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公开(公告)号:US20230321895A1
公开(公告)日:2023-10-12
申请号:US18194942
申请日:2023-04-03
发明人: Takehiko UENO
CPC分类号: B29C59/002 , B29C59/022 , B29C59/026
摘要: An imprint apparatus including a mold deformation mechanism configured to deform a mold by applying a pressure to the mold, a substrate deformation mechanism configured to deform the substrate by applying a pressure to the substrate, a measurement unit configured to measure a deformation amount of the mold and a deformation amount of the substrate during separating the mold from the cured imprint material on the substrate, and a control unit configured to control, during the separating, a pressure to be applied to the mold by the mold deformation mechanism and a pressure to be applied to the substrate by the substrate deformation mechanism based on the deformation amounts measured by the measurement unit such that a difference between the deformation amount of the mold and the deformation amount of the substrate falls within an allowable range.