公开(公告)号：US20040239008A1

公开(公告)日：2004-12-02

申请号：US10840958

申请日：2004-05-07

Inventor： Marc Bernard Gottlieb ,  Christian Ruepping

IPC: B29C035/08

CPC classification number: B29C71/04 ,  B29C45/0053 ,  B29C45/14336 ,  B29C45/14344 ,  B29C2035/0827 ,  B29C2045/0075 ,  B29C2045/14459 ,  B29L2031/26

Abstract: Processes for preparation of seals and gaskets using cure-in-place techniques that incorporate a molding step, which is preferably an injection molding step, are provided. The processes are useful for preparing sealing assemblies that comprise compositions that are curable by UV radiation and that are adhered to a support member.

Abstract translation: 提供了使用固化技术制备密封件和垫圈的方法，其中包括优选为注模步骤的成型步骤。 这些方法可用于制备包含可通过UV辐射固化并且粘附到支撑构件的组合物的密封组件。

公开(公告)号：US20040207124A1

公开(公告)日：2004-10-21

申请号：US10716426

申请日：2003-11-20

Inventor： Eli Kritchman ,  Hanan Gothait ,  Gershon Miller

IPC: B29C035/08

CPC classification number: B29C35/04 ,  B29C35/08 ,  B29C37/0067 ,  B29C64/112 ,  B29C64/40 ,  B29C70/68 ,  B33Y10/00 ,  B33Y30/00 ,  B33Y40/00 ,  B33Y70/00 ,  Y10T29/49885 ,  Y10T29/4998 ,  Y10T29/49982 ,  Y10T29/49993

Abstract: A method for printing and supporting a three-dimensional (3-D) object is provided. The method of printing can include dispensing a first interface material for the construction of the three-dimensional object, dispensing a second interface material to form a support structure for supporting the three-dimensional object and dispensing a third interface material which May be Used to separate the support structure from the 3-D object Disclosed also a method for producing a 3-D model containing various kinds of inserts.

Abstract translation: 提供了一种用于打印和支持三维（3-D）物体的方法。 打印方法可以包括分配用于构建三维物体的第一界面材料，分配第二界面材料以形成用于支撑三维物体的支撑结构，并且分配可用于分离的第三界面材料 来自3-D物体的支撑结构还公开了一种包含各种插入物的3-D模型的制造方法。

公开(公告)号：US20040201139A1

公开(公告)日：2004-10-14

申请号：US10835164

申请日：2004-04-29

Applicant: Phonak AG

Inventor： Christoph Widmer ,  Joydeep Dutta

IPC: B29C035/08

CPC classification number: A61F11/008 ,  B29C64/135 ,  B29C64/153 ,  B29C64/165 ,  B29L2031/753 ,  B33Y10/00 ,  B33Y80/00 ,  H04R25/658

Abstract: A method for manufacturing ear devices that are individualized for individual. Data of the three-dimensional shape of each individual's area of application for a haring device is provided. Individual shells for the hearing devices are construed by respectively depositing commonly a layer of one of a fluid and a powderous material and solidifying by a laser arrangement in the layer individually shaped layers of the individual shells, thereby controlling the laser arrangement with the data.

Abstract translation: 用于个人化的耳机的制造方法。 提供了每个人个人应用场合的三维形状的数据。 用于听力装置的单独的壳通过分别通过流体和粉末材料之一分别沉积并通过激光装置固化在单独壳的单独成形层中，从而控制与数据的激光布置。

公开(公告)号：US20040150141A1

公开(公告)日：2004-08-05

申请号：US10758423

申请日：2004-01-16

Inventor： Chih-Yu Chao ,  Wen-Jiunn Hsieh ,  Ta-Kang Chen ,  Wen-Tse Tseng

IPC: B29C035/08 ,  B05D005/12 ,  B29C059/02 ,  B29C071/04 ,  B29C071/02 ,  B05D003/12

CPC classification number: G02F1/13378 ,  B29C35/02 ,  B29C59/026 ,  B29C2035/0827 ,  B29C2059/023 ,  G02F2001/133765

Abstract: A method for forming a non-rubbing alignment film is provided. A polymer film is formed on a substrate. A plurality of microgroove structure is then formed on the surface of the polymer film by the molecular imprint method to prevent electrostatic damage and micro particle contamination produced by the conventional rubbing method.

Abstract translation: 提供了一种形成非摩擦取向膜的方法。 在基板上形成聚合物膜。 然后通过分子印迹法在聚合物膜的表面上形成多个微槽结构，以防止由常规摩擦方法产生的静电损伤和微粒污染。

公开(公告)号：US20040140578A1

公开(公告)日：2004-07-22

申请号：US10724677

申请日：2003-12-01

Inventor： William Michael Kelly ,  Allen Gilliard ,  George Burnett ,  John Michael Dilworth

IPC: B29D011/00 ,  B29C035/08

CPC classification number: B29D11/00134 ,  B29C35/0888 ,  B29C2035/0827 ,  B29D11/023 ,  B29L2011/0041 ,  Y10S425/808

Abstract: A system and method for forming a polymeric molding. A mold component includes a transmissive portion for passing curing energy such as UV light into the mold cavity. A masking collar is engaged around the transmissive portion to block curing energy from exposing and curing polymeric material outside of the region underlying the transmissive portion.

Abstract translation: 一种用于形成聚合物模制品的系统和方法。 模具部件包括用于将诸如UV光的固化能量传递到模腔中的透射部分。 屏蔽套环围绕透射部分接合以阻挡固化能量，以在透射部分下方的区域外暴露和固化聚合物材料。

公开(公告)号：US20040124566A1

公开(公告)日：2004-07-01

申请号：US10194991

申请日：2002-07-11

Inventor： Sidlgata V. Sreenivasan ,  Byung J. Choi ,  Norman E. Shumaker ,  Ronald D. Voisin ,  Michael P.C. Watts

IPC: B29C035/08

CPC classification number: B81C1/0046 ,  B82Y10/00 ,  B82Y30/00 ,  B82Y40/00 ,  G03F7/0002

Abstract: Described are methods for patterning a substrate by imprint lithography. Imprint lithography is a process in which a liquid is dispensed onto a substrate. A template is brought into contact with the liquid and the liquid is cured. The cured liquid includes an imprint of any patterns formed in the template. In one embodiment, the imprint process is designed to imprint only a portion of the substrate. The remainder of the substrate is imprinted by moving the template to a different portion of the template and repeating the imprint lithography process.

Abstract translation: 描述了通过压印光刻图案化衬底的方法。 压印光刻是将液体分配到基板上的过程。 使模板与液体接触并且液体被固化。 固化液体包括在模板中形成的任何图案的印记。 在一个实施例中，压印工艺被设计成仅印刷基板的一部分。 通过将模板移动到模板的不同部分并重复压印光刻工艺来印刷衬底的其余部分。

公开(公告)号：US20040077745A1

公开(公告)日：2004-04-22

申请号：US10273357

申请日：2002-10-18

Inventor： Jigeng Xu

IPC: B29C035/08 ,  B29C041/02 ,  C08G065/00

CPC classification number: C08F290/062 ,  B33Y10/00 ,  B33Y70/00 ,  C08F283/10 ,  C08F289/00 ,  C09D151/08 ,  Y10T428/31511 ,  C08L2666/02

Abstract: The present invention provides curable compositions and rapid prototyping processes using the same. In one embodiment, the present compositions include one or more aromatic epoxies and one or more aliphatic epoxies, and, after full cure, exhibit a heat deflection temperature of at least 105null C. and an elongation at break of at least 1.5%.

Abstract translation: 本发明提供了可固化组合物和使用其的快速成型方法。 在一个实施方案中，本发明的组合物包括一种或多种芳族环氧化物和一种或多种脂族环氧化物，并且在完全固化后，显示至少105℃的热变形温度和至少1.5％的断裂伸长率。

公开(公告)号：US20040061260A1

公开(公告)日：2004-04-01

申请号：US10675885

申请日：2003-09-29

Applicant: EOS GmbH Electro Optical Systems

Inventor： Martin Heugel

IPC: B29C035/08 ,  B29C041/02

CPC classification number: B29C64/153 ,  B33Y30/00 ,  H01S3/0804 ,  H01S3/08045 ,  H01S3/0805 ,  H01S3/106

Abstract: A device and a method for the layer-by-layer generative manufacturing of three-dimensional objects by selective hardening of a previously applied layer by means of laser radiation, wherein a laser (1) contains a switching device (8) for changing the modal composition of the laser radiation. By changing the modal composition of the radiation during the selective hardening of a layer, the focussing features (nullfocusabilitynull) of the radiation is increased in areas (25), in which high structural accuracy is required. In the remaining areas to be illuminated, the required illumination time is reduced by increasing the intensity of the radiation.

Abstract translation: 一种用于通过激光辐射选择性硬化先前施加的层来逐层生成三维物体的装置和方法，其中激光器（1）包含用于改变模态的切换装置（8） 激光辐射的组成。 通过在层的选择性硬化期间改变辐射的模态组成，在需要高结构精度的区域（25）中增加了辐射的聚焦特征（“聚焦性”）。 在待照亮的其余区域中，通过增加辐射强度来降低所需的照明时间。

公开(公告)号：US20040033424A1

公开(公告)日：2004-02-19

申请号：US10222734

申请日：2002-08-15

Inventor： Albert Alec Talin ,  Jeffrey H. Baker ,  William J. Dauksher ,  Andy Hooper ,  Douglas J. Resnick

IPC: G03F001/08 ,  C23C014/34 ,  G02B001/12 ,  B29D011/00 ,  B29C035/08

CPC classification number: B82Y10/00 ,  B82Y40/00 ,  C23C14/086 ,  G03F7/0002 ,  G03F7/0017 ,  G03F7/093

Abstract: This invention relates to semiconductor devices, microelectronic devices, micro electro mechanical devices, microfluidic devices, photonic devices, and more particularly to a lithographic template, a method of forming the lithographic template and a method for forming devices with the lithographic template. The lithographic template (10) is formed having a substrate (12), a transparent conductive layer (16) formed on a surface (14) of the substrate (12) by low pressure sputtering to a thickness that allows for preferably 90% transmission of ultraviolet light therethrough, and a patterning layer (20) formed on a surface (18) of the transparent conductive layer (16). The template (10) is used in the fabrication of a semiconductor device (30) for affecting a pattern in device (30) by positioning the template (10) in close proximity to semiconductor device (30) having a radiation sensitive material formed thereon and applying a pressure to cause the radiation sensitive material to flow into the relief image present on the template. Radiation is then applied through the template so as to cure portions of the radiation sensitive material and define the pattern in the radiation sensitive material. The template (10) is then removed to complete fabrication of semiconductor device (30).

Abstract translation: 本发明涉及半导体器件，微电子器件，微电子机械器件，微流体器件，光子器件，更具体地涉及光刻模板，形成光刻模板的方法和用光刻模板形成器件的方法。 光刻模板（10）形成为具有基板（12），通过低压溅射形成在基板（12）的表面（14）上的透明导电层（16）至允许优选90％透射率的厚度 紫外光，以及形成在透明导电层（16）的表面（18）上的图形层（20）。 模板（10）用于通过将模板（10）定位成紧邻其上形成有辐射敏感材料的半导体器件（30）而影响器件（30）中的图案的半导体器件（30）的制造，以及 施加压力以使辐射敏感材料流入存在于模板上的浮雕图像。 然后通过模板施加辐射，以便固化辐射敏感材料的部分并限定辐射敏感材料中的图案。 然后移除模板（10）以完成半导体器件（30）的制造。

公开(公告)号：US20040018107A1

公开(公告)日：2004-01-29

申请号：US10610622

申请日：2003-06-30

Inventor： Behrokh Khoshnevis

IPC: B29C035/08 ,  B29C041/02 ,  B22F007/02

CPC classification number: B22F3/008 ,  B22F2998/10 ,  B22F2999/00 ,  B33Y10/00 ,  B33Y30/00 ,  B33Y40/00 ,  B33Y70/00 ,  B33Y80/00 ,  B22F3/004 ,  B22F3/02 ,  B22F2003/1046

Abstract: A selective inhibition of sintering (SIS) technique may be used to fabricate a three-dimensional (3-D) dense metal object from a binderless metal powder. A number of layers of metal powder are provided on a build tank. For each layer, regions of the layer are sinter-inhibited, e.g., by depositing a sinter-inhibiting material such as a ceramic slurry, a metal salt, or oxidizing metal particles in the powder using chemicals or a concentrated heat source. Each layer may be compacted before the next layer is provided. A final compact may then be sintered. Unwanted sintered sections may be removed from the compact at boundaries formed by the sinter-inhibited (unsintered) regions, and the object extracted.

Abstract translation: 可以使用选择性抑制烧结（SIS）技术从无粘合剂金属粉末制造三维（3-D）致密金属物体。 在建造罐上提供了多层金属粉末。 对于每个层，例如通过使用化学品或浓缩热源在粉末中沉积诸如陶瓷浆料，金属盐或氧化性金属颗粒的烧结抑制材料来对该层的区域进行烧结抑制。 在提供下一层之前，每个层可以被压实。 然后可以烧结最终的压块。 可以在由烧结体抑制（未烧结）区域形成的边界处，从压块中去除不需要的烧结部分，并提取物体。