Layout of semiconductor memory device

    公开(公告)号:US11915755B2

    公开(公告)日:2024-02-27

    申请号:US17580591

    申请日:2022-01-20

    CPC classification number: G11C15/04

    Abstract: A layout of a semiconductor memory device includes a substrate and a ternary content addressable memory (TCAM). The TCAM is disposed on the substrate and includes a plurality of TCAM bit cells, where at least two of the TCAM bit cells are mirror-symmetrical along an axis of symmetry, and each of the TCAM bit cells includes two storage units electrically connected to two word lines respectively, and a logic circuit electrically connected to the storage units. The logic circuit includes two first reading transistors, and two second reading transistors, where each of the second reading transistors includes a gate and source and drain regions, the source and drain regions of the second reading transistors are electrically connected to two matching lines and the first reading transistors, respectively, where the word lines are disposed parallel to and between the matching lines.

    Method of forming static random-access memory (SRAM) cell array

    公开(公告)号:US10468420B2

    公开(公告)日:2019-11-05

    申请号:US16028442

    申请日:2018-07-06

    Abstract: A static random-access memory (SRAM) cell array forming method includes the following steps. A plurality of fin structures are formed on a substrate, wherein the fin structures include a plurality of active fins and a plurality of dummy fins, each PG (pass-gate) FinFET shares at least one of the active fins with a PD (pull-down) FinFET, and at least one dummy fin is disposed between the two active fins having two adjacent PU (pull-up) FinFETs thereover in a static random-access memory cell. At least a part of the dummy fins are removed. The present invention also provides a static random-access memory (SRAM) cell array formed by said method.

    Control circuit used for ternary content-addressable memory with two logic units

    公开(公告)号:US10366756B1

    公开(公告)日:2019-07-30

    申请号:US16104946

    申请日:2018-08-19

    Abstract: A control circuit for a ternary content-addressable memory includes a first logic unit and a second logic unit. The first logic unit is coupled to a first storage unit, a second storage unit, a first search line, a second search line, a reference voltage terminal, and a match line. The second logic unit is coupled to the first storage unit, the second storage unit, the first search line, the second search line, a first power supply line and a second power supply line. When voltages at the first search line and the second search line match voltages at the first storage unit and the second storage unit, the second logic unit provides a path for electrically connecting the first power supply line to the second power supply line.

    Static random-access memory (SRAM) cell array and forming method thereof

    公开(公告)号:US10050046B2

    公开(公告)日:2018-08-14

    申请号:US15691764

    申请日:2017-08-31

    Abstract: A static random-access memory (SRAM) cell array forming method includes the following steps. A plurality of fin structures are formed on a substrate, wherein the fin structures include a plurality of active fins and a plurality of dummy fins, each PG (pass-gate) FinFET shares at least one of the active fins with a PD (pull-down) FinFET, and at least one dummy fin is disposed between the two active fins having two adjacent PU (pull-up) FinFETs thereover in a static random-access memory cell. At least a part of the dummy fins are removed. The present invention also provides a static random-access memory (SRAM) cell array formed by said method.

    Static random access memory
    10.
    发明授权
    Static random access memory 有权
    静态随机存取存储器

    公开(公告)号:US09379119B1

    公开(公告)日:2016-06-28

    申请号:US14749623

    申请日:2015-06-24

    CPC classification number: H01L27/1104 H01L27/0207 H01L27/0886 H01L27/0924

    Abstract: A static random access memory (SRAM) is disclosed. The SRAM includes a plurality of SRAM cells on a substrate, in which each of the SRAM cells further includes: a gate structure on the substrate, a plurality of fin structures disposed on the substrate, where each fin structure is arranged perpendicular to the arrangement direction of the gate structure, a first interlayer dielectric (ILD) layer around the gate structure, a first contact plug in the first ILD layer, where the first contact plug is strip-shaped and contacts two different fin structures; and a second ILD layer on the first ILD layer.

    Abstract translation: 公开了一种静态随机存取存储器(SRAM)。 SRAM包括在衬底上的多个SRAM单元,其中每个SRAM单元还包括:衬底上的栅极结构,设置在衬底上的多个鳍结构,其中每个鳍结构垂直于排列方向排列 栅极结构周围的第一层间电介质(ILD)层,第一ILD层中的第一接触插塞,其中第一接触插塞为带状并接触两个不同的翅片结构; 和第一ILD层上的第二ILD层。

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