TECHNIQUE FOR DYNAMIC LENGTH COMPENSATION
    2.
    发明公开

    公开(公告)号:US20240326317A1

    公开(公告)日:2024-10-03

    申请号:US18699624

    申请日:2022-10-07

    发明人: Juergen GRETSCHER

    IPC分类号: B29C59/02 B29C59/00

    CPC分类号: B29C59/022 B29C59/002

    摘要: A device for dynamic length compensation when embossing a film strip includes: an embossing point; a roller for slip-free transport of the film strip; and a guide channel arranged between the embossing point and the roller. The guide channel has a guide surface movable between a first position and a second position. A path length of the film strip between the roller and the embossing point in the first position of the guide surface is greater than a path length of the film strip between the roller and the embossing point in the second position. The film strip, in the first position of the guide surface in the guide channel, is conveyed from the roller to the embossing point. The guide surface is moved from the first position to the second position during the embossing of the film strip.

    Method and tool for embossing
    4.
    发明授权

    公开(公告)号:US12030236B2

    公开(公告)日:2024-07-09

    申请号:US17255448

    申请日:2019-07-01

    发明人: Jan Jäderberg

    IPC分类号: B29C59/00 B29C59/02 B29D11/00

    摘要: The present disclosure relates to a method for embossing a plastic sheet and a corresponding tool (1). The plastic sheet is pressed between first and second tool halves (3, 5) while being heated such that a pattern is imprinted on first and second faces (19, 21) of the plastic sheet. Reference marks (31, 33) are imprinted on both faces of the plastic sheet and the embossed plastic sheet is evaluated optically to determine error data based on the relative position of the first and second reference marks. This allows to adjust the embossing tool based on the error data for subsequent embossing operations.

    NANOFABRICATION METHOD WITH CORRECTION OF DISTORTION WITHIN AN IMPRINT SYSTEM

    公开(公告)号:US20240066786A1

    公开(公告)日:2024-02-29

    申请号:US17823411

    申请日:2022-08-30

    IPC分类号: B29C59/00 B29C59/02 B82Y40/00

    摘要: A nanofabrication method comprises receiving information regarding in-plane distortion of a substrate, modeling target out-of-plane displacement as a summation of a plurality of geometric modes represented by a linear combination of basis functions, generating a first drop pattern of formable material based on the modeled out-of-plane displacement, generating a second drop pattern by merging the first drop pattern with a drop pattern based on a topography of the template and the substrate; dispensing drops of formable material onto the substrate according to the second drop pattern, and contacting the dispensed drops with the template to form a film. The plurality of geometric modes are modified using a plurality of unique predetermined correction coefficients. Each unique predetermined correction coefficient represents a relationship between an analytically determined amount of in-plane distortion and an empirically determined amount of in-plane distortion.

    IMPRINT DEVICE, IMPRINT METHOD, ARTICLE MANUFACTURING METHOD, AND STORAGE MEDIUM

    公开(公告)号:US20230390993A1

    公开(公告)日:2023-12-07

    申请号:US18300538

    申请日:2023-04-14

    发明人: HIROYUKI MATSUDA

    摘要: The present invention is to provide an imprint device that can form a circuit pattern with high accuracy even if a deviation occurs in a positional relationship between the circuit pattern and an alignment mark. The imprint device performs an imprinting process in which a mold on which a pattern is formed is brought in contact with an imprint material on a substrate and the pattern is transferred to the substrate at a target position on the substrate, and includes an alignment unit that performs alignment of the mold with the substrate such that the mold and the substrate are at an alignment position corrected based on an amount of relative positional deviation between a pattern mark formed near the pattern of the mold and an alignment mark of the mold obtained by measuring the pattern mark and the alignment mark, and a curing unit that cures the imprint material at the position at which alignment is performed by the alignment unit.

    IMPRINT APPARATUS, IMPRINT METHOD AND ARTICLE MANUFACTURING METHOD

    公开(公告)号:US20230321895A1

    公开(公告)日:2023-10-12

    申请号:US18194942

    申请日:2023-04-03

    发明人: Takehiko UENO

    IPC分类号: B29C59/00 B29C59/02

    摘要: An imprint apparatus including a mold deformation mechanism configured to deform a mold by applying a pressure to the mold, a substrate deformation mechanism configured to deform the substrate by applying a pressure to the substrate, a measurement unit configured to measure a deformation amount of the mold and a deformation amount of the substrate during separating the mold from the cured imprint material on the substrate, and a control unit configured to control, during the separating, a pressure to be applied to the mold by the mold deformation mechanism and a pressure to be applied to the substrate by the substrate deformation mechanism based on the deformation amounts measured by the measurement unit such that a difference between the deformation amount of the mold and the deformation amount of the substrate falls within an allowable range.