公开(公告)号：US20040231151A1

公开(公告)日：2004-11-25

申请号：US10842900

申请日：2004-05-10

Applicant: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.

Inventor： Yasuhiro Nakatani ,  Hideki Higashitani ,  Tadashi Nakamura ,  Fumio Echigo

IPC: H05K001/16 ,  H05K001/11

CPC classification number: H05K3/4614 ,  H05K1/113 ,  H05K3/4069 ,  H05K3/4652 ,  H05K2201/0195 ,  H05K2201/09045 ,  H05K2201/096 ,  H05K2201/10378 ,  H05K2203/068 ,  H05K2203/1461 ,  Y10S428/901 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T428/24917

Abstract: It is an object of the present invention to provide a multilayer circuit board, and a method for manufacturing the same, in which a plurality of circuit boards are layered, wherein as regards at least one circuit board positioned on an outer side, a conductive substance is filled into holes passing through the circuit board in the thickness direction and cured, and the wiring layers of the plurality of circuit boards are electrically connected by the conductive substance that has been cured, wherein in the multilayer circuit board, the wiring layer positioned outside the conductive substance that has been cured projects outward from its surroundings. Thus, the conductive paste is sufficiently compressed during hot pressing to yield a stable electrical connection, and thermosetting resin can be filled in between the inner layer wiring pattern without leaving gaps.

Abstract translation: 本发明的目的是提供一种层叠多个电路板的多层电路板及其制造方法，其中至少一个位于外侧的电路板，导电物质 填充穿过电路板的厚度方向的孔并固化，并且多个电路板的布线层通过已固化的导电物质电连接，其中在多层电路板中，位于外侧的布线层 已经固化的导电物质从其周围向外突出。 因此，导热膏在热压期间被充分压缩，从而产生稳定的电连接，并且可以在内层布线图案之间填充热固性树脂，而不会留下间隙。

公开(公告)号：US20040156177A1

公开(公告)日：2004-08-12

申请号：US10770775

申请日：2004-02-03

Applicant: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.

Inventor： Hideki Higashitani

IPC: H05K007/02 ,  H05K007/06 ,  H05K007/08 ,  H05K007/10

CPC classification number: H01L23/49551 ,  H01L23/3107 ,  H01L23/5387 ,  H01L24/45 ,  H01L24/48 ,  H01L25/105 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2224/451 ,  H01L2224/48091 ,  H01L2224/4824 ,  H01L2224/73215 ,  H01L2225/1035 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/18301 ,  H01L2924/19041 ,  H01L2924/00 ,  H01L2224/05599

Abstract: An electronic component package includes: at least one electronic component; a wiring provided with a terminal portion with which the electronic component is connected electrically; and a resin portion that covers at least a part of the electronic component and is for bonding the wiring. A part of the wiring extends by way of an edge of the package so as to be formed on a surface and a rear face of the package. With this configuration, wirings can be formed freely on the surface of the package without using a flexible board, and input and output terminals from the electronic component can be arranged on the surface and the rear face of the package.

Abstract translation: 电子部件封装包括：至少一个电子部件; 设置有电子部件与电连接的端子部的布线; 以及覆盖所述电子部件的至少一部分并且用于接合所述布线的树脂部。 布线的一部分通过封装的边缘延伸，以形成在封装的表面和后表面上。 通过这种结构，可以在封装的表面上自由地形成配线，而不使用柔性板，并且可以在封装的表面和背面上布置来自电子部件的输入和输出端子。

公开(公告)号：US20020029906A1

公开(公告)日：2002-03-14

申请号：US09734593

申请日：2000-12-13

Applicant: Matsushita Electric Industrial Co., Ltd.

Inventor： Fumio Echigo ,  Hideki Higashitani ,  Daizo Andoh ,  Noritake Fukuda ,  Yasuhiro Nakatani ,  Tadashi Nakamura

IPC: H05K003/36 ,  H01K003/10 ,  B23K026/00

CPC classification number: H05K3/4069 ,  H05K3/0032 ,  H05K3/20 ,  H05K3/386 ,  H05K2201/0112 ,  H05K2201/0116 ,  H05K2201/0355 ,  H05K2203/0191 ,  H05K2203/1461 ,  Y10T29/49126 ,  Y10T29/49155 ,  Y10T29/49165 ,  Y10T29/49172

Abstract: Removable mask films 303 are formed on the both sides of the substrate having the adhesive layer 302 by applying and drying a resin varnish 304 including a ultraviolet-absorbing agent, and fine through holes 306 are formed by using a third harmonics YAG solid-state laser light with a relatively short wavelength not longer than that in the ultraviolet range in such a way that the effects of such a residual strain as the conventional embodiment forming a removable mask film by a laminating process may be decreased as well as the more fine hole drilling compared with conventional embodiment using the carbon dioxide gas laser with a relatively long wavelength may be performed.

Abstract translation: 通过施加和干燥包括紫外线吸收剂的树脂清漆304在具有粘合剂层302的基板的两侧上形成可移除掩模膜303，并且通过使用第三谐波YAG固体激光器形成细小通孔306 具有比紫外线范围内的波长相对较短波长的光可以减少通过层压方法形成可去除掩模膜的这种残留应变的效果以及更细孔钻孔 与使用具有较长波长的二氧化碳气体激光器的常规实施例相比可以进行。

公开(公告)号：US20030180512A1

公开(公告)日：2003-09-25

申请号：US10397661

申请日：2003-03-26

Applicant: Matsushita Electric Industrial Co., Ltd.

Inventor： Daizou Andou ,  Toshio Sugawa ,  Tadashi Nakamura ,  Hideki Higashitani ,  Masahide Tsukamoto

IPC: B32B003/00

CPC classification number: H05K3/20 ,  H05K3/007 ,  H05K3/205 ,  H05K3/386 ,  H05K3/4069 ,  H05K3/4614 ,  H05K3/4617 ,  H05K3/462 ,  H05K3/4623 ,  H05K3/4658 ,  H05K3/4688 ,  H05K2201/0116 ,  H05K2201/0195 ,  H05K2201/10378 ,  H05K2203/0152 ,  H05K2203/0384 ,  H05K2203/061 ,  H05K2203/1461 ,  Y10S428/901 ,  Y10T29/49126 ,  Y10T29/49155 ,  Y10T29/49165 ,  Y10T428/24917 ,  Y10T428/2804

Abstract: Through holes formed in an electrical insulating substrate having adhesive layers on its both surfaces are filled with a conductor. Then, supporting bases having wiring layers with a predetermined pattern are laminated on both the surfaces of the electrical insulating substrate, which are then heated and pressurized. After that, the supporting bases are removed, thus obtaining a circuit board in which the wiring layers have been embedded in the adhesive layers. The conductor within the through holes are compressed sufficiently, thus forming minute via holes with high reliability.

公开(公告)号：US20030188428A1

公开(公告)日：2003-10-09

申请号：US10401607

申请日：2003-03-31

Applicant: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.

Inventor： Fumio Echigo ,  Hideki Higashitani ,  Daizo Andoh ,  Noritake Fukuda ,  Yasuhiro Nakatani ,  Tadashi Nakamura

IPC: H01K003/10 ,  B29C035/08 ,  C08J007/04

CPC classification number: H05K3/4069 ,  H05K3/0032 ,  H05K3/20 ,  H05K3/386 ,  H05K2201/0112 ,  H05K2201/0116 ,  H05K2201/0355 ,  H05K2203/0191 ,  H05K2203/1461 ,  Y10T29/49126 ,  Y10T29/49155 ,  Y10T29/49165 ,  Y10T29/49172

Abstract: Removable mask films 303 are formed on the both sides of the substrate having the adhesive layer 302 by applying and drying a resin varnish 304 including a ultraviolet-absorbing agent, and fine through holes 306 are formed by using a third harmonics YAG solid-state laser light with a relatively short wavelength not longer than that in the ultraviolet range in such a way that the effects of such a residual strain as the conventional embodiment forming a removable mask film by a laminating process may be decreased as well as the more fine hole drilling compared with conventional embodiment using the carbon dioxide gas laser with a relatively long wavelength may be performed.