公开(公告)号：US09661743B1

公开(公告)日：2017-05-23

申请号：US14565247

申请日：2014-12-09

Applicant: Multek Technologies Ltd.

Inventor： Mark Bergman ,  Joan K. Vrtis

IPC: H05K1/00 ,  H05K1/02 ,  H05K3/46 ,  H05K1/03 ,  H05K1/09

CPC classification number: H01M6/40 ,  A41D1/002 ,  A41D1/005 ,  D05B17/00 ,  H01M2/08 ,  H01M6/12 ,  H01M10/0436 ,  H01R4/00 ,  H01R4/02 ,  H01R4/029 ,  H01R43/005 ,  H01R43/02 ,  H01R43/0235 ,  H05K1/0271 ,  H05K1/0296 ,  H05K1/0298 ,  H05K1/0306 ,  H05K1/0366 ,  H05K1/0373 ,  H05K1/038 ,  H05K1/0393 ,  H05K1/09 ,  H05K1/11 ,  H05K1/111 ,  H05K1/112 ,  H05K1/115 ,  H05K1/18 ,  H05K1/181 ,  H05K1/189 ,  H05K3/284 ,  H05K3/30 ,  H05K3/305 ,  H05K3/32 ,  H05K3/4015 ,  H05K3/42 ,  H05K3/4644 ,  H05K7/02 ,  H05K9/009 ,  H05K13/04 ,  H05K2201/0154 ,  H05K2201/0158 ,  H05K2201/0162 ,  H05K2201/0287 ,  H05K2201/05 ,  H05K2201/09418 ,  H05K2201/09818

Abstract: A flexible circuit board includes a center “rigid” section, such as a printed circuit stack, and an adjoining flexible multi-layer body that are fabricated from a common interconnect layer. A transition material is included at the interface between the center rigid section and the flexible multi-layer body to minimize ripping and cracking of the interconnect layer. The transition material can also be added at stress areas not related to the interface. The transition material is attached at the interface and stress areas of the flexible circuit board in order to strengthen the flexible circuit board in general and in particular the transition material included therein. The transition material layer is formed and deposited at one or more locations on or within the flexible circuit board in order to minimize, reduce, if not prevent cracking and ripping of the flexible circuit board as it is bent, flexed and/or twisted.

公开(公告)号：US20150059971A1

公开(公告)日：2015-03-05

申请号：US14101766

申请日：2013-12-10

Applicant: TIANJIN FUNAYUANCHUANG TECHNOLOGY CO.,LTD.

Inventor： HO-CHIEN WU

IPC: H05K3/46 ,  B32B38/00 ,  B32B37/24 ,  B32B37/12

CPC classification number: B32B37/1284 ,  B32B38/0004 ,  B32B38/0008 ,  B32B38/145 ,  B32B2037/243 ,  B32B2310/0831 ,  B32B2310/0843 ,  B32B2457/208 ,  G06F3/044 ,  G06F2203/04103 ,  G06F2203/04112 ,  H05K1/09 ,  H05K1/16 ,  H05K2201/026 ,  H05K2201/0281 ,  H05K2201/0287 ,  H05K2201/0323 ,  H05K2201/10053 ,  Y10T156/10 ,  Y10T156/1052

Abstract: A method for making a touch panel is provided. A number of first transparent conductive layers are formed on an insulative substrate. Each of the first transparent conductive layers is resistance anisotropy. A number of first electrodes and a first conductive trace are formed corresponding to each first transparent conductive layer. An adhesive layer is formed on the insulative substrate to cover the first transparent conductive layers. A carbon nanotube layer is formed on the adhesive layer. The carbon nanotube layer is patterned to obtain a number of second transparent conductive layers spaced from each other and with each corresponding to one first transparent conductive layer. A number of second electrode and a second conductive trace are formed corresponding to each second transparent conductive layer.

Abstract translation: 提供了制造触摸面板的方法。 在绝缘基板上形成多个第一透明导电层。 每个第一透明导电层是电阻各向异性。 形成对应于每个第一透明导电层的多个第一电极和第一导电迹线。 在绝缘基板上形成粘合层以覆盖第一透明导电层。 在粘合剂层上形成碳纳米管层。 对碳纳米管层进行构图以获得彼此间隔开的多个第二透明导电层，并且分别对应于一个第一透明导电层。 对应于每个第二透明导电层形成多个第二电极和第二导电迹线。

公开(公告)号：US6016598A

公开(公告)日：2000-01-25

申请号：US73143

申请日：1998-05-05

Applicant: Erik Middelman ,  Pieter Hendrik Zuuring

Inventor： Erik Middelman ,  Pieter Hendrik Zuuring

IPC: H05K3/38 ,  H05K3/46 ,  H05K3/36

CPC classification number: H05K3/4655 ,  H05K2201/0195 ,  H05K2201/0287 ,  H05K2203/0759 ,  H05K3/386 ,  H05K3/4652 ,  Y10S428/901 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49155 ,  Y10T29/49163

Abstract: A process for manufacturing a multi-layer printed wire board, also referred to as a multilayer, comprising at least two electrically insulating substrates with electrically conductive traces or layers provided on at least three surfaces thereof, in which process, by means of lamination under pressure, a cured basic substrate based on a UD-reinforced synthetic material, provided on either side with traces, is combined with and bonded to a back-up substrate, wherein during the laminating process the back-up substrate is added to the basic substrate, the base substrate and the back-up substrate comprising a UD-reinforced cured core layer, the base substrate having been provided at least on the side facing the back-up substrate with a still plastically deformable (flowable) adhesive layer, and such a pressure is exerted on the laminate as to bring said back-up substrate into contact or practically into contact with the conducting traces of the basic substrate, and the space between these traces is filled with the adhesive material, so bonding the basic substrate and the back-up substrate.

Abstract translation: 一种也称为多层的多层印刷线路板的制造方法，其包括至少两个电绝缘基板，其中至少三个表面设置有导电迹线或层，其中通过压力层压 基于UD增强的合成材料的固化的基底基材在两侧设置有痕迹，与备用基板结合并结合到支撑基板上，其中在层压工艺期间将支撑基板添加到基板， 所述基底基板和所述支撑基板包括UD增强的固化核心层，所述基底基板至少设置在面向所述支撑基板的一侧上，具有可塑性可变形（可流动的）粘合剂层，并且这种压力 施加在层压板上，以使所述备用基板与基本基板的导电迹线接触或实际上接触，并且这些t 种种填充有粘合剂材料，因此粘合基础基材和支撑基材。

公开(公告)号：US5752550A

公开(公告)日：1998-05-19

申请号：US768137

申请日：1996-12-17

Applicant: Diego A. Scari' ,  Marco Scari'

Inventor： Diego A. Scari' ,  Marco Scari'

IPC: D03D15/12 ,  D03D15/00 ,  D03D19/00 ,  H05K1/03

CPC classification number: H05K1/0366 ,  D03D15/0011 ,  D03D19/00 ,  H05K2201/0287 ,  H05K2201/029 ,  Y10S428/901 ,  Y10T442/102 ,  Y10T442/3065 ,  Y10T442/3309

Abstract: A unidirectional fabric produced with a continuous glass yarn which is twisted, plied or has zero twisting turns, with different gram weights. Interlacings of thin glass binding yarns for stabilizing the fabric extend warpwise to engage weft yarns in a leno interweaving. The fabric is used in the manufacture of printed circuits and in industrial applications.

Abstract translation: 用连续的玻璃纱线制成的单向织物，其以不同的克重为扭曲，合股或零捻。 用于稳定织物的薄玻璃粘合纱线的交织在纬纱上延伸以接合纱罗交织中的纬纱。 该布料用于制造印刷电路和工业应用。

公开(公告)号：US5496613A

公开(公告)日：1996-03-05

申请号：US157038

申请日：1993-12-02

Applicant: Erik Middelman ,  Pieter H. Zuuring

Inventor： Erik Middelman ,  Pieter H. Zuuring

IPC: B32B5/12 ,  B32B7/12 ,  H05K1/03 ,  H05K3/00 ,  B32B9/00

CPC classification number: H05K1/0366 ,  B32B5/12 ,  H05K1/036 ,  H05K2201/0236 ,  H05K2201/0287 ,  Y10T428/24058 ,  Y10T428/24124 ,  Y10T428/24917 ,  Y10T442/656

Abstract: A laminate, adapted to be used as a supporting board for a printed circuit, is disclosed which comprises layers of an electrically non-conductive matrix material reinforced with unidirectionally (UD) oriented fibers with the layers comprising individual matrix material having different directions of orientation. The layers are stacked to form a laminate of crossing layers, and the laminate has a core plane relative to which the crossing layers are in mirror image relationship so that the laminate has orthotropic properties. The laminate comprises layers of adhesive material present at least between any pair of layers of UD-reinforced matrix material having different directions of orientation.

Abstract translation: PCT No.PCT / EP92 / 01132 Sec。 371日期1993年12月2日第 102（e）日期1993年12月2日PCT提交1992年5月19日PCT公布。 WO92 / 22191 PCT出版物 公开了一种适于用作印刷电路的支撑板的层压板，其包括用单向（UD）定向纤维增强的非导电基体材料层，其中所述层包括单独的基体 材料具有不同的取向方向。 层叠以形成交叉层的层压体，并且层压体具有相对于其交叉层呈镜像关系的芯平面，使得层压体具有正交各向异性。 层压体包括至少存在于具有不同取向方向的任何一对UD增强基体材料层之间的粘合剂材料层。

公开(公告)号：US5376326A

公开(公告)日：1994-12-27

申请号：US398344

申请日：1989-08-23

Applicant: Jonas Medney ,  Fred E. Klimpl

Inventor： Jonas Medney ,  Fred E. Klimpl

IPC: B32B15/08 ,  B29B15/10 ,  B29B15/12 ,  B29C53/56 ,  B29C53/58 ,  B29C53/76 ,  B29C53/80 ,  B29C70/06 ,  B29C70/10 ,  B29C70/16 ,  B29C70/20 ,  B29C70/34 ,  B29K105/08 ,  B29L9/00 ,  B29L31/34 ,  B32B5/12 ,  B32B5/28 ,  C08J5/24 ,  H05K1/02 ,  H05K1/03 ,  H05K3/00 ,  H05K3/36 ,  H05K3/46 ,  B29C45/16 ,  B29C45/14 ,  B32B17/04

CPC classification number: B29C70/347 ,  B29C53/564 ,  B29C53/58 ,  B29C53/76 ,  B29C53/8016 ,  B29C70/202 ,  H05K1/0366 ,  H05K3/4626 ,  B29C2793/009 ,  B29C53/821 ,  B29L2031/3425 ,  H05K2201/0145 ,  H05K2201/0278 ,  H05K2201/0287 ,  H05K2203/085 ,  H05K2203/1327 ,  H05K3/0047 ,  Y10S428/901 ,  Y10T29/49158 ,  Y10T29/49176 ,  Y10T428/24074

Abstract: A method for making a multilayered printed circuit board including the steps of arranging two plates in spaced relation, arranging a perimetral seal between the two plates with an upper opening in the seal to form an upwardly open chamber, placing a plurality of printed circuit boards between the plates in spaced relation to one another, placing the chamber under vacuum, injecting a settable matrix material into the chamber, compressing the end plates towards one another to achieve the desired outer dimensions of the board, and curing the settable matrix material.

Abstract translation: 一种制造多层印刷电路板的方法，包括以两个间隔布置的方式布置两个板的步骤：在两个板之间设置一个上开口的周边密封，以形成向上敞开的室，将多个印刷电路板放置在 板彼此间隔开，将室放置在真空下，将可固化的基质材料注入到室中，将端板彼此压缩以实现板的期望的外部尺寸，并固化可固化的基体材料。

公开(公告)号：US4943334A

公开(公告)日：1990-07-24

申请号：US907863

申请日：1986-09-15

Applicant: Jonas Medney ,  Fred E. Klimpl

Inventor： Jonas Medney ,  Fred E. Klimpl

IPC: B32B15/08 ,  B29B15/10 ,  B29B15/12 ,  B29C53/56 ,  B29C53/58 ,  B29C53/76 ,  B29C53/80 ,  B29C70/06 ,  B29C70/10 ,  B29C70/16 ,  B29C70/20 ,  B29C70/34 ,  B29K105/08 ,  B29L9/00 ,  B29L31/34 ,  B32B5/12 ,  B32B5/28 ,  C08J5/24 ,  H05K1/02 ,  H05K1/03 ,  H05K3/00 ,  H05K3/36 ,  H05K3/46

CPC classification number: B29C70/347 ,  B29C53/564 ,  B29C53/58 ,  B29C53/76 ,  B29C53/8016 ,  B29C70/202 ,  H05K1/0366 ,  H05K3/4626 ,  B29C2793/009 ,  B29C53/821 ,  B29L2031/3425 ,  H05K2201/0145 ,  H05K2201/0278 ,  H05K2201/0287 ,  H05K2203/085 ,  H05K2203/1327 ,  H05K3/0047 ,  Y10S428/901 ,  Y10T29/49158 ,  Y10T29/49176 ,  Y10T428/24074

Abstract: A warp-free laminate is produced by winding a first set of strands or filaments about a flat mandrel with a second set of strands being wound transverse to the first set. The two sets may be perpendicular to each other. The filaments are maintained under a controlled tension while being impregnated with a resin and during subsequent cure of the resin. In order to permit the formation of a warp-free product, the winding pattern is such that it forms a mirror image about a neutral axis or plane of symmetry. The winding pattern may be chosen to provide interstices in a predetermined pattern permitting punching out or high speed drilling of hole openings for subsequent printed circuit applications.

Abstract translation: 通过在第一组横向缠绕第二组股线的情况下围绕扁平心轴缠绕第一组股线或细丝来生产无翘曲的层压体。 两组可以彼此垂直。 将长丝保持在可控制的张力下，同时用树脂浸渍并在随后的树脂固化期间。 为了允许形成无翘曲的产品，卷绕图案使得其形成关于中性轴或对称平面的镜像。 卷绕图案可以被选择成以预定图案提供间隙，允许冲孔或高速钻孔用于随后的印刷电路应用。

公开(公告)号：US09872383B1

公开(公告)日：2018-01-16

申请号：US14266636

申请日：2014-04-30

Applicant: Flextronics AP, LLC

Inventor： Weifeng Liu ,  Anwar Mohammed ,  Zhen Feng

IPC: H05K1/00 ,  H05K1/03 ,  H01R4/00 ,  D05B17/00 ,  H01R4/02 ,  H01R43/02 ,  H05K1/18 ,  H05K9/00

CPC classification number: H01M6/40 ,  A41D1/002 ,  A41D1/005 ,  D05B17/00 ,  H01M2/08 ,  H01M6/12 ,  H01M10/0436 ,  H01R4/00 ,  H01R4/02 ,  H01R4/029 ,  H01R43/005 ,  H01R43/02 ,  H01R43/0235 ,  H05K1/0271 ,  H05K1/0296 ,  H05K1/0298 ,  H05K1/0306 ,  H05K1/0366 ,  H05K1/0373 ,  H05K1/038 ,  H05K1/0393 ,  H05K1/09 ,  H05K1/11 ,  H05K1/111 ,  H05K1/112 ,  H05K1/115 ,  H05K1/18 ,  H05K1/181 ,  H05K1/189 ,  H05K3/284 ,  H05K3/30 ,  H05K3/305 ,  H05K3/32 ,  H05K3/4015 ,  H05K3/42 ,  H05K3/4644 ,  H05K7/02 ,  H05K9/009 ,  H05K13/04 ,  H05K2201/0154 ,  H05K2201/0158 ,  H05K2201/0162 ,  H05K2201/0287 ,  H05K2201/05 ,  H05K2201/09418 ,  H05K2201/09818

Abstract: An electronics assembly includes one or more electronic components coupled to a fabric. Each electronic component includes one or more electrical connection points, such as a bond pad or solder bump. The electronics assembly also includes one or more electrically conductive wire cloths, one electrically conductive wire cloth coupled to one electrical connection point on an electronic component. The electrically conductive wire cloth is stitched to the fabric by an electrically conductive wire, thereby providing an electrical connection between the electronic component and the electrically conductive wire via the electrically conductive wire cloth.

公开(公告)号：US20120097431A1

公开(公告)日：2012-04-26

申请号：US13339244

申请日：2011-12-28

Applicant: Kalu K. Vasoya ,  Bharat M. Mangrolia ,  William E. Davis ,  Richard A. Bohner

Inventor： Kalu K. Vasoya ,  Bharat M. Mangrolia ,  William E. Davis ,  Richard A. Bohner

IPC: H05K7/20 ,  H05K1/09 ,  H05K1/03 ,  H01K3/10

CPC classification number: B32B27/12 ,  B32B5/26 ,  B32B27/04 ,  B32B2260/021 ,  B32B2262/101 ,  B32B2262/106 ,  B32B2307/202 ,  B32B2307/302 ,  B32B2457/00 ,  C08K3/38 ,  C08K9/08 ,  C08K2003/385 ,  H05K1/0206 ,  H05K1/0207 ,  H05K1/0366 ,  H05K1/0373 ,  H05K3/429 ,  H05K3/445 ,  H05K3/4623 ,  H05K3/4641 ,  H05K2201/0209 ,  H05K2201/0278 ,  H05K2201/0287 ,  H05K2201/0323 ,  Y10S428/901 ,  Y10T29/49124 ,  Y10T29/49165 ,  Y10T428/24917 ,  Y10T428/24994 ,  Y10T428/249942 ,  Y10T428/249945 ,  Y10T428/249946 ,  Y10T428/249947 ,  Y10T428/249951 ,  Y10T428/249952 ,  Y10T428/25 ,  Y10T428/292 ,  Y10T428/31504 ,  Y10T442/117 ,  Y10T442/2418

Abstract: Prepregs, laminates, printed wiring board structures and processes for constructing materials and printed wiring boards that enable the construction of printed wiring boards with improved thermal properties. In one embodiment, the prepregs include substrates impregnated with electrically and thermally conductive resins. In other embodiments, the prepregs have substrate materials that include carbon. In other embodiments, the prepregs include substrates impregnated with thermally conductive resins. In other embodiments, the printed wiring board structures include electrically and thermally conductive laminates that can act as ground and/or power planes.

Abstract translation: 预浸料，层压板，印刷线路板结构以及用于构造材料和印刷线路板的工艺，其能够构造具有改善的热性能的印刷线路板。 在一个实施方案中，预浸料包括浸渍有导电和导热树脂的基材。 在其它实施例中，预浸料坯具有包括碳的基底材料。 在其它实施方案中，预浸料包括浸渍有导热树脂的基材。 在其他实施例中，印刷线路板结构包括可以用作接地和/或电力平面的导电和导热的层压板。

公开(公告)号：US20100136284A1

公开(公告)日：2010-06-03

申请号：US12594165

申请日：2008-03-26

Applicant: Masaaki Harazono ,  Masaharu Shirai ,  Katsura Hayashi

Inventor： Masaaki Harazono ,  Masaharu Shirai ,  Katsura Hayashi

IPC: B32B3/12 ,  B32B5/12

CPC classification number: C08J5/04 ,  H05K1/0366 ,  H05K2201/0287 ,  H05K2201/029 ,  H05K2201/0296 ,  Y10T428/24099 ,  Y10T428/24149 ,  Y10T428/24994

Abstract: A fiber-reinforced resin is provided which includes a fiber bundle 2 comprising a plurality of monofilament layers 20, 21, and 22 being laminated, each of the monofilament layers comprising a plurality of monofilaments 23 arranged in one direction and an adhesive 3 for adhering the monofilaments 23 of the fiber bundle 2 together, and the fiber bundle 2 has a honeycomb-shaped cross section.

Abstract translation: 提供了一种纤维增强树脂，其包括层叠多个单丝层20,21和22的纤维束2，每个单丝层包括沿一个方向布置的多根单丝23和粘合剂3 纤维束2的单丝23一起，纤维束2具有蜂窝状的截面。