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公开(公告)号：US09549463B1
公开(公告)日：2017-01-17
申请号：US14712823
申请日：2015-05-14
Applicant: Multek Technologies, Ltd
Inventor： Joan K. Vrtis , Michael James Glickman , Mark Bergman , Shurui Shang
CPC classification number: H05K1/0281 , H05K1/0283 , H05K3/24
Abstract: A circuit board comprises one or more rigid sections, one or more flexible sections, and one or more transition areas where the circuit board transitions from the rigid section to the flexible section. One or more mechanically restrictive components are applied at a transition area to prevent failure and/or breakage of the circuit as it is bent and flexed. The mechanically restrictive components can be dispersed throughout the circuit as a coverlay, an underlay, and symmetrically positioned within the circuit board as an overlay and an underlay.
Abstract translation: 电路板包括一个或多个刚性部分，一个或多个柔性部分以及电路板从刚性部分转变到柔性部分的一个或多个过渡区域。 在过渡区域施加一个或多个机械限制部件，以防止电路在弯曲和弯曲时的故障和/或破损。 机械限制部件可以作为覆盖层，底板分散在整个电路中，并且作为覆盖层和底层被对称地定位在电路板内。
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Patent Agency Ranking
公开(公告)号：US09723713B1
公开(公告)日：2017-08-01
申请号：US14712842
申请日：2015-05-14
Applicant: Multek Technologies, Ltd
Inventor： Joan K. Vrtis , Michael James Glickman , Mark Bergman , Shurui Shang
CPC classification number: H05K1/0281 , H05K1/0278 , H05K1/028 , H05K1/0283 , H05K1/147 , H05K1/148 , H05K3/4691 , H05K2201/2009
Abstract: In order to limit the stress and strain applied to a printed circuit board while still maintaining flexibility, a flexible section of the printed circuit board is configured to have a non-linear portion that functions as a hinge when the flexible section is bent, flexed, twisted or otherwise subjected to a motion related force. The hinge configuration improves durability and flexibility while minimizing ripping and cracking of the printed circuit board, particularly interconnects within the flexible section and a transition region between the flexible section and a rigid section of the printed circuit board. The hinge is configured to have a non-linear shape, such as a serpentine or circuitous path that can include curved portions, different linear portions or some combination of curved and linear portions.
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公开(公告)号：US09659478B1
公开(公告)日：2017-05-23
申请号：US14572610
申请日：2014-12-16
Applicant: Multek Technologies Ltd.
Inventor： Mark Bergman , Michael James Glickman
CPC classification number: H05K3/42 , G01M5/0041 , G01M5/0083 , G06F1/16 , G08B21/182 , G08B23/00 , H05K1/0201 , H05K1/115 , H05K2201/0302 , H05K2203/0338 , H05K2203/0723
Abstract: A stress and/or strain indicator comprises a wearable body, one or more flexible sections, one or more rigid sections and one or more strain gauges. The one or more strain gauges detect a level of stress and/or strain applied to the wearable body in order to indicate when the product is in danger of failing. A warning is activated based upon the level of stress and/or strain applied to the wearable body. For example, the stress and/or strain indicator is able to display a visual and/or an audible warning that a high level of stress and/or strain has been applied to the wearable body and the product is in danger of failing. In some embodiments, the stress and/or strain incident is recorded and downloadable. Consequently, a user is better informed as to when the electronic product is in danger of failing because of damage or misuse.
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公开(公告)号：US10449729B1
公开(公告)日：2019-10-22
申请号：US14958603
申请日：2015-12-03
Applicant: Multek Technologies Ltd.
Inventor： Michael James Glickman , Jennet Ellen Johnson
Abstract: A 3D printing system includes a 3D printer configured to receive as input a coated or un-coated optical fiber, to coat the optical fiber in the case of an input un-coated optical fiber, to treat an outer coating of the coated optical fiber, and to precisely output the coated optical fiber onto a specific location on a substrate such that the coated optical fiber is securely attached to the substrate via the treated outer coating. The 3D printer has a nozzle head that includes treating element for treating, such as heating or curing, the outer coating of the coated optical fiber. The 3D printer also includes a movement mechanism, such as an XYZ gantry, coupled to the nozzle head such that the nozzle head can be precisely moved relative to the substrate for well controlled placement of the treated coated optical fiber on the substrate.
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公开(公告)号：US09560746B1
公开(公告)日：2017-01-31
申请号：US14604476
申请日：2015-01-23
Applicant: Multek Technologies, Ltd.
Inventor： Mark Bergman , Michael James Glickman
CPC classification number: H05K1/189 , H05K2201/0154 , H05K2201/10378 , H05K2201/2009
Abstract: In order to limit the stress and strain applied to a printed circuit board while still maintaining flexibility, multiple small rigid mesas are formed on a flexible printed circuit, where the rigid mesas are physically isolated by trenches formed around their perimeters. Individual electronic components are attached to the multiple rigid mesas. These trenches form openings at which the printed circuit board is enabled to flex, bend or twist, thereby minimizing, if not eliminating, resulting stress applied to the interconnection between the electronic components and the rigid mesas.
Abstract translation: 为了限制施加到印刷电路板上的应力和应变同时仍然保持柔性，在柔性印刷电路上形成多个小的刚性台面，其中刚性台面通过围绕其周边形成的沟槽物理隔离。 单独的电子部件连接到多个刚性台面。 这些沟槽形成开口，印刷电路板在该开口处能够弯曲，弯曲或扭曲，从而最小化（如果不消除）施加到电子部件和刚性台面之间的互连的所产生的应力。
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公开(公告)号：US09736947B1
公开(公告)日：2017-08-15
申请号：US14572636
申请日：2014-12-16
Applicant: Multek Technologies Ltd.
Inventor： Mark Bergman , Joan K. Vrtis , Michael James Glickman
CPC classification number: H05K3/42 , G01M5/0041 , G01M5/0083 , G06F1/16 , G08B21/182 , G08B23/00 , H05K1/0201 , H05K1/115 , H05K2201/0302 , H05K2203/0338 , H05K2203/0723
Abstract: A process of constructing a filled via of a printed circuit board comprises drilling a via hole through a body of the printed circuit board, desmearing a barrel of the via hole, metallizing a outer surface of the via barrel, electroplating the via barrel, pushing nano-copper solder into the via hole and heating the circuit board in order to melt the nano-copper solder within the via hole. The nano-copper solder improves the thermal conductivity of the printed circuit board for applications when heat needs to be conducted from one side of the printed circuit board to another.
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