Method for developing resist, method for forming a resist pattern, method for producing a mold, and developing fluid utilized in these methods
    3.
    发明授权
    Method for developing resist, method for forming a resist pattern, method for producing a mold, and developing fluid utilized in these methods 有权
    用于形成抗蚀剂的方法,用于形成抗蚀剂图案的方法,用于制造模具的方法和在这些方法中使用的显影液

    公开(公告)号:US09417530B2

    公开(公告)日:2016-08-16

    申请号:US14497616

    申请日:2014-09-26

    摘要: A method for developing a non chemically amplified resist employs a developing fluid having a carboxylic acid compound, which is a carboxylic acid ester having branched chain alkyl groups and a total carbon number of 8 or greater, as a main component. It is particularly preferable for the carboxylic acid compound to be at least one of isobutyl butyrate, butyl isobutyrate, isobutyl isobutyrate, isoamyl isobutyrate, and 2-methylbutyrate 2-methylbutyl. It is also preferable for the non chemically amplified resist to be a resist having a copolymer of an α-chloroacrylate ester compound and an α-methylstyrene compound as a main component.

    摘要翻译: 用于开发非化学放大抗蚀剂的方法采用具有羧酸化合物的显影液,其是具有支链烷基和总碳数为8以上的羧酸酯作为主要成分。 特别优选羧酸化合物为丁酸异丁酯,异丁酸丁酯,异丁酸异丁酯,异丁酸异戊酯和2-甲基丁酸2-甲基丁酯中的至少一种。 非化学放大型抗蚀剂也优选为具有α-氯代丙烯酸酯化合物和α-甲基苯乙烯化合物的共聚物作为主要成分的抗蚀剂。

    METHODS OF FORMING INSULATION LAYER STRUCTURES AND METHODS OF MANUFACTURING METAL INTERCONNECTIONS
    6.
    发明申请
    METHODS OF FORMING INSULATION LAYER STRUCTURES AND METHODS OF MANUFACTURING METAL INTERCONNECTIONS 审中-公开
    形成绝缘层结构的方法和制造金属互连的方法

    公开(公告)号:US20150241780A1

    公开(公告)日:2015-08-27

    申请号:US14607252

    申请日:2015-01-28

    IPC分类号: G03F7/20 G03F7/30

    摘要: In a method of an insulation layer structure, a first photosensitive layer is formed on a substrate. The first photosensitive layer is partially exposed to form a first pattern and a second pattern. The second pattern includes silicon oxide. A second photosensitive layer is formed on the second pattern. The second photosensitive layer is partially exposed to form a third pattern and a fourth pattern. The fourth pattern includes silicon oxide. The first pattern is removed by performing a first developing process. The third pattern is removed by performing a second developing process.

    摘要翻译: 在绝缘层结构的方法中,在基板上形成第一感光层。 第一感光层部分地暴露以形成第一图案和第二图案。 第二图案包括氧化硅。 第二感光层形成在第二图案上。 第二感光层被部分曝光以形成第三图案和第四图案。 第四图案包括氧化硅。 通过执行第一显影过程来去除第一图案。 通过执行第二显影过程来去除第三图案。

    Templates for use in imprint lithography and related intermediate template structures
    10.
    发明授权
    Templates for use in imprint lithography and related intermediate template structures 有权
    用于压印光刻和相关中间模板结构的模板

    公开(公告)号:US08657597B2

    公开(公告)日:2014-02-25

    申请号:US12839755

    申请日:2010-07-20

    IPC分类号: A01J21/00

    摘要: A method of forming a template for use in imprint lithography. The method comprises providing an ultraviolet (“UV”) wavelength radiation transparent layer and forming a pattern in the UV transparent layer by photolithography. The pattern may be formed by anisotropically etching the UV transparent layer and may have feature dimensions of less than approximately 100 nm, such as dimensions of less than approximately 45 nm. An additional embodiment of the method comprises providing a UV opaque layer comprising a first pattern therein, forming a first UV transparent layer in contact with the first pattern of the UV opaque layer, forming a second UV transparent layer in contact with the first UV transparent layer, and removing the UV opaque layer to form the template. An intermediate template structure for use in imprint lithography is also disclosed. In other embodiments, a template that is opaque to UV wavelength radiation and a method of forming the same are disclosed.

    摘要翻译: 形成用于压印光刻的模板的方法。 该方法包括提供紫外(“UV”)波长辐射透明层并通过光刻在UV透明层中形成图案。 图案可以通过各向异性蚀刻UV透明层而形成,并且可以具有小于约100nm的特征尺寸,例如小于约45nm的尺寸。 该方法的另外的实施例包括提供包括其中的第一图案的UV不透明层,形成与UV不透明层的第一图案接触的第一UV透明层,形成与第一UV透明层接触的第二UV透明层 ,并除去UV不透明层以形成模板。 还公开了用于压印光刻的中间模板结构。 在其它实施例中,公开了对UV波长辐射不透明的模板及其形成方法。