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公开(公告)号：US09549463B1
公开(公告)日：2017-01-17
申请号：US14712823
申请日：2015-05-14
Applicant: Multek Technologies, Ltd
Inventor： Joan K. Vrtis , Michael James Glickman , Mark Bergman , Shurui Shang
CPC classification number: H05K1/0281 , H05K1/0283 , H05K3/24
Abstract: A circuit board comprises one or more rigid sections, one or more flexible sections, and one or more transition areas where the circuit board transitions from the rigid section to the flexible section. One or more mechanically restrictive components are applied at a transition area to prevent failure and/or breakage of the circuit as it is bent and flexed. The mechanically restrictive components can be dispersed throughout the circuit as a coverlay, an underlay, and symmetrically positioned within the circuit board as an overlay and an underlay.
Abstract translation: 电路板包括一个或多个刚性部分，一个或多个柔性部分以及电路板从刚性部分转变到柔性部分的一个或多个过渡区域。 在过渡区域施加一个或多个机械限制部件，以防止电路在弯曲和弯曲时的故障和/或破损。 机械限制部件可以作为覆盖层，底板分散在整个电路中，并且作为覆盖层和底层被对称地定位在电路板内。
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公开(公告)号：US09723713B1
公开(公告)日：2017-08-01
申请号：US14712842
申请日：2015-05-14
Applicant: Multek Technologies, Ltd
Inventor： Joan K. Vrtis , Michael James Glickman , Mark Bergman , Shurui Shang
CPC classification number: H05K1/0281 , H05K1/0278 , H05K1/028 , H05K1/0283 , H05K1/147 , H05K1/148 , H05K3/4691 , H05K2201/2009
Abstract: In order to limit the stress and strain applied to a printed circuit board while still maintaining flexibility, a flexible section of the printed circuit board is configured to have a non-linear portion that functions as a hinge when the flexible section is bent, flexed, twisted or otherwise subjected to a motion related force. The hinge configuration improves durability and flexibility while minimizing ripping and cracking of the printed circuit board, particularly interconnects within the flexible section and a transition region between the flexible section and a rigid section of the printed circuit board. The hinge is configured to have a non-linear shape, such as a serpentine or circuitous path that can include curved portions, different linear portions or some combination of curved and linear portions.
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公开(公告)号：US09659478B1
公开(公告)日：2017-05-23
申请号：US14572610
申请日：2014-12-16
Applicant: Multek Technologies Ltd.
Inventor： Mark Bergman , Michael James Glickman
CPC classification number: H05K3/42 , G01M5/0041 , G01M5/0083 , G06F1/16 , G08B21/182 , G08B23/00 , H05K1/0201 , H05K1/115 , H05K2201/0302 , H05K2203/0338 , H05K2203/0723
Abstract: A stress and/or strain indicator comprises a wearable body, one or more flexible sections, one or more rigid sections and one or more strain gauges. The one or more strain gauges detect a level of stress and/or strain applied to the wearable body in order to indicate when the product is in danger of failing. A warning is activated based upon the level of stress and/or strain applied to the wearable body. For example, the stress and/or strain indicator is able to display a visual and/or an audible warning that a high level of stress and/or strain has been applied to the wearable body and the product is in danger of failing. In some embodiments, the stress and/or strain incident is recorded and downloadable. Consequently, a user is better informed as to when the electronic product is in danger of failing because of damage or misuse.
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Patent Agency Ranking
公开(公告)号：US09736947B1
公开(公告)日：2017-08-15
申请号：US14572636
申请日：2014-12-16
Applicant: Multek Technologies Ltd.
Inventor： Mark Bergman , Joan K. Vrtis , Michael James Glickman
CPC classification number: H05K3/42 , G01M5/0041 , G01M5/0083 , G06F1/16 , G08B21/182 , G08B23/00 , H05K1/0201 , H05K1/115 , H05K2201/0302 , H05K2203/0338 , H05K2203/0723
Abstract: A process of constructing a filled via of a printed circuit board comprises drilling a via hole through a body of the printed circuit board, desmearing a barrel of the via hole, metallizing a outer surface of the via barrel, electroplating the via barrel, pushing nano-copper solder into the via hole and heating the circuit board in order to melt the nano-copper solder within the via hole. The nano-copper solder improves the thermal conductivity of the printed circuit board for applications when heat needs to be conducted from one side of the printed circuit board to another.
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公开(公告)号：US09661743B1
公开(公告)日：2017-05-23
申请号：US14565247
申请日：2014-12-09
Applicant: Multek Technologies Ltd.
Inventor： Mark Bergman , Joan K. Vrtis
CPC classification number: H01M6/40 , A41D1/002 , A41D1/005 , D05B17/00 , H01M2/08 , H01M6/12 , H01M10/0436 , H01R4/00 , H01R4/02 , H01R4/029 , H01R43/005 , H01R43/02 , H01R43/0235 , H05K1/0271 , H05K1/0296 , H05K1/0298 , H05K1/0306 , H05K1/0366 , H05K1/0373 , H05K1/038 , H05K1/0393 , H05K1/09 , H05K1/11 , H05K1/111 , H05K1/112 , H05K1/115 , H05K1/18 , H05K1/181 , H05K1/189 , H05K3/284 , H05K3/30 , H05K3/305 , H05K3/32 , H05K3/4015 , H05K3/42 , H05K3/4644 , H05K7/02 , H05K9/009 , H05K13/04 , H05K2201/0154 , H05K2201/0158 , H05K2201/0162 , H05K2201/0287 , H05K2201/05 , H05K2201/09418 , H05K2201/09818
Abstract: A flexible circuit board includes a center “rigid” section, such as a printed circuit stack, and an adjoining flexible multi-layer body that are fabricated from a common interconnect layer. A transition material is included at the interface between the center rigid section and the flexible multi-layer body to minimize ripping and cracking of the interconnect layer. The transition material can also be added at stress areas not related to the interface. The transition material is attached at the interface and stress areas of the flexible circuit board in order to strengthen the flexible circuit board in general and in particular the transition material included therein. The transition material layer is formed and deposited at one or more locations on or within the flexible circuit board in order to minimize, reduce, if not prevent cracking and ripping of the flexible circuit board as it is bent, flexed and/or twisted.
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公开(公告)号：US10015880B1
公开(公告)日：2018-07-03
申请号：US14565227
申请日：2014-12-09
Applicant: Multek Technologies Ltd.
Inventor： Mark Bergman , Joan K. Vrtis
CPC classification number: H05K1/0271 , H05K1/0278 , H05K1/028 , H05K1/0281 , H05K1/0283 , H05K1/038 , H05K1/0386 , H05K1/0393 , H05K1/144 , H05K1/148 , H05K3/22 , H05K3/4691 , H05K2201/0137 , H05K2201/05 , H05K2201/058 , H05K2201/09945 , H05K2201/0999 , H05K2201/2009
Abstract: A rip stop material is attached at a stress area of a flexible circuit board in order to strengthen the flexible circuit board and minimize ripping and cracking in the polyimide and/or the copper conductors of the circuit. A rip stop transition layer is formed and deposited at a location on the flexible circuit in order to minimize, reduce, if not preventing cracking and ripping of the circuit as it is bent and flexed. The rip stop transition layer can be placed at different locations on and within the flexible circuit in order to minimize cracking and ripping as the flexible circuit is bent, flexed and twisted.
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公开(公告)号：US09560746B1
公开(公告)日：2017-01-31
申请号：US14604476
申请日：2015-01-23
Applicant: Multek Technologies, Ltd.
Inventor： Mark Bergman , Michael James Glickman
CPC classification number: H05K1/189 , H05K2201/0154 , H05K2201/10378 , H05K2201/2009
Abstract: In order to limit the stress and strain applied to a printed circuit board while still maintaining flexibility, multiple small rigid mesas are formed on a flexible printed circuit, where the rigid mesas are physically isolated by trenches formed around their perimeters. Individual electronic components are attached to the multiple rigid mesas. These trenches form openings at which the printed circuit board is enabled to flex, bend or twist, thereby minimizing, if not eliminating, resulting stress applied to the interconnection between the electronic components and the rigid mesas.
Abstract translation: 为了限制施加到印刷电路板上的应力和应变同时仍然保持柔性，在柔性印刷电路上形成多个小的刚性台面，其中刚性台面通过围绕其周边形成的沟槽物理隔离。 单独的电子部件连接到多个刚性台面。 这些沟槽形成开口，印刷电路板在该开口处能够弯曲，弯曲或扭曲，从而最小化（如果不消除）施加到电子部件和刚性台面之间的互连的所产生的应力。
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8.发明授权公开(公告)号：US09521748B1
公开(公告)日：2016-12-13
申请号：US14565267
申请日：2014-12-09
Applicant: Multek Technologies Ltd.
Inventor： Mark Bergman , Joan K. Vrtis
CPC classification number: H05K1/0271 , H05K1/0278 , H05K1/028 , H05K1/0281 , H05K1/0283 , H05K1/038 , H05K1/0386 , H05K1/0393 , H05K1/144 , H05K1/148 , H05K3/22 , H05K3/4691 , H05K2201/0137 , H05K2201/05 , H05K2201/058 , H05K2201/09945 , H05K2201/0999 , H05K2201/2009
Abstract: Mechanical measures strengthen a flexible circuit board or deformable electronic by manipulating the location and/or intensity of the stress concentration or to limit bending, torsion, and stretching. A material layer is patterned onto the flexible circuit board with a specific pattern and place of deposition in order to modify the stress concentration and profile of the circuit board and increase its overall strength. The material layer may be configured to modify the stress concentrations during bending away from the weak points in the assembly or to spread the stress during bending by increasing the radius of the bend curvature and therefore decreasing the chance of mechanical failure.
Abstract translation: 机械措施通过操纵应力集中的位置和/或强度或限制弯曲，扭转和拉伸来加强柔性电路板或可变形电子。 将材料层图案化到具有特定图案和沉积位置的柔性电路板上，以便改变电路板的应力集中和轮廓并增加其整体强度。 材料层可以被配置为在远离组件中的弱点的过程中修改弯曲期间的应力集中，或者通过增加弯曲曲率半径来扩展弯曲过程中的应力，从而降低机械故障的机会。
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