公开(公告)号：US12003025B2

公开(公告)日：2024-06-04

申请号：US17154854

申请日：2021-01-21

申请人： Skyworks Solutions, Inc.

发明人： Hoang Mong Nguyen ,  Anthony James LoBianco ,  Gregory Edward Babcock ,  Darren Roger Frenette ,  George Khoury

IPC分类号： H01Q1/52 ,  H01L21/027 ,  H01L21/268 ,  H01L21/285 ,  H01L21/3205 ,  H01L21/78 ,  H01L23/00 ,  H01L23/498 ,  H01L23/552 ,  H01L23/66 ,  H01Q1/22 ,  H01Q1/38 ,  H01Q9/42

CPC分类号： H01Q1/526 ,  H01L21/027 ,  H01L21/268 ,  H01L21/2855 ,  H01L21/28568 ,  H01L21/32051 ,  H01L21/78 ,  H01L23/498 ,  H01L23/552 ,  H01L23/66 ,  H01L24/48 ,  H01Q1/2283 ,  H01Q1/2291 ,  H01Q1/38 ,  H01Q9/42 ,  H01L2223/6611 ,  H01L2223/6644 ,  H01L2223/6655 ,  H01L2223/6677 ,  H01L2224/48091 ,  H01L2924/01022 ,  H01L2924/01029 ,  H01L2924/1421 ,  H01L2924/1815 ,  H01L2924/19107 ,  H01L2924/3025

摘要： Aspects of this disclosure relate to methods of selectively shielded radio frequency modules. A radio frequency module can be provided with a radio frequency component and an antenna. A shielding layer can be formed over a portion of the radio frequency module such that the radio frequency component is shielded by the shielding layer and the antenna is unshielded by the shielding layer.

公开(公告)号：US11563267B2

公开(公告)日：2023-01-24

申请号：US17303135

申请日：2021-05-20

申请人： Skyworks Solutions, Inc.

发明人： Anthony James LoBianco ,  Hoang Mong Nguyen

IPC分类号： H05K1/02 ,  H05K3/30 ,  H01L23/00 ,  H01L23/552 ,  H01Q1/52 ,  H01L23/31 ,  H01Q1/38 ,  H01Q1/24 ,  H04B1/3883 ,  H04W52/02 ,  H01Q1/22

摘要： A method for providing electromagnetic shielding of a semiconductor die includes attaching a semiconductor die to a package substrate of a packaged radio frequency module, where the package substrate includes one or more radio frequency circuits fabricated therein. The method also includes encapsulating the semiconductor die with a molding compound. The method also includes at least partially covering the molding compound with an electromagnetic shielding structure having an outer layer including cobalt. A phone board assembly can include the packaged radio frequency module attached to a printed circuit board. The packaged radio frequency module can be incorporated into a mobile device.

公开(公告)号：US20210399423A1

公开(公告)日：2021-12-23

申请号：US17305647

申请日：2021-07-12

申请人： Skyworks Solutions, Inc.

发明人： Dinhphuoc Vu Hoang ,  Robert Francis Darveaux ,  Anthony James LoBianco ,  Lori Ann DeOrio ,  Hoang Mong Nguyen ,  Ki Wook Lee ,  Hardik Bhupendra Modi ,  Foad Arfaei Malekzadeh ,  Stephen Joseph Kovacic ,  René Rodriguez

IPC分类号： H01Q9/04 ,  B29C41/42 ,  H01Q5/35 ,  H01Q9/06

摘要： An antenna structure can include a printed circuit board module and a mold compound disposed on a side of the printed circuit board module. A planar antenna is defined by a conformal shield layer disposed on a first surface of the mold compound such that the mold compound is disposed between the printed circuit board module and the conformal shield layer. The thickness of the mold compound layer and the shape of the conformal shield layer can be varied to optimize a performance of the antenna.

公开(公告)号：US20210320081A1

公开(公告)日：2021-10-14

申请号：US17240661

申请日：2021-04-26

申请人： Skyworks Solutions, Inc.

发明人： Gregory Edward Babcock ,  Lori Ann DeOrio ,  Darren Roger Frenette ,  George Khoury ,  Anthony James LoBianco ,  Hoang Mong Nguyen ,  Leslie Paul Wallis

IPC分类号： H01L23/00 ,  H01L23/66 ,  H01L23/552 ,  H04B1/40 ,  H01L25/18

摘要： Packaged modules for use in wireless devices are disclosed. A substrate supports integrated circuit die including at least a portion of a baseband system and a front end system, an oscillator assembly, and an antenna. The oscillator assembly includes an enclosure to enclose the oscillator and conductive pillars formed at least partially within a side of the enclosure to conduct signals between the top and bottom surfaces of the oscillator assembly. Components can be vertically integrated to save space and reduce trace length. Vertical integration provides an overhang volume that can include discrete components. Radio frequency shielding and ground planes within the substrate shield the front end system and antenna from radio frequency interference. Stacked filter assemblies include passive surface mount devices to filter radio frequency signals.

公开(公告)号：US20190198990A1

公开(公告)日：2019-06-27

申请号：US16290137

申请日：2019-03-01

申请人： Skyworks Solutions, Inc.

发明人： Hoang Mong Nguyen ,  Anthony James LoBianco ,  Gregory Edward Babcock ,  Darren Roger Frenette ,  George Khoury ,  René Rodríguez

IPC分类号： H01Q1/52 ,  H01L21/268 ,  H01L21/027 ,  H01Q1/22 ,  H01Q9/42 ,  H01Q1/38 ,  H01L21/285 ,  H01L23/552 ,  H01L23/498 ,  H01L21/78 ,  H01L21/3205 ,  H01L23/66

摘要： Aspects of this disclosure relate to selectively shielded radio frequency modules. A radio frequency module can include a package substrate, a radio frequency component on the package substrate, a multi-layer antenna, a radio frequency shielding structure configured to provide shielding between the multi-layer antenna and the radio frequency component. The radio frequency shielding structure can include a shielding layer providing a shield over the radio frequency component and leaving the radio frequency module unshielded over the antenna.

公开(公告)号：US10163814B2

公开(公告)日：2018-12-25

申请号：US15486682

申请日：2017-04-13

申请人： Skyworks Solutions, Inc.

发明人： Matthew Sean Read ,  Hoang Mong Nguyen ,  Anthony James LoBianco ,  Howard E. Chen ,  Dinhphuoc Vu Hoang

IPC分类号： H01Q1/40 ,  H01L23/552 ,  H01L21/56 ,  H01L23/00 ,  H01L23/66 ,  H01Q1/52

摘要： Disclosed are devices and methods related to a conductive paint layer configured to provide radio-frequency (RF) shielding for a packaged semiconductor module. Such a module can include a packaging substrate, one or more RF components mounted on the packaging substrate, a ground plane disposed within the packaging substrate, and a plurality of RF-shielding wirebonds disposed on the packaging substrate and electrically connected to the ground plane. The module can further include an overmold structure formed over the packaging substrate and dimensioned to substantially encapsulate the RF component(s) and the RF-shielding wirebonds. The overmold structure can define an upper surface that exposes upper portions of the RF-shielding wirebonds. The module can further include a conductive paint layer having silver flakes disposed on the upper surface of the overmold structure so that the conductive paint layer, the RF-shielding wirebonds, and the ground plane form an RF-shield for the RF component(s).

公开(公告)号：US20180365365A1

公开(公告)日：2018-12-20

申请号：US16022413

申请日：2018-06-28

申请人： Skyworks Solutions, Inc.

发明人： Howard E. Chen ,  Matthew Sean Read ,  Hoang Mong Nguyen ,  Anthony James LoBianco ,  Guohao Zhang ,  Dinhphuoc Vu Hoang

IPC分类号： G06F17/50 ,  H05K1/18 ,  H01L23/00 ,  H01L21/56 ,  H01L23/66 ,  H01L23/552 ,  H01L23/498 ,  H01L23/58

摘要： Aspects of the present disclosure relate to determining a layout of a racetrack that forms part of an RF isolation structure of a packaged module and the resulting RF isolation structures. Locations of where the racetrack can be adjusted (for example, narrowed) and/or removed without significantly degrading the EMI performance of the RF isolation structure can be identified. In certain embodiments, a portion of the racetrack can be removed to create a break and/or a portion of the racetrack can be narrowed in a selected area.

公开(公告)号：US20170301986A1

公开(公告)日：2017-10-19

申请号：US15490436

申请日：2017-04-18

申请人： Skyworks Solutions, Inc.

发明人： Hoang Mong Nguyen ,  Anthony James LoBianco ,  Gregory Edward Babcock ,  Darren Roger Frenette ,  George Khoury ,  René Rodriguez

IPC分类号： H01Q1/52 ,  H01Q1/22 ,  H01Q1/38

CPC分类号： H01Q1/526 ,  H01L21/027 ,  H01L21/268 ,  H01L21/2855 ,  H01L21/28568 ,  H01L21/32051 ,  H01L21/78 ,  H01L23/498 ,  H01L23/552 ,  H01L23/66 ,  H01L24/48 ,  H01L2223/6611 ,  H01L2223/6644 ,  H01L2223/6677 ,  H01L2224/48091 ,  H01L2924/01022 ,  H01L2924/01029 ,  H01L2924/1421 ,  H01Q1/2283 ,  H01Q1/2291 ,  H01Q1/38 ,  H01Q9/42

摘要： Aspects of this disclosure relate to selectively shielded radio frequency modules. A radio frequency module can include a package substrate, a radio frequency component on the package substrate, a multi-layer antenna, a radio frequency shielding structure configured to provide shielding between the multi-layer antenna and the radio frequency component. The radio frequency shielding structure can include a shielding layer providing a shield over the radio frequency component and leaving the radio frequency module unshielded over the antenna.

公开(公告)号：US20170301985A1

公开(公告)日：2017-10-19

申请号：US15490346

申请日：2017-04-18

申请人： Skyworks Solutions, Inc.

发明人： Hoang Mong Nguyen ,  Anthony James LoBianco ,  Gregory Edward Babcock ,  Darren Roger Frenette ,  George Khoury

IPC分类号： H01Q1/52 ,  H01Q1/38 ,  H01Q1/22

CPC分类号： H01Q1/526 ,  H01L21/027 ,  H01L21/268 ,  H01L21/2855 ,  H01L21/28568 ,  H01L21/32051 ,  H01L21/78 ,  H01L23/498 ,  H01L23/552 ,  H01L23/66 ,  H01L24/48 ,  H01L2223/6611 ,  H01L2223/6644 ,  H01L2223/6677 ,  H01L2224/48091 ,  H01L2924/01022 ,  H01L2924/01029 ,  H01L2924/1421 ,  H01Q1/2283 ,  H01Q1/2291 ,  H01Q1/38 ,  H01Q9/42

摘要： Aspects of this disclosure relate to selectively shielded radio frequency modules. A radio frequency module can include a package substrate, a radio frequency shielding structure extending above the package substrate, a radio frequency component over the package substrate and in an interior of the radio frequency shielding structure, and an antenna on the package substrate external to the radio frequency shielding structure. The shielding structure can include a shielding layer providing a shield over the radio frequency component and leaving the radio frequency module unshielded over the antenna.

公开(公告)号：US09576911B2

公开(公告)日：2017-02-21

申请号：US14885897

申请日：2015-10-16

申请人： SKYWORKS SOLUTIONS, INC.

发明人： Anthony James LoBianco ,  Hoang Mong Nguyen

IPC分类号： H01L23/552 ,  H01L23/00 ,  H01L21/56 ,  H01L21/768 ,  H01L23/66 ,  H05K1/02 ,  H05K1/18 ,  H05K9/00 ,  H01L23/498 ,  H01L25/16 ,  H01L23/538

CPC分类号： H01L23/552 ,  H01L21/56 ,  H01L21/561 ,  H01L21/76838 ,  H01L23/49838 ,  H01L23/538 ,  H01L23/66 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/97 ,  H01L25/16 ,  H01L2223/6611 ,  H01L2223/6677 ,  H01L2224/32225 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48105 ,  H01L2224/48175 ,  H01L2224/48227 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/12042 ,  H01L2924/141 ,  H01L2924/15192 ,  H01L2924/181 ,  H01L2924/19105 ,  H01L2924/19107 ,  H01L2924/3025 ,  H05K1/0216 ,  H05K1/0218 ,  H05K1/185 ,  H05K9/00 ,  H05K9/0088 ,  H01L2924/00012 ,  H01L2224/85 ,  H01L2924/00 ,  H01L2224/85399 ,  H01L2224/05599

摘要： A radio frequency (RF) module comprises an electrical reference, or ground, plane to which one or more RF devices disposed on the module are electrically coupled, and may be disposed beneath the RF devices. The reference plane may be segmented as to form one or more segments of the reference plane that are at least partially electrically isolated from surrounding segments or devices. A module may have a plurality of devices disposed thereon, wherein separate, at least partially isolated reference planes, correspond to different devices of the module. The reference plane may be etched or cut to achieve such segmentation.

摘要翻译： 射频（RF）模块包括电参考或接地平面，一个或多个设置在该模块上的RF器件电耦合到该平面，并且可以设置在RF器件的下方。 参考平面可以被分段成形成至少部分地与周围段或装置电隔离的参考平面的一个或多个段。 模块可以具有设置在其上的多个设备，其中分离的至少部分隔离的参考平面对应于模块的不同设备。 可以蚀刻或切割参考平面以实现这种分割。