公开(公告)号：US20020029906A1

公开(公告)日：2002-03-14

申请号：US09734593

申请日：2000-12-13

Applicant: Matsushita Electric Industrial Co., Ltd.

Inventor： Fumio Echigo ,  Hideki Higashitani ,  Daizo Andoh ,  Noritake Fukuda ,  Yasuhiro Nakatani ,  Tadashi Nakamura

IPC: H05K003/36 ,  H01K003/10 ,  B23K026/00

CPC classification number: H05K3/4069 ,  H05K3/0032 ,  H05K3/20 ,  H05K3/386 ,  H05K2201/0112 ,  H05K2201/0116 ,  H05K2201/0355 ,  H05K2203/0191 ,  H05K2203/1461 ,  Y10T29/49126 ,  Y10T29/49155 ,  Y10T29/49165 ,  Y10T29/49172

Abstract: Removable mask films 303 are formed on the both sides of the substrate having the adhesive layer 302 by applying and drying a resin varnish 304 including a ultraviolet-absorbing agent, and fine through holes 306 are formed by using a third harmonics YAG solid-state laser light with a relatively short wavelength not longer than that in the ultraviolet range in such a way that the effects of such a residual strain as the conventional embodiment forming a removable mask film by a laminating process may be decreased as well as the more fine hole drilling compared with conventional embodiment using the carbon dioxide gas laser with a relatively long wavelength may be performed.

Abstract translation: 通过施加和干燥包括紫外线吸收剂的树脂清漆304在具有粘合剂层302的基板的两侧上形成可移除掩模膜303，并且通过使用第三谐波YAG固体激光器形成细小通孔306 具有比紫外线范围内的波长相对较短波长的光可以减少通过层压方法形成可去除掩模膜的这种残留应变的效果以及更细孔钻孔 与使用具有较长波长的二氧化碳气体激光器的常规实施例相比可以进行。

公开(公告)号：US20030188428A1

公开(公告)日：2003-10-09

申请号：US10401607

申请日：2003-03-31

Applicant: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.

Inventor： Fumio Echigo ,  Hideki Higashitani ,  Daizo Andoh ,  Noritake Fukuda ,  Yasuhiro Nakatani ,  Tadashi Nakamura

IPC: H01K003/10 ,  B29C035/08 ,  C08J007/04

CPC classification number: H05K3/4069 ,  H05K3/0032 ,  H05K3/20 ,  H05K3/386 ,  H05K2201/0112 ,  H05K2201/0116 ,  H05K2201/0355 ,  H05K2203/0191 ,  H05K2203/1461 ,  Y10T29/49126 ,  Y10T29/49155 ,  Y10T29/49165 ,  Y10T29/49172

Abstract: Removable mask films 303 are formed on the both sides of the substrate having the adhesive layer 302 by applying and drying a resin varnish 304 including a ultraviolet-absorbing agent, and fine through holes 306 are formed by using a third harmonics YAG solid-state laser light with a relatively short wavelength not longer than that in the ultraviolet range in such a way that the effects of such a residual strain as the conventional embodiment forming a removable mask film by a laminating process may be decreased as well as the more fine hole drilling compared with conventional embodiment using the carbon dioxide gas laser with a relatively long wavelength may be performed.