公开(公告)号：US20240365522A1

公开(公告)日：2024-10-31

申请号：US18641747

申请日：2024-04-22

Applicant: Drexel University ,  Korea Institute of Science and Technology

Inventor： Yury Gogotsi ,  Babak Anasori ,  Mohamed H. Alhabeb ,  Christine B. Hatter ,  Chong Min Koo ,  Soon Man Hong ,  Faisal Shahzad

IPC: H05K9/00 ,  C01B32/921 ,  H01B1/20 ,  H01L23/29 ,  H01L23/552

CPC classification number: H05K9/0088 ,  H01B1/20 ,  H01L23/295 ,  H01L23/552 ,  H05K9/0084 ,  C01B32/921 ,  C01P2002/20 ,  C01P2002/72 ,  C01P2004/03 ,  C01P2004/04 ,  C01P2006/40 ,  H01L2924/3025

Abstract: The present disclosure is directed to materials which provide electromagnetic shielding and methods of providing such electromagnetic shielding. In particular, the present disclosure describes the use of two-dimensional transition metal carbide, nitride, and carbonitride materials for this purpose.

公开(公告)号：US20240349469A1

公开(公告)日：2024-10-17

申请号：US18633315

申请日：2024-04-11

Applicant: David Horinek

Inventor： David Horinek

IPC: H05K9/00

CPC classification number: H05K9/0088

Abstract: An infrared cloaking material includes a copper-coated fabric and a layer of zinc oxide. The copper-coated fabric includes an inner layer of copper, a layer of fabric, and an outer layer of copper as the layer of fabric is composed of an inner fabric surface and an outer fabric surface. The inner fabric surface and the outer fabric surface being positioned opposite of each other about the layer of fabric. The inner layer of copper is superimposed onto and across the inner fabric surface. The outer layer of copper is superimposed onto and across the outer fabric surface. The layer of zinc oxide is positioned adjacent to the inner layer of copper, opposite of the layer of fabric as the layer of zinc oxide is superimposed onto and across the inner layer of copper.

公开(公告)号：US20240292583A1

公开(公告)日：2024-08-29

申请号：US18648787

申请日：2024-04-29

Applicant: FUJIFILM Corporation

Inventor： Kiyotaka FUKAGAWA

IPC: H05K9/00

CPC classification number: H05K9/0083 ,  H05K9/0088

Abstract: There are provided an electromagnetic wave shielding material including one or more magnetic layers containing magnetic particles and a resin, in which a peak top temperature of a loss tangent Tan δ in a dynamic viscoelasticity measurement at 1 Hz is 0° C. or higher and lower than 60° C., as well as an electronic component and an electronic apparatus which include the electromagnetic wave shielding material.

公开(公告)号：US20240237316A9

公开(公告)日：2024-07-11

申请号：US18048495

申请日：2022-10-21

Applicant: NXP B.V.

Inventor： Philipp Franz Freidl ,  Mustafa Acar ,  Antonius Hendrikus Jozef Kamphuis ,  Erik Daniel Björk ,  Konstantinos Giannakidis ,  Jan Willem Bergman ,  Rajesh Mandamparambil ,  Paul Mattheijssen

IPC: H05K9/00 ,  H01L23/552

CPC classification number: H05K9/0032 ,  H01L23/552 ,  H05K9/0088

Abstract: One example discloses an on-chip shielded device, including: a planar structure including a substrate and a passivation layer; an electrical component formed within the substrate and coupled to an input signal path and an output signal path; a first shielding element positioned above the electrical component and the passivation layer; and a second shielding element positioned above the electrical component, the passivation layer and the first shielding element.

公开(公告)号：US12029020B2

公开(公告)日：2024-07-02

申请号：US18321096

申请日：2023-05-22

Applicant: Dan Miulli ,  James Garvin Wiginton, IV ,  James Brazdzionis ,  Paras Savla

Inventor： Dan Miulli ,  James Garvin Wiginton, IV ,  James Brazdzionis ,  Paras Savla

IPC: H05K9/00 ,  G01R29/08

CPC classification number: H05K9/0088 ,  H05K9/009 ,  G01R29/0878

Abstract: A multilayer electromagnetic shielding system providing two stacks spaced apart by an air gap, wherein each stack has an electric-field-attenuating layer adhered to a magnetic-field-attenuating layer. An electromagnetically inert material may sandwich the spaced apart stacks for insulative and structural purposes.

公开(公告)号：US12028966B2

公开(公告)日：2024-07-02

申请号：US18060708

申请日：2022-12-01

Applicant: Marvell Asia Pte, Ltd.

Inventor： Shaowu Huang ,  Dance Wu

IPC: H05K1/02 ,  H05K1/18 ,  H05K9/00

CPC classification number: H05K1/0231 ,  H05K1/181 ,  H05K9/0024 ,  H05K9/0088 ,  H05K2201/10371

Abstract: A printed circuit board (PCB) and a method of manufacturing the same is described. The PCB includes a substrate defining a major plane and an integrated electromagnetic interference and compatibility (EMC/EMI) shielding enclosure configured to enclose the substrate. The shielding enclosure includes a metallic top layer deposited on top of the major plane of the substrate so as to envelop an uppermost layer of the substrate, a metallic bottom layer deposited on bottom of the major plane of the substrate so as to envelop a bottommost layer of the substrate, and a metallic side layer formed along a length of one or more edges of the substrate to electrically connect the metallic top layer and the metallic bottom layer.

公开(公告)号：US20240196580A1

公开(公告)日：2024-06-13

申请号：US18584752

申请日：2024-02-22

Applicant: Microsoft Technology Licensing, LLC

Inventor： Jesse William SANDERS

IPC: H05K9/00 ,  B29C70/88 ,  B32B7/12 ,  B32B15/20

CPC classification number: H05K9/0088 ,  B29C70/882 ,  B32B7/12 ,  B32B15/20 ,  H05K9/0041 ,  H05K9/0043 ,  H05K9/0086

Abstract: Described herein is electromagnetic shielding that is configured to attenuate electromagnetic interference (EMI) by at least a threshold amount when the EMI has a frequency within a predefined frequency range. The electromagnetic shielding includes a layer of metal, such as aluminum foil, and a layer of thermoplastic polymer fabric (such as woven polyethylene fabric), where the electromagnetic shielding has several apertures that extend therethrough. The electromagnetic shielding is at least partially draped over electronic equipment that is to be shielded from EMI.

公开(公告)号：US20240098954A1

公开(公告)日：2024-03-21

申请号：US18273626

申请日：2022-01-21

Applicant: Maxell, Ltd.

Inventor： Masayuki TOYODA ,  Masao FUJITA

IPC: H05K9/00

CPC classification number: H05K9/0088 ,  H05K9/0094

Abstract: The present invention realizes an electric-wave absorber of a so-called electric-wave interference type, which can favorably absorb absorption electric waves of a desired frequency even when a protective layer for protecting an electric resistance film is formed on the surface of the electric resistance film, and a manufacturing method for the electric-wave absorber. In an electric-wave absorber of an electric-wave interference type, which is formed by sequentially stacking an electric resistance film 1, a dielectric layer 2, and an electric-wave shielding layer 3, absorption electric waves to be absorbed by the electric-wave absorber are waves in a high frequency band in or above a millimeter-wave band, a protective layer 4 is included on the electric resistance film, and a thickness of the dielectric layer is smaller than a reference thickness dst obtained according to the frequency of the absorption electric waves and the permittivity of the dielectric layer.

公开(公告)号：US20240098953A1

公开(公告)日：2024-03-21

申请号：US18240997

申请日：2023-08-31

Applicant: Laird Technologies (Shenzhen) Co. Ltd.

Inventor： Tsang-I TSAI ,  Yunxi SHE ,  Dong-Xiang LI ,  Jie-Sheng CHEN ,  Min-Wei HSU

IPC: H05K9/00 ,  B60L50/64

CPC classification number: H05K9/0088 ,  B60L50/64

Abstract: This application discloses electromagnetic energy mitigation assemblies and automotive vehicle components comprising the electromagnetic energy mitigation assemblies. An electromagnetic energy mitigation assembly includes a first electrically conductive layer and a second electrically conductive layer. First and second permalloy layers are along respective first and second opposite sides of the first electrically conductive layer. Third and fourth permalloy layers are along respective third and fourth opposite sides of the second electrically conductive layer. An electromagnetic noise suppression layer is sandwiched between the second and third permalloy layers. An automotive vehicle component includes an electromagnetic energy mitigation assembly configured to be positioned relative to one or more batteries of an automotive vehicle for providing electromagnetic shielding for the one or more batteries. The electromagnetic energy mitigation assembly includes a first electrically conductive layer. First and second permalloy layers are along respective first and second opposite sides of the first electrically conductive layer.

公开(公告)号：US11937365B2

公开(公告)日：2024-03-19

申请号：US17256931

申请日：2019-07-05

Applicant: Tatsuta Electric Wire & Cable Co., Ltd.

Inventor： Sougo Ishioka ,  Masahiro Watanabe

IPC: H05K1/02 ,  H05K9/00

CPC classification number: H05K1/023 ,  H05K9/0088 ,  H05K2201/0715

Abstract: An affixation film 101 for a printed wiring board includes a circuit pattern concealing layer 112, and an adhesive layer 111 put on top of the circuit pattern concealing layer 112. An opposite surface of the circuit pattern concealing layer 112 from the adhesive layer 111 has an Rku of 2.5-3.0.