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1.发明授权公开(公告)号：US07554059B2
公开(公告)日：2009-06-30
申请号：US11518878
申请日：2006-09-12
CPC分类号： H05B3/143 , H01L21/67109
摘要： A ceramic heater attaining more uniform temperature distribution from the start to the end of cooling is provided. Further, in a cooling module used for cooling the heater, liquid leakage during use is prevented, degradation in cooling capability is prevented and the performance is maintained for a long period of use, and the manufacturing cost of the module is decreased. The ceramic heater includes a ceramic heater body and a cooling module cooling the heater body, and the cooling module has a structure formed by arranging a pipe in a trench formed in a plate-shaped structure.
摘要翻译： 提供了一种从开始到结束温度分布均匀的陶瓷加热器。 此外，在用于冷却加热器的冷却模块中，防止了使用期间的液体泄漏，防止了冷却能力的劣化，并且长时间使用时保持了性能，并且模块的制造成本降低。 陶瓷加热器包括陶瓷加热器主体和冷却加热器主体的冷却模块，并且冷却模块具有通过将管道设置在形成为板状结构的沟槽中而形成的结构。
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2.发明申请Wafer holder, heater unit used for wafer prober having the wafer holder, and wafer prober having the heater unit 审中-公开用于具有晶片保持器的晶片探测器的晶片保持器，加热器单元和具有加热器单元的晶片探测器公开(公告)号：US20090050621A1
公开(公告)日：2009-02-26
申请号：US11493919
申请日：2006-07-27
IPC分类号： H05B3/68
CPC分类号： H01L21/67103 , H05B3/148
摘要： A wafer holder that prevents positional deviation of the wafer mounted on the wafer-mounting surface of a chuck top and enables better thermal uniformity of the wafer, as well as a heater unit including the wafer holder and a wafer prober mounting these are provided. The wafer holder has a chuck top mounting and fixing the wafer and a supporter supporting the chuck top, and the chuck top has water absorption of at least 0.01% and preferably at least 0.1%. Preferable material of the chuck top is a composite of metal and ceramics, and particularly, a composite of aluminum and silicon carbide, or a composite of silicon and silicon carbide.
摘要翻译： 提供一种晶片保持器，其防止安装在卡盘顶部的晶片安装表面上的晶片的位置偏移，并且实现了晶片的更好的热均匀性，以及包括晶片保持器和安装它们的晶片探测器的加热器单元。 晶片保持器具有卡盘顶部，其安装并固定晶片和支撑卡盘顶部的支撑件，卡盘顶部具有至少0.01％，优选至少0.1％的吸水率。 卡盘顶部的优选材料是金属和陶瓷的复合材料，特别是铝和碳化硅的复合材料，或硅和碳化硅的复合物。
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公开(公告)号：US20080083732A1
公开(公告)日：2008-04-10
申请号：US11544636
申请日：2006-10-10
CPC分类号： H01L21/67103 , H01L21/67109
摘要： The present invention is a wafer holder including a heating plate 2 equipped with heating means such as a film-form/foil-form heat generating body 9 or the like, a cooling plate 3 equipped with cooling means such as a coolant passage 7 or the like, and temperature measurement means 4, wherein the heating plate 2 and cooling plate 3 are layered in a direction perpendicular to the wafer placement surface. The heating plate 2 is preferably disposed closer to the wafer placement surface than the cooling plate 3, and a heat conducting member 8 is disposed between the heating plate 2 and cooling plate 3.
摘要翻译： 本发明是一种晶片保持器，其包括装有诸如薄膜/箔形发热体9等加热装置的加热板2，具有冷却装置如冷却剂通道7的冷却板3或 和温度测量装置4，其中加热板2和冷却板3在垂直于晶片放置表面的方向上层叠。 加热板2优选地设置成比冷却板3更靠近晶片放置表面，并且在加热板2和冷却板3之间设置导热部件8。
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公开(公告)号：US07279048B2
公开(公告)日：2007-10-09
申请号：US10987304
申请日：2004-11-15
IPC分类号： G01R31/02 , H01L21/68 , C23C16/00 , C23C16/458
CPC分类号： C23C16/4586 , H01L21/67109
摘要： To provide a semiconductor manufacturing device, which is provided with a wafer holder capable of improving the cooling rate of a heater and retaining the homogeneity of the temperature distribution of the heater at cooling time and which can markedly shorten the time period for treating a semiconductor wafer.The wafer holder includes the heater 1 for carrying the semiconductor wafer thereon to heat the same, and the cooling block 2 for cooling the heater 1. The cooling block 2 is arranged so as to come into and out of abutment against the back 1b of the heater on the side opposed to the wafer carrying face 1a, and its abutment face 2a to abut against the heater 1 has a warpage of 1 mm or less. The cooling block 2 can be provided therein with a passage for a cooling liquid. It is preferred that the passage has a sectional area of 1 mm2 or larger over 80% of its entire length, and that the area of the portion having the passage formed is 3% or larger of the entire area of the abutment face 2a.
摘要翻译： 为了提供一种半导体制造装置，其具有能够提高加热器的冷却速度的晶片保持器，并且保持加热器在冷却时的温度分布的均匀性，并且可以显着缩短处理半导体晶片的时间段 。 晶片保持器包括用于在其上承载半导体晶片以加热其的加热器1和用于冷却加热器1的冷却块2。 冷却块2被布置成在与晶片承载面1a相对的一侧进入和离开加热器的背面1b，并且其抵靠加热器1的邻接面2a具有翘曲 为1mm以下。 冷却块2可以在其中设置有用于冷却液体的通道。 优选的是，通道的截面面积为其整个长度的80％以上的1mm 2以上，并且具有通路形状的部分的面积为整体的3％以上 邻接面2a的区域。
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公开(公告)号：US20070205788A1
公开(公告)日：2007-09-06
申请号：US11701417
申请日：2007-02-02
IPC分类号： G01R31/02
CPC分类号： G01R31/2865 , H01L21/68757
摘要： A wafer holder is provided having high rigidity and an enhanced heat-insulating effect that allow positional accuracy and heating uniformity to be improved, a chip to be rapidly heated and cooled, and the manufacturing cost to be reduced, and a wafer prober apparatus on which the wafer holder is mounted. The wafer holder of the present invention includes a chuck top for mounting a wafer, a support member for supporting the chuck top, and a stand for supporting the support member. The chuck top has a thermal conductivity K1 and a Young's modulus Y1; the support member has a thermal conductivity K2 and a Young's modulus Y2; and the stand has a thermal conductivity K3 and a Young's modulus Y3. K1>K2 and K1>K3; and Y3>Y1 and Y3>Y2.
摘要翻译： 提供了具有高刚性和增强的隔热效果的晶片保持器，其允许提高位置精度和加热均匀性，快速加热和冷却的芯片，以及降低的制造成本，以及晶片探测器装置，其上 安装晶片保持架。 本发明的晶片保持器包括用于安装晶片的卡盘顶部，用于支撑卡盘顶部的支撑构件和用于支撑支撑构件的支架。 卡盘顶部具有热导率K 1和杨氏模量Y 1; 支撑构件具有热导率K 2和杨氏模量Y 2; 并且支架具有导热系数K 3和杨氏模量Y 3。 K 1> K 2和K 1> K 3; Y 3> Y 1，Y 3> Y 2。
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6.发明申请公开(公告)号：US20070095291A9
公开(公告)日：2007-05-03
申请号：US10709889
申请日：2004-06-03
IPC分类号： C23C16/00
CPC分类号： H01L21/68757 , C23C16/4581 , C23C16/4586 , H01L21/68785 , H05B3/12 , H05B3/143
摘要： Affords a holder for use in semiconductor or liquid-crystal manufacturing devices—as well as semiconductor or liquid-crystal manufacturing devices in which the holder is installed—in which temperature uniformity in the processed-object retaining face is heightened. Configuring the holder with, furnished atop a ceramic susceptor, a composite of a ceramic and a metal improves the temperature uniformity in the holder's processed-object retaining face and makes for curtailing the generation of particulates and other contaminants. In addition, putting a coating on at least the retaining face improves the durability of the holder. Installing a holder of this sort in a semiconductor manufacturing device or a liquid-crystal manufacturing device contributes to making available semiconductor or liquid-crystal manufacturing devices whose productivity and throughput are excellent.
摘要翻译： 提供用于半导体或液晶制造装置的保持器以及其中安装保持器的半导体或液晶制造装置，其中加工对象保持面的温度均匀性提高。 配置陶瓷基座上的支架，陶瓷和金属的复合材料，可提高保持器的加工对象保持面的温度均匀性，并减少微粒和其他污染物的产生。 另外，至少在保持面上涂上涂层，提高了保持体的耐久性。 在半导体制造装置或液晶制造装置中安装这样的支架有助于制造生产率和生产率优异的半导体或液晶制造装置。
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7.发明申请Composite and susceptor for semiconductor manufacturing device and power module with the same 审中-公开复合和感应器用于半导体制造装置和电源模块相同公开(公告)号：US20070069174A1
公开(公告)日：2007-03-29
申请号：US11509822
申请日：2006-08-25
CPC分类号： B22F7/02 , B22F2998/00 , C04B35/565 , C04B35/581 , C04B35/62218 , C04B41/009 , C04B41/52 , C04B41/89 , C04B2111/00844 , C04B2235/3217 , C04B2235/3225 , C04B2235/3418 , C04B2235/3865 , C04B2235/3873 , C04B2235/9607 , H01L23/142 , H01L23/3735 , H01L2924/0002 , C04B41/4523 , C04B41/5155 , C04B41/5096 , C04B41/522 , C04B41/4543 , C04B41/5031 , C04B41/5035 , C04B41/5045 , C04B41/5063 , C04B41/5066 , C04B41/4572 , C04B41/51 , C04B35/10 , C04B35/00 , C04B38/00 , B22F3/26 , H01L2924/00
摘要： The present invention provides a composite having superior reliability and superior binding strength with respect to films formed on substrates by aerosol methods, and also provides a semiconductor manufacturing devices susceptor and a power module substrate. In the composite of the present invention, a film formed by an aerosol method is provided on a surface of a composite formed from a plurality of metals. Alternatively, a film formed by an aerosol method may be provided on the surface of a composite formed from a metal and a ceramic. The composite preferably has a thermal conductivity of 100 W/mK or greater, and the film formed by the aerosol method preferably has a thermal conductivity of 1 W/mK or greater.
摘要翻译： 本发明提供了一种具有优异的可靠性和相对于通过气溶胶方法在基底上形成的膜的优异结合强度的复合材料，并且还提供半导体制造装置基座和功率模块基板。 在本发明的复合材料中，在由多种金属形成的复合体的表面上设置由气溶胶法形成的膜。 或者，通过气溶胶法形成的膜可以设置在由金属和陶瓷形成的复合材料的表面上。 该复合体的导热率优选为100W / m·K以上，通过气溶胶法形成的膜的导热率优选为1W / m·K以上。
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公开(公告)号：US20070068921A1
公开(公告)日：2007-03-29
申请号：US11559389
申请日：2006-11-13
申请人： Akira Kuibira , Hirohiko Nakata
发明人： Akira Kuibira , Hirohiko Nakata
IPC分类号： H05B3/68
CPC分类号： H01L21/67109
摘要： Heater module, and semiconductor manufacturing equipment in which the heater module is utilized, for raising the cooling speed of a post-heating heater markedly more than conventional, and that can contribute toward bettering and improving productivity, without accompanying scaling-up of and cost increases in the semiconductor manufacturing equipment. The heater module is furnished with heater part 1a for controlled heating of a wafer placed on its top face, and block part 3a provided to be shiftable relative to said heater part, for varying heat capacity in total with heater part 1a by abutting on or separating from the reverse surface of heater part 1a. By having the heat capacity of block part 3a be 20% or more of the total heat capacity of heater part 1a and block part 3a, the heater cooling speed can be made 10°C./min or more.
摘要翻译： 加热器模块和使用加热器模块的半导体制造设备，用于提高后加热加热器的冷却速度，其显着地比传统的更高，并且可以有助于改善和提高生产率，而不伴随增加和成本增加 在半导体制造设备中。 加热器模块配备有加热器部分1a，用于受控加热放置在其顶面上的晶片，以及块部分3a，其被设置为可相对于所述加热器部件移动，用于通过邻接加热器部分1a来改变总体上的热容量 在加热器部分1a的反面上或与其分离。 通过使块部3a的热容量为加热器部1a和块部3a的总热容量的20％以上，加热器冷却速度可以为10℃/分钟以上。
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公开(公告)号：US20070056952A1
公开(公告)日：2007-03-15
申请号：US11496711
申请日：2006-08-01
IPC分类号： H05B3/68
CPC分类号： H05B3/26 , H05B3/262 , H05B2203/013
摘要： A heater unit that can be fabricated in a simple manner and is highly reliable, as well as a wafer prober mounting the heater unit are provided. The heater unit of the present invention includes a mounting base mounting an object to be processed and a heater unit heating the mounting base, wherein the heater body has an insulating sheet and a heating body formed on the insulating sheet. Preferably, at least a part of the heating body is covered with a protective layer, and preferably, the material of the heating body is metal foil. Further, preferably, the material of the protective layer is heat-resistant rubber, and preferably, the material of the insulating sheet is heat-resistant resin.
摘要翻译： 提供了可以以简单的方式制造并且高度可靠的加热器单元以及安装加热器单元的晶片探测器。 本发明的加热器单元包括安装待加工物体的安装基座和加热安装基座的加热器单元，其中加热器主体具有形成在绝缘片上的绝缘片和加热体。 优选地，加热体的至少一部分被保护层覆盖，并且优选地，加热体的材料是金属箔。 此外，优选地，保护层的材料是耐热橡胶，并且优选地，绝缘片的材料是耐热树脂。
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公开(公告)号：US20070046307A1
公开(公告)日：2007-03-01
申请号：US11498966
申请日：2006-08-04
IPC分类号： G01R31/02
CPC分类号： G01R31/2865 , G01R31/2875
摘要： A wafer holding body used for a wafer prober for testing a semiconductor wafer includes a chuck top having a conductive layer on a surface thereof and a support body supporting the chuck top. The support body has a base portion opposing the chuck top and a side portion extending from the perimeter of the base portion to the chuck top to support the chuck top. A cavity portion is formed between the chuck top and the base portion of the support body. A reflection plate is provided in the cavity portion. A heater unit and a wafer prober includes the wafer holding body.
摘要翻译： 用于晶片探测器的用于测试半导体晶片的晶片保持体包括其表面上具有导电层的卡盘顶板和支撑卡盘顶部的支撑体。 支撑体具有与卡盘顶部相对的基部和从基部的周边延伸到卡盘顶部以支撑卡盘顶部的侧部。 在卡盘顶部和支撑体的基部之间形成空腔部分。 反射板设置在空腔部分中。 加热器单元和晶片探测器包括晶片保持体。
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