路板的部件的方法包括通过加热和压制使脱模膜粘附到预浸料坯的至少一侧。 脱模膜包含或涂覆有具有吸热性的吸热物质。 在该方法中，在不低于预浸料坯的软化点的温度下进行加热，且不高于吸热物质的吸热温度。 因此，即使使用激光等来处理孔也能够防止或减少脱模膜的收缩等变形的发生的电路板的构件，其制造方法以及制造电路板的方法是： 提供。

    Circuit board and production of the same
    8.
    发明申请
    Circuit board and production of the same 失效
    电路板和生产相同

    公开(公告)号：US20020038725A1

    公开(公告)日：2002-04-04

    申请号：US09928869

    申请日：2001-08-13

    Applicant: Matsushita Electric Industrial Co., Ltd.

    Inventor： Takeshi Suzuki ,  Tatsuo Ogawa ,  Yoshihiro Bessho ,  Satoru Tomekawa ,  Yasuhiro Nakatani ,  Yoji Ueda ,  Susumu Matsuoka ,  Daizo Andoh ,  Fumio Echigo

    IPC: H05K001/11

    CPC classification number: H05K1/0373 ,  H05K1/036 ,  H05K3/20 ,  H05K3/202 ,  H05K3/4069 ,  H05K3/4614 ,  H05K3/4652 ,  H05K3/4658 ,  H05K2201/0195 ,  H05K2201/0209 ,  H05K2201/068 ,  H05K2203/1461 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49155 ,  Y10T29/49165 ,  Y10T428/24917

    Abstract: A circuit board is configured so as to include not less than two wiring layers, an insulator layer for electric insulation between the wiring layers, and an inner-via-hole conductive member provided in the insulator layer in a thickness direction of the insulator layer, for electric connection between the wiring layers. The insulator layer is made of a composite material containing an organic resin and a material having a smaller thermal expansion coefficient than that of the organic resin, and includes a surface part, a core part, and a surface part laminated in the stated order, the surface part having a high content of the organic resin, the core part having a low content of the organic resin. The wiring layers have a land portion that is connected with the inner-via-hole conductive member, the land portion being embedded so as to be substantially in contact with the core part, and the inner-via-hole conductive member has a thickness substantially equal to a thickness of the core part. According to this configuration, a part of the metal foil is embedded in the insulator layer so as to be in contact with the core layer. Therefore, this makes it possible to provide a circuit board in which portions of the conductive material can be selectively compressed, and which hence is capable of ensuring stable connection between layers.

    Abstract translation: 电路板被构造成在布线层之间包括不少于两个布线层，用于电绝缘的绝缘体层和在绝缘体层的厚度方向上设置在绝缘体层中的内通孔导电构件， 用于布线层之间的电连接。 绝缘体层由包含有机树脂和热膨胀系数小于有机树脂的材料的复合材料制成，并且包括以所述顺序层压的表面部分，芯部分和表面部分， 表面部分具有高含量的有机树脂，芯部分的有机树脂含量低。 所述布线层具有与所述内通孔导电部件连接的台面部，所述接合部嵌入以与所述芯部大体接触，所述内通孔导电部件的厚度基本上 等于芯部的厚度。 根据该结构，将金属箔的一部分嵌入到绝缘体层中以与芯层接触。 因此，能够提供能够选择性地压缩导电材料的部分的电路基板，由此能够确保层之间的稳定的连接。

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