Method for reducing propellant curing residual stress by high-energy acoustic beam

    公开(公告)号:US11814331B2

    公开(公告)日:2023-11-14

    申请号:US16751731

    申请日:2020-01-24

    IPC分类号: C06B21/00 B29C35/08

    摘要: The present disclosure is related to the technical field of propellant performance research, and in particular, to a method for reducing propellant curing residual stress by a high-energy acoustic beam. The method includes the following steps: injecting a propellant slurry into a curing container and waiting for the propellant slurry to start curing; actuating, when the propellant slurry starts curing, a high-energy acoustic beam generator and a high-energy acoustic beam transducer to continuously emit high-energy acoustic beam to the propellant slurry in the curing container until the propellant slurry is cured to form a propellant grain; and closing the high-energy acoustic beam generator and the high-energy acoustic beam transducer. The method for reducing propellant curing residual stress by high-energy acoustic beam provided in the present disclosure can reduce residual stress inside the propellant in an effective manner, thereby ensuring operation safety of the aerospace equipment.

    IMPRINT APPARATUS, IMPRINT METHOD, AND ARTICLE MANUFACTURING METHOD

    公开(公告)号:US20180253001A1

    公开(公告)日:2018-09-06

    申请号:US15906286

    申请日:2018-02-27

    发明人: Yuji Sakata

    摘要: An imprint apparatus performs imprint processing of supplying a second composition having a property of being cured onto a substrate to which a first composition not having a property of being cured in an uncured state is supplied, bringing a mold into contact with a mixed layer of the first composition and the second composition, which is formed by the supplying, curing the mixed layer, separating the mold from the cured mixed layer, and forming a pattern on the mixed layer. When unloading the substrate outside the apparatus before completion of the imprint processing for all shot regions of the substrate, the apparatus supplies the second composition to a portion on the substrate in which the first composition is in an uncured state and performs curing processing of curing the mixed layer formed in the portion before the unloading.