-
1.发明授权公开(公告)号：US12199333B2
公开(公告)日：2025-01-14
申请号：US17649725
申请日：2022-02-02
Applicant: NXP B.V.
Inventor： Antonius Hendrikus Jozef Kamphuis , Jan Willem Bergman , Marcellinus Johannes Maria Geurts , Mustafa Acar , Paul Mattheijssen , Rajesh Mandamparambil , Andrei-Alexandru Damian , Amar Ashok Mavinkurve
IPC: H01Q1/22 , H01L23/60 , H01L25/00 , H01L25/065 , H01Q9/04
Abstract: A semiconductor device comprising a substrate, a first integrated circuit package mounted on the substrate, the first integrated circuit package comprising a first antenna sub-array having a uniform pitch, and a second integrated circuit package mounted on the substrate, the second integrated circuit package comprising a second antenna sub-array having a uniform pitch. The second integrated circuit package is mounted adjacent to the first integrated circuit package to form a multi-package module having an antenna array formed of the first antenna sub-array and the second antenna sub-array, wherein the antenna array has a uniform pitch. Also provided is a method of manufacturing a multi-package module and a method of providing package-to-package grounding.
-
公开(公告)号：US20240347928A1
公开(公告)日：2024-10-17
申请号：US18600833
申请日：2024-03-11
Applicant: NXP B.V.
Inventor： Mustafa Acar , Zhiwei Gong , Robert Joseph Wenzel , Tingdong Zhou
CPC classification number: H01Q21/065 , H01Q9/0414 , H01Q21/0087
Abstract: An antenna package and method of manufacturing an antenna package is disclosed. The antenna package includes a first substrate and second substrate in a stacked arrangement. A first plurality of patch antennas and a plurality of decoupling capacitors is arranged on a first major surface of the first substrate. One or more decoupling capacitor of the plurality of decoupling capacitors is located between adjacent patch antennas of the first plurality of patch antennas. The second substrate includes a second plurality of patch antennas. One or more decoupling capacitors of the plurality of decoupling capacitors includes a first terminal configured to be in contact with the first substrate and a second terminal configured to be in contact with the first substrate and the second substrate.
-
公开(公告)号：US12009565B2
公开(公告)日：2024-06-11
申请号：US17314219
申请日：2021-05-07
Applicant: NXP B.V.
Inventor： Olivier Tesson , Mustafa Acar
CPC classification number: H01P5/16 , H01L23/66 , H01P11/003 , H03H7/461 , H01L2223/6627
Abstract: A power combiner/splitter for multiple input multiple output (MIMO) applications and a method of making the same. A metallisation stack has a plurality of layers including patterned metal features forming first and second branched arrangements of the power combiner/splitter. Each branched arrangement includes a port located at one end of that branched arrangement, and a plurality of further ports. Each branched arrangement also includes a plurality of bifurcated branches extending between each end of that branched arrangement for dividing/combining a signal passing through that branched arrangement between the port and the plurality of further ports. The metallisation stack further includes a common ground plane that is shared by the first and second branched arrangements. At least some of the patterned metal features forming the first branched arrangement overlie at least some of the patterned metal features forming the second branched arrangement.
-
公开(公告)号：US20230268667A1
公开(公告)日：2023-08-24
申请号：US18161315
申请日：2023-01-30
Applicant: NXP B.V.
Inventor： Mustafa Acar , Lucas Maria Florentinus De Maaijer , Paul Mattheijssen
CPC classification number: H01Q21/065 , H01Q3/247 , H01Q21/08
Abstract: A phased-array antenna system includes a substrate and a plurality of sub-arrays. Each sub-array comprises an array of patch antennas arranged on a first major surface of the substrate; a plurality of beamformer devices coupled to the array of patch antennas; a multi-channel up-down converter (UDC) and a combiner-splitter coupled to the multi-channel UDC. The combiner-splitter is configured to split a signal provided by the UDC and provide the signal to each of the plurality of beamformers and/or to combine signal provided by the plurality of beamformers and to provide the combined signal to the UDC. Each sub-array also includes an integrated device comprising the multi-channel UDC and the combiner-splitter. The integrated device and the plurality of beamformer devices is arranged on a second major surface of the substrate opposite the first major surface. The integrated device is arranged between at least two beamformer devices.
-
公开(公告)号：US20230170945A1
公开(公告)日：2023-06-01
申请号：US18052965
申请日：2022-11-07
Applicant: NXP B.V.
Inventor： Lucas Maria Florentinus De Maaijer , Mustafa Acar , Paul Mattheijssen
IPC: H04B7/0413 , H04B7/10 , H01Q21/24
CPC classification number: H04B7/0413 , H04B7/10 , H01Q21/24
Abstract: A multiple-input multiple-output (MIMO) antenna system for a mobile cellular network and method is described. The MIMO antenna system includes an array of dual-polarization patch antennas each having first and second polarization feed-points. A signal is transmitted via the first polarization feed-point of a dual-polarisation patch antennas and a replica of the transmitted signal is sensed (detected) using the second polarization feed-point of the same patch antenna. This replica signal is used by a digital predistortion module to apply predistortion to a subsequently transmitted signal.
-
Patent Agency Ranking
公开(公告)号：US20230008852A1
公开(公告)日：2023-01-12
申请号：US17809978
申请日：2022-06-30
Applicant: NXP B.V.
Abstract: A transmission line. The transmission line includes a reference electrode. The transmission line also includes a stripline. The stripline meanders within a plane. The stripline has a non-planar profile when viewed along a direction parallel to the plane.
-
公开(公告)号：US08963586B2
公开(公告)日：2015-02-24
申请号：US14172256
申请日：2014-02-04
Applicant: NXP B.V.
Inventor： Mustafa Acar , Katarzyna Nowak
IPC: H03K3/00 , H03B1/00 , H03K19/0185 , H03K19/003
CPC classification number: H03K19/018521 , H03K19/00315 , H03K19/018528
Abstract: A power stage has a differential output stage 2 driven by one or more buffer stages 4. The buffer stages 4 are implemented as high and low side buffers 12,14, each of which is itself a differential buffer implemented using transistors formed in an isolated-well technology such as triple-well CMOS.
Abstract translation: 功率级具有由一个或多个缓冲级4驱动的差分输出级2.缓冲级4被实现为高侧缓冲器12和低侧缓冲器12,14，每个缓冲器本身都是使用形成在隔离级中的晶体管实现的差分缓冲器， 良好的技术，如三阱CMOS。
-
公开(公告)号：US12114472B2
公开(公告)日：2024-10-08
申请号：US18059611
申请日：2022-11-29
Applicant: NXP B.V.
Inventor： Philipp Franz Freidl , Mustafa Acar , Antonius Hendrikus Jozef Kamphuis , Jan Willem Bergman
CPC classification number: H05K9/0081 , H01P3/08 , H01Q1/526 , H05K9/0037
Abstract: A Radio Frequency, “RF”, component and a method of making the same. The component includes a first electrically conductive signal member for conveying an RF signal and a second electrically conductive signal member for conveying an RF signal. The component also includes a barrier located between the first signal member and the second signal member electromagnetically to shield the first and second signal members from each other. The barrier includes a first row of electrically conductive shielding members spaced apart along a longitudinal axis of the first row, and a second row of electrically conductive shielding members spaced apart along a longitudinal axis of the second row. Each shielding member includes a polyhedron. The shielding members of the first row are offset with respect to the shielding members of the second row to prevent a direct line of sight between the first signal member and the second signal member.
-
公开(公告)号：US20240098906A1
公开(公告)日：2024-03-21
申请号：US18459759
申请日：2023-09-01
Applicant: NXP B.V.
Inventor： Xin Yang , Mustafa Acar , Zhe Chen , Dominicus MARTINUS WILHELMUS Leenaerts
CPC classification number: H05K3/3405 , H05K1/0233 , H05K1/025 , H05K2201/10053
Abstract: A circuit comprising: a digital attenuator part comprising: a first and second attenuator terminal; a first inductor having a first terminal coupled to the first attenuator terminal and a second terminal coupled to the second attenuator terminal; a first switched arrangement comprising a first switch having a first switch-terminal and a second switch-terminal, wherein the first switch-terminal is coupled to the first terminal of the first inductor, and a first resistor and a first capacitor are arranged in parallel, coupled between the second switch-terminal and a reference voltage; and a second switched arrangement comprising a second switch having a first switch-terminal and a second switch-terminal, wherein the first switch-terminal is coupled to the second terminal of the first inductor, and wherein a second resistor and a second capacitor are arranged in parallel and coupled between the second switch-terminal and the reference voltage.
-
公开(公告)号：US20230387985A1
公开(公告)日：2023-11-30
申请号：US18306391
申请日：2023-04-25
Applicant: NXP B.V.
Inventor： Paul Mattheijssen , Mustafa Acar , Lucas Maria Florentinus De Maaijer
IPC: H04B7/06 , H04B7/0426
CPC classification number: H04B7/0617 , H04B7/0426
Abstract: A beamformer device for a multiple-input, multiple-output (MIMO) antenna system and method of operating a beamformer device is described. the beamformer device includes a number of beamformer channels. Each beamformer channel includes a RF terminal, an antenna connection terminal; and a power detector having a power detector output, The beamformer device includes a digital control interface comprising a serial data input and a serial data output; a control input coupled to the serial data input; and a beamformer monitor output configured to be selectively coupled to either the serial data output or the power detector output of one of the beamformer channels.
-
-
-
-
-
-
-
-
-
Search Results
38
records
(took 0.014 seconds)
