Abstract:
An electrical arrangement provides power to a plurality of electrical systems, the electrical arrangement including a plurality of voltage buses; a plurality of voltage sources configured to supply respective electrical voltage potentials, the voltage sources being respectively assigned to the voltage buses, the voltage sources supplying the respective electrical voltage potentials to the respective voltage buses; at least one electrical system assigned to and electrically coupled to each of the voltage buses to receive electrical power; and a DC-DC converter arrangement electrically coupled to the voltage buses, the DC-DC converter being configured to convert at least one of the respective voltage potentials to another one of the respective voltage potentials, the DC-DC converter being mechanically and proximally coupled to at least one of the voltage sources.
Abstract:
A Rad Hard MOSFET has a plurality of closely spaced base strips which have respective source to form invertible surface channels with the opposite sides of each of the stripes. A non-DMOS late gate oxide and overlying conductive polysilicon gate are formed after the source and base regions have been diffused. The base strips are spaced by about 0.6 microns, and the polysilicon gate stripes are about 3.2 microns wide. An enhancement region is implanted through spaced narrow window early in the process and are located in the JFET common conduction region which is later formed by and between the spaced base stripes. The device is a high voltage (greater than 25 volts) device with very low gate capacitance and very low on resistance. An early and deep (1.6 micron) P channel implant and diffusion are formed before the main channel is formed to produce a graded body diode junction.
Abstract:
The tops of the conductive polysilicon gates of a trench device have a layer of a silicide such as titanium silicide which is more conductive than the polysilicon gate, thereby reducing gate resistance.
Abstract:
A vertical conduction MOSFET having a reduced on resistance RDSON as well as reduced threshold voltage Vth, and an improved resistance to punchthrough and walkout has an extremely shallow source diffusion, of less than 0.3 microns in depth and an extremely shallow channel diffusion, of less than about 3 microns in depth. In a P channel version, phosphorus is implanted into the bottom of a contact trench and into the channel region with an implant energy of 400 keV for a singly charged phosphorus ion or 200 keV for a doubly charged ion, thereby to prevent walkout of the threshold voltage.
Abstract:
A trench type power MOSgated device has a plurality of spaced trenches lined with oxide and filled with conductive polysilicon. The tops of the polysilicon fillers are below the top silicon surface and are capped with a deposited oxide the top of which is flush with the top of the silicon. Source regions of short lateral extent extend into the trench walls to a depth below the top of the polysilicon. A trench termination is formed having an insulation oxide liner covered by a polysilicon layer, covered in turn by a deposited oxide.
Abstract:
A Schottky diode has a barrier height which is adjusted by boron implant through a titanium silicide Schottky contact and into the underlying Nnull silicon substrate which receives the titanium silicide contact. The implant is a low energy, of about 10 keV (non critical) and a low dose of less than about 1E12 atoms per cm2 (non-critical).
Abstract translation:肖特基二极管具有通过硼注入通过硅化钛肖特基接触并进入接收硅化钛接触的下面的N-硅衬底中的势垒高度。 植入物是约10keV(非临界)和小于约1E12原子/ cm 2(非关键)的低能量的低能量。
Abstract:
A termination structure for a superjunction device on which the net charge between P pylons in an Nnull termination region is intentionally unbalanced and is negative. The P pylons in the termination area are further non-uniformly located relative to those in the active area. A field ring which is an extension of the source electrode terminates at a radial mid point of the termination region.
Abstract:
A driver stage consisting of an N channel FET and a P channel FET are mounted in the same package as the main power FET. The power FET is mounted on a lead frame and the driver FETs are mounted variously on a separate pad of the lead frame or on the main FET or on the lead frame terminals. All electrodes are interconnected within the package by mounting on common conductive surfaces or by wire bonding. The drivers are connected to define either an inverting or non-inverting drive.
Abstract:
An electronic ballast circuit for powering a gas discharge lamp is networked with other ballast circuits to provide large scale lighting control on a local or remote basis. The ballast has an interface connectable to a standard PC for receiving commands and obtaining query information. The ballasts can be controlled individually or in groups. The ballast control also can download lighting profiles to a microcontroller in the ballast, and can support lighting control protocols including the DALI standard.
Abstract:
A force-fit diode for high circuit application has a cylindrical constant diameter conductive body which has a tapered top and bottom peripheral edge. An axial conductor extends from one end of the housing. The tapered top and bottom peripheral edges allow the housing to be forced into an opening in the bus, with either the housing bottom or the axial lead being the first to enter the openings.