公开(公告)号：US20140002188A1

公开(公告)日：2014-01-02

申请号：US13917384

申请日：2013-06-13

申请人： SKYWORKS SOLUTIONS, INC.

发明人： Howard E. Chen ,  Yifan Guo ,  Dinhphuoc Vu Hoang ,  Mehran Janani ,  Tin Myint Ko ,  Philip John Lehtola ,  Anthony James LoBianco ,  Hardik Bhupendra Modi ,  Hoang Mong Nguyen ,  Matthew Thomas Ozalas ,  Sandra Louise Petty-Weeks ,  Matthew Sean Read ,  Jens Albrecht Riege ,  David Steven Ripley ,  Hongxiao Shao ,  Hong Shen ,  Weimin Sun ,  Hsiang-Chih Sun ,  Patrick Lawrence Welch ,  Peter J. Zampardi, JR. ,  Guohao Zhang

IPC分类号： H03F3/19

CPC分类号： H03F1/0205 ,  H01L21/485 ,  H01L21/4853 ,  H01L21/4864 ,  H01L21/565 ,  H01L21/76898 ,  H01L21/78 ,  H01L21/8249 ,  H01L21/8252 ,  H01L22/14 ,  H01L23/3114 ,  H01L23/481 ,  H01L23/49811 ,  H01L23/49827 ,  H01L23/49838 ,  H01L23/49844 ,  H01L23/49861 ,  H01L23/49866 ,  H01L23/49894 ,  H01L23/50 ,  H01L23/522 ,  H01L23/552 ,  H01L23/66 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/85 ,  H01L24/97 ,  H01L27/0605 ,  H01L27/0623 ,  H01L27/092 ,  H01L29/0684 ,  H01L29/0821 ,  H01L29/0826 ,  H01L29/1004 ,  H01L29/20 ,  H01L29/205 ,  H01L29/36 ,  H01L29/66242 ,  H01L29/66863 ,  H01L29/737 ,  H01L29/7371 ,  H01L29/812 ,  H01L29/8605 ,  H01L2223/6611 ,  H01L2223/6616 ,  H01L2223/6644 ,  H01L2223/665 ,  H01L2223/6655 ,  H01L2224/05155 ,  H01L2224/05164 ,  H01L2224/05554 ,  H01L2224/05644 ,  H01L2224/45015 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48177 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/48611 ,  H01L2224/48644 ,  H01L2224/48647 ,  H01L2224/48655 ,  H01L2224/48664 ,  H01L2224/48811 ,  H01L2224/48816 ,  H01L2224/48844 ,  H01L2224/48847 ,  H01L2224/48855 ,  H01L2224/48864 ,  H01L2224/4903 ,  H01L2224/49111 ,  H01L2224/49176 ,  H01L2224/85205 ,  H01L2224/85207 ,  H01L2224/85411 ,  H01L2224/85416 ,  H01L2224/85444 ,  H01L2224/85455 ,  H01L2224/85464 ,  H01L2924/00011 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/12033 ,  H01L2924/12042 ,  H01L2924/1305 ,  H01L2924/13051 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/1421 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/19105 ,  H01L2924/19107 ,  H01L2924/3011 ,  H01L2924/30111 ,  H01L2924/3025 ,  H03F1/565 ,  H03F3/187 ,  H03F3/19 ,  H03F3/195 ,  H03F3/21 ,  H03F3/213 ,  H03F3/245 ,  H03F3/347 ,  H03F3/45 ,  H03F3/60 ,  H03F2200/387 ,  H03F2200/451 ,  H03F2200/48 ,  H03F2200/555 ,  H01L2924/00 ,  H01L2924/00014

摘要： A power amplifier module includes a power amplifier including a GaAs bipolar transistor having a collector, a base abutting the collector, and an emitter, the collector having a doping concentration of at least about 3×1016 cm−3 at a junction with the base, the collector also having at least a first grading in which doping concentration increases away from the base; and an RF transmission line driven by the power amplifier, the RF transmission line including a conductive layer and finish plating on the conductive layer, the finish plating including a gold layer, a palladium layer proximate the gold layer, and a diffusion barrier layer proximate the palladium layer, the diffusion barrier layer including nickel and having a thickness that is less than about the skin depth of nickel at 0.9 GHz. Other embodiments of the module are provided along with related methods and components thereof.

摘要翻译： 功率放大器模块包括功率放大器，其包括具有集电极的GaAs双极晶体管，邻接集电极的基极和发射极，该集电极在与基极的连接处具有至少约3×1016cm-3的掺杂浓度， 所述收集器还具有至少第一分级，其中掺杂浓度从所述基底增加; 以及由功率放大器驱动的RF传输线，RF传输线包括在导电层上的导电层和精整电镀，精加工镀层包括金层，接近金层的钯层和靠近金层的扩散阻挡层 钯层，扩散阻挡层包括镍，并且其厚度小于0.9GHz处的镍的趋肤深度。 模块的其他实施例与其相关方法和组件一起提供。

公开(公告)号：US20230402338A1

公开(公告)日：2023-12-14

申请号：US18329186

申请日：2023-06-05

申请人： Skyworks Solutions, Inc.

发明人： Anthony James LoBianco ,  Ki Wook Lee ,  Yi Liu

IPC分类号： H01L23/31 ,  H01L23/498 ,  H01L23/15 ,  H05K1/18 ,  H01L21/56 ,  H05K3/40

CPC分类号： H01L23/3121 ,  H01L23/49827 ,  H01L23/15 ,  H05K1/181 ,  H01L21/563 ,  H05K3/4038 ,  H05K2201/0305

摘要： An electronic package is provided. The electronic package includes a substrate configured to receive one or more electronic modules, a first electronic module mounted to a first side of the substrate, a first mold structure extending over at least part of the first side of the substrate; and a group of electrically conductive through-mold connections provided on the first side of the substrate. The first mold structure substantially encapsulates the group of through-mold connections. The group of through-mold connections is exposed through the first mold structure. The group of through-mold connections is configured to couple to a circuit board by a corresponding group of intermediate solder portions. The through-mold connections can have a melting point in excess of a melting point of the intermediate solder portion. Related electronic assemblies, electronic devices, and methods of manufacturing and/or mounting an electronic package are provided.

公开(公告)号：US20230402294A1

公开(公告)日：2023-12-14

申请号：US18329387

申请日：2023-06-05

申请人： Skyworks Solutions, Inc.

发明人： Anthony James LoBianco ,  Ki Wook Lee ,  Yi Liu

IPC分类号： H01L21/56 ,  H01L21/60

CPC分类号： H01L21/565 ,  H01L21/60 ,  H01L2021/6027 ,  H01L2021/6024

摘要： Methods are disclosed for mounting an electronic package to a circuit board are disclosed. The electronic package can be mounted to the circuit board by use of intermediate solder portions such that each intermediate solder portion couples a corresponding through-mold connection of the electronic package to the circuit board. The through-mold connections can have a melting point in excess of a melting point of the intermediate solder portions. Related electronic packages, electronic assemblies, electronic devices, and methods of manufacturing electronic packages are disclosed.

公开(公告)号：US20230345684A1

公开(公告)日：2023-10-26

申请号：US18190841

申请日：2023-03-27

申请人： Skyworks Solutions, Inc.

发明人： Anthony James LoBianco ,  Hoang Mong Nguyen ,  Yi Liu

IPC分类号： H05K9/00 ,  H01L23/552 ,  H01L23/544 ,  H01L21/56

CPC分类号： H05K9/0022 ,  H01L23/552 ,  H01L23/544 ,  H01L21/56 ,  H01L2223/54406 ,  H01L2223/5442 ,  H01L2223/54413 ,  H03H9/64

摘要： An integrated device package is disclosed. The integrated device package can include a carrier, an electronic component mounted on the carrier, a molding material disposed over the carrier, and an electromagnetic interference shield layer disposed over the molding material. The electronic component is at least partially disposed in the molding material. The electromagnetic interference shield layer is configured to shield the electronic component from a radio frequency signal. The electromagnetic interference shield layer has a thickness in a range between 2 μm and 6 μm. A surface of the electromagnetic interference shield layer includes an ink mark that has a thickness in a range between 5 μm and 15 μm, or a laser mark that has a depth in a range between 1 μm and 2 μm.

公开(公告)号：US20230326841A1

公开(公告)日：2023-10-12

申请号：US18130511

申请日：2023-04-04

申请人： SKYWORKS SOLUTIONS, INC.

发明人： Robert Francis Darveaux ,  Howard E. Chen ,  Hoang Mong Nguyen ,  Anthony James LoBianco

IPC分类号： H01L23/498 ,  H01L23/538 ,  H01L23/31 ,  H01Q1/22

CPC分类号： H01L23/49816 ,  H01L23/5383 ,  H01L23/3157 ,  H01L23/3128 ,  H01Q1/2283

摘要： A dual-sided packaged radio-frequency (RF) module comprises a packaging substrate having a first surface with at least one RF circuit component mounted thereon and a second surface opposite to the first surface with at least one circuitry component mounted thereon, at least one contact feature attached to the second surface of the packaging substrate, a vertical extension of the at least one contact feature being larger than a distance between a bottom surface of the at least one circuitry component and the second surface of the packaging substrate, an underside molding encapsulating the at least one circuitry component and the at least one contact feature, a bottom surface of the underside molding being flush with the bottom surface of the at least one circuitry component, and a trench structure formed in the underside molding around the at least one contact feature.

公开(公告)号：US20230163458A1

公开(公告)日：2023-05-25

申请号：US18156889

申请日：2023-01-19

申请人： Skyworks Solutions, Inc.

发明人： Anthony James LoBianco ,  Hoang Mong Nguyen

IPC分类号： H01Q1/52 ,  H01L23/552 ,  H01L23/31 ,  H01Q1/38 ,  H01Q1/24 ,  H04B1/3883 ,  H04W52/02 ,  H01Q1/22

CPC分类号： H01Q1/526 ,  H01L23/552 ,  H01L23/3121 ,  H01Q1/38 ,  H01Q1/243 ,  H04B1/3883 ,  H04W52/0296 ,  H01Q1/2283

摘要： A packaged radio frequency module includes a package substrate. A semiconductor die is attached to the package substrate and includes one or more radio frequency circuits fabricated therein. A molding compound encapsulates the semiconductor die. An electromagnetic shielding structure at least partially covers the molding compound, the electromagnetic shielding structure having an outer layer including cobalt that defines a topmost layer of the module.

公开(公告)号：US11596056B2

公开(公告)日：2023-02-28

申请号：US16588884

申请日：2019-09-30

申请人： SKYWORKS SOLUTIONS, INC.

发明人： Bhuvaneshwaran Vijayakumar ,  Lori Ann DeOrio ,  Anthony James LoBianco ,  Hoang Mong Nguyen ,  Robert Francis Darveaux

IPC分类号： H05K1/02 ,  H05K3/24 ,  H05K1/11 ,  H03F3/19

摘要： A packaging substrate can include a first surface and a second opposing surface, the first surface having a mounting region configured to receive electronic components, and electrical contacts formed on the second opposing surface. A saw street region can surround the mounting region and the electrical contacts, a metal layer and a solder mask layer being formed within the saw street region on the second opposing surface, and the solder mask layer being formed over the metal layer. An electronic module can include a packaging substrate including a first surface and a second opposing surface, the first surface including a mounting region. A plurality of electronic components can be mounted on the mounting region. A ground pad can be formed on the second opposing surface of the packaging substrate, the ground pad including a solder mask layer formed thereon, the solder mask layer having a plurality of openings.

公开(公告)号：US20210336332A1

公开(公告)日：2021-10-28

申请号：US17303135

申请日：2021-05-20

申请人： Skyworks Solutions, Inc.

发明人： Anthony James LoBianco ,  Hoang Mong Nguyen

IPC分类号： H01Q1/52 ,  H01L23/552 ,  H01L23/31 ,  H01Q1/38 ,  H01Q1/24 ,  H04B1/3883 ,  H04W52/02 ,  H01Q1/22

摘要： A method for providing electromagnetic shielding of a semiconductor die includes attaching a semiconductor die to a package substrate of a packaged radio frequency module, where the package substrate includes one or more radio frequency circuits fabricated therein. The method also includes encapsulating the semiconductor die with a molding compound. The method also includes at least partially covering the molding compound with an electromagnetic shielding structure having an outer layer including cobalt. A phone board assembly can include the packaged radio frequency module attached to a printed circuit board. The packaged radio frequency module can be incorporated into a mobile device.

公开(公告)号：US11037893B2

公开(公告)日：2021-06-15

申请号：US16820401

申请日：2020-03-16

申请人： Skyworks Solutions, Inc.

发明人： Leslie Paul Wallis ,  Hoang Mong Nguyen ,  Anthony James LoBianco ,  Gregory Edward Babcock ,  Darren Roger Frenette ,  George Khoury ,  René Rodríguez

IPC分类号： H04B1/38 ,  H01L23/66 ,  H03F3/24 ,  H03F1/32 ,  H01L23/552 ,  H04B1/40 ,  H03F3/195 ,  H03F1/22 ,  H03F1/34 ,  H03F1/56 ,  H04B1/04 ,  H05B47/19 ,  F21V23/00 ,  H04W84/12 ,  H01Q1/38 ,  H01Q1/22 ,  H01Q9/42

摘要： Front end systems and related devices, integrated circuits, modules, and methods are disclosed. One such packaged module includes a low noise amplifier in an interior of a radio frequency shielding structure and an antenna external to the radio frequency shielding structure. The low noise amplifier includes a first inductor, an amplification circuit, and a second inductor magnetically coupled to the first inductor to provide negative feedback to linearize the low noise amplifier. The radio frequency shielding structure can extend above a package substrate. The antenna can be on the package substrate. Other embodiments of front end systems are disclosed, along with related devices, integrated circuits, modules, methods, and components thereof.

公开(公告)号：US20210143542A1

公开(公告)日：2021-05-13

申请号：US17154854

申请日：2021-01-21

申请人： Skyworks Solutions, Inc.

发明人： Hoang Mong Nguyen ,  Anthony James LoBianco ,  Gregory Edward Babcock ,  Darren Roger Frenette ,  George Khoury

IPC分类号： H01Q1/52 ,  H01Q9/42 ,  H01Q1/22 ,  H01Q1/38 ,  H01L21/027 ,  H01L21/268 ,  H01L21/285 ,  H01L21/3205 ,  H01L21/78 ,  H01L23/498 ,  H01L23/552 ,  H01L23/66 ,  H01L23/00

摘要： Aspects of this disclosure relate to methods of selectively shielded radio frequency modules. A radio frequency module can be provided with a radio frequency component and an antenna. A shielding layer can be formed over a portion of the radio frequency module such that the radio frequency component is shielded by the shielding layer and the antenna is unshielded by the shielding layer.