Mosfet with reduced threshold voltage and on resistance and process for its manufacture
    1.
    发明申请
    Mosfet with reduced threshold voltage and on resistance and process for its manufacture 有权
    Mosfet具有降低的阈值电压和电阻及其制造工艺

    公开(公告)号:US20030089945A1

    公开(公告)日:2003-05-15

    申请号:US10044427

    申请日:2001-11-09

    CPC classification number: H01L29/7802 H01L29/0847 H01L29/1095 H01L29/41766

    Abstract: A vertical conduction MOSFET having a reduced on resistance RDSON as well as reduced threshold voltage Vth, and an improved resistance to punchthrough and walkout has an extremely shallow source diffusion, of less than 0.3 microns in depth and an extremely shallow channel diffusion, of less than about 3 microns in depth. In a P channel version, phosphorus is implanted into the bottom of a contact trench and into the channel region with an implant energy of 400 keV for a singly charged phosphorus ion or 200 keV for a doubly charged ion, thereby to prevent walkout of the threshold voltage.

    Abstract translation: 具有降低的导通电阻RDSON和降低的阈值电压Vth的垂直导通MOSFET以及改进的穿通和迂回阻力具有小于0.3微米深度的极浅源极扩散和小于0.3微米的通道扩散。 约3微米深。 在P沟道版本中,磷被注入到接触沟槽的底部并且注入到沟道区域中,对于单电荷的磷离子或200keV的注入能量为400keV,用于双电荷离子,从而防止阈值 电压。

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