公开(公告)号：US20160307830A1

公开(公告)日：2016-10-20

申请号：US15193000

申请日：2016-06-24

申请人： Alpha and Omega Semiconductor Incorporated

发明人： Yueh-Se Ho ,  Hamza Yilmaz ,  Yan Yun Xue ,  Jun Lu

IPC分类号： H01L23/495 ,  H01L23/00

CPC分类号： H01L23/49575 ,  H01L23/49503 ,  H01L23/49513 ,  H01L23/49524 ,  H01L23/49555 ,  H01L23/49558 ,  H01L23/49562 ,  H01L23/49568 ,  H01L24/36 ,  H01L24/37 ,  H01L24/40 ,  H01L24/41 ,  H01L24/48 ,  H01L24/49 ,  H01L27/088 ,  H01L2224/05554 ,  H01L2224/0603 ,  H01L2224/371 ,  H01L2224/40095 ,  H01L2224/40245 ,  H01L2224/48137 ,  H01L2224/48245 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/49111 ,  H01L2224/49171 ,  H01L2224/73221 ,  H01L2224/8385 ,  H01L2224/8485 ,  H01L2924/00014 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099 ,  H01L2224/85399 ,  H01L2224/05599

摘要： A combined packaged power semiconductor device includes flipped top source low-side MOSFET electrically connected to top surface of a die paddle, first metal interconnection plate connecting between bottom drain of a high-side MOSFET or top source of a flipped high-side MOSFET to bottom drain of the low-side MOSFET, and second metal interconnection plate stacked on top of the high-side MOSFET chip. The high-side, low-side MOSFET and the IC controller can be packaged three-dimensionally reducing the overall size of semiconductor devices and can maximize the chip's size within a package of the same size and improves the performance of the semiconductor devices. The top source of flipped low-side MOSFET is connected to the top surface of the die paddle and thus is grounded through the exposed bottom surface of die paddle, which simplifies the shape of exposed bottom surface of the die paddle and maximizes the area to facilitate heat dissipation.

公开(公告)号：US20160307829A1

公开(公告)日：2016-10-20

申请号：US15195466

申请日：2016-06-28

申请人： TOYOTA JIDOSHA KABUSHIKI KAISHA

发明人： Takuya KADOGUCHI ,  Tatsuya MIYOSHI ,  Takanori KAWASHIMA ,  Tomomi OKUMURA

IPC分类号： H01L23/495 ,  H01L23/00 ,  H01L23/31

CPC分类号： H01L23/49562 ,  H01L22/34 ,  H01L23/3114 ,  H01L23/4334 ,  H01L23/492 ,  H01L23/495 ,  H01L23/4951 ,  H01L23/4952 ,  H01L23/49537 ,  H01L23/49541 ,  H01L23/49551 ,  H01L23/49555 ,  H01L23/49568 ,  H01L23/49575 ,  H01L24/37 ,  H01L24/40 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/85 ,  H01L25/072 ,  H01L25/16 ,  H01L25/18 ,  H01L2224/371 ,  H01L2224/37147 ,  H01L2224/40095 ,  H01L2224/40137 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/49171 ,  H01L2224/73221 ,  H01L2224/73263 ,  H01L2224/73265 ,  H01L2224/83801 ,  H01L2224/84801 ,  H01L2224/859 ,  H01L2924/00014 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099

摘要： A problem to be solved is to provide a lead frame and a power module having high material yield.A lead frame includes a plurality of first leads extending to one side of an area in which a semiconductor device is disposed in a planar view; a plurality of second leads extending to another side that is opposite the one side of the area in which the semiconductor device is disposed in a planar view; a third lead arranged outside of one of the plurality of first leads positioned at an edge of the plurality of first leads in a planar view; and a wiring part that is connected to the third lead, acts as a part of a guide frame of the plurality of first leads, the plurality of second leads, and the third lead, and acts as a wiring connected to the third lead after parts of the guide frame other than the part of the guide frame have been cut off.

摘要翻译： 引线框架包括延伸到其中半导体器件在平面图中设置的区域的一侧的多个第一引线; 多个第二引线延伸到在平面图中与半导体器件设置的区域的一侧相对的另一侧; 第三引线，布置在平面图中位于所述多个第一引线的边缘的所述多个第一引线中的一个之外; 以及连接到第三引线的布线部分，用作多个第一引线，多个第二引线和第三引线的引导框架的一部分，并且用作连接到第三引线的布线部件 引导框架除了引导框架的一部分已被切断。

公开(公告)号：US09474180B2

公开(公告)日：2016-10-18

申请号：US13962428

申请日：2013-08-08

申请人： SEIKO EPSON CORPORATION

发明人： Tetsuya Otsuki

IPC分类号： H05K5/02 ,  H05K7/14 ,  H01L23/495 ,  H01L23/00

CPC分类号： H01L23/49575 ,  H01L23/49537 ,  H01L23/49551 ,  H01L23/49555 ,  H01L24/16 ,  H01L24/32 ,  H01L24/33 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/0554 ,  H01L2224/0557 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/4809 ,  H01L2224/48095 ,  H01L2224/48105 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/49171 ,  H01L2224/73204 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/01079 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： A method of manufacturing an electronic device, the method includes: preparing a first lead frame having a first lead, the first lead having a first portion located in a first region; electrically connecting the first lead and a first electronic part; bending the first lead such that the first portion is located outside the first region; arranging a second lead frame to overlap the first lead frame such that a second portion of a second lead of the second lead frame is located in the first region; and electrically connecting the second lead and the second electronic part.

公开(公告)号：US20160300776A1

公开(公告)日：2016-10-13

申请号：US15184560

申请日：2016-06-16

申请人： ROHM CO., LTD.

发明人： Shoji YASUNAGA ,  Akihiro KOGA

IPC分类号： H01L23/373 ,  H01L23/367 ,  H01L23/495 ,  H01L23/31

CPC分类号： H01L23/3731 ,  H01L23/3107 ,  H01L23/3142 ,  H01L23/367 ,  H01L23/4334 ,  H01L23/49503 ,  H01L23/49548 ,  H01L23/49555 ,  H01L23/49568 ,  H01L23/49575 ,  H01L23/52 ,  H01L24/06 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/78 ,  H01L24/85 ,  H01L2224/04042 ,  H01L2224/05552 ,  H01L2224/05553 ,  H01L2224/05644 ,  H01L2224/0603 ,  H01L2224/27013 ,  H01L2224/29101 ,  H01L2224/29339 ,  H01L2224/32245 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48139 ,  H01L2224/48195 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/48472 ,  H01L2224/48997 ,  H01L2224/4903 ,  H01L2224/49171 ,  H01L2224/49505 ,  H01L2224/73265 ,  H01L2224/78301 ,  H01L2224/83385 ,  H01L2224/85045 ,  H01L2224/85181 ,  H01L2224/85439 ,  H01L2224/85951 ,  H01L2924/12042 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/18301 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/351 ,  H01L2924/00014 ,  H01L2924/20753 ,  H01L2924/2076 ,  H01L2924/014 ,  H01L2924/00012 ,  H01L2924/00

摘要： A semiconductor device includes two or more semiconductor elements, a lead with island portions on which the semiconductor elements are mounted, a heat dissipation member for dissipating heat from the island portions, a bonding layer bonding the island portions and the heat dissipation member, and a sealing resin covering the semiconductor elements, the island portions and a part of the heat dissipation member. The bonding layer includes mutually spaced individual regions provided for the island portions, respectively.

摘要翻译： 半导体器件包括两个或更多个半导体元件，其上安装有半导体元件的岛部的引线，用于从岛部散发热的散热构件，将岛部和散热构件接合的接合层，以及 覆盖半导体元件的密封树脂，岛部和散热构件的一部分。 接合层分别包括为岛部设置的相互间隔开的各个区域。

公开(公告)号：US09466557B2

公开(公告)日：2016-10-11

申请号：US14984082

申请日：2015-12-30

申请人： STMICROELECTRONICS (SHENZHEN) R&D CO., LTD.

发明人： Jing-En Luan

IPC分类号： H01L23/495 ,  H01L23/00 ,  H01L23/48 ,  H01L23/433 ,  H01L23/367 ,  H01L23/498 ,  H01L23/28 ,  H01L23/31 ,  H01L21/56

CPC分类号： H01L23/49531 ,  H01L21/56 ,  H01L21/561 ,  H01L21/76885 ,  H01L23/28 ,  H01L23/3107 ,  H01L23/3114 ,  H01L23/3675 ,  H01L23/4334 ,  H01L23/481 ,  H01L23/482 ,  H01L23/49503 ,  H01L23/49513 ,  H01L23/49541 ,  H01L23/49548 ,  H01L23/49555 ,  H01L23/49568 ,  H01L23/49575 ,  H01L23/49805 ,  H01L23/49827 ,  H01L23/49838 ,  H01L24/03 ,  H01L24/05 ,  H01L24/06 ,  H01L24/09 ,  H01L24/16 ,  H01L24/33 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L24/85 ,  H01L24/92 ,  H01L2224/03003 ,  H01L2224/03334 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/04105 ,  H01L2224/0603 ,  H01L2224/06102 ,  H01L2224/06131 ,  H01L2224/06135 ,  H01L2224/06136 ,  H01L2224/06177 ,  H01L2224/09151 ,  H01L2224/12105 ,  H01L2224/16238 ,  H01L2224/32221 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48106 ,  H01L2224/48245 ,  H01L2224/48247 ,  H01L2224/49175 ,  H01L2224/73207 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2224/81815 ,  H01L2224/85 ,  H01L2224/92127 ,  H01L2224/92242 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2224/05599 ,  H01L2224/81 ,  H01L2924/00012

摘要： An electronic device may include leads, an IC having first and second bond pads, and an encapsulation material adjacent the leads and the IC so the leads extend to a bottom surface of the encapsulation material defining first contact pads. The electronic device may include bond wires between the first bond pads and corresponding ones of the leads, and conductors extending from corresponding ones of the second bond pads to the bottom surface of the encapsulation material defining second contact pads.

公开(公告)号：US20160284633A1

公开(公告)日：2016-09-29

申请号：US15174208

申请日：2016-06-06

申请人： International Business Machines Corporation

发明人： Ai Kiar Ang ,  Michael Lauri

IPC分类号： H01L23/495 ,  H01L21/48

CPC分类号： H05K1/11 ,  H01L21/4839 ,  H01L23/49537 ,  H01L23/49555 ,  H01L23/49565 ,  H01L23/49575 ,  H01L25/105 ,  H01L25/50 ,  H01L2225/1029 ,  H01L2924/181 ,  H05K1/0313 ,  H05K1/144 ,  H05K1/18 ,  H05K1/181 ,  H05K3/328 ,  H05K3/341 ,  H05K3/3421 ,  H05K3/3426 ,  H05K2201/10015 ,  H05K2201/10227 ,  H05K2201/10515 ,  H05K2201/1053 ,  H05K2201/10962 ,  Y02P70/613 ,  H01L2924/00012

摘要： A method includes forming a multi-stacked electronic device having two or more electronic components, each of the electronic components includes a leadframe, the leadframes of each electronic component are physically joined together using a non-solder metal joining process to form a joint, and the joint is located outside a solder connection region.

公开(公告)号：US09437508B2

公开(公告)日：2016-09-06

申请号：US14381133

申请日：2013-03-06

申请人： Panasonic Corporation

发明人： Zyunya Tanaka ,  Masanori Minamio

IPC分类号： H01L23/48 ,  H01L23/04 ,  H01L23/433 ,  H01L23/495 ,  H01L25/11 ,  H01L21/52 ,  H01L23/31 ,  H01L23/00 ,  H01L21/60

CPC分类号： H01L23/041 ,  H01L21/52 ,  H01L23/3107 ,  H01L23/4334 ,  H01L23/49555 ,  H01L23/49562 ,  H01L23/49575 ,  H01L24/06 ,  H01L24/09 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L25/115 ,  H01L2021/60015 ,  H01L2224/04042 ,  H01L2224/0603 ,  H01L2224/29111 ,  H01L2224/32245 ,  H01L2224/45014 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48139 ,  H01L2224/48247 ,  H01L2224/4903 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2224/80801 ,  H01L2924/01029 ,  H01L2924/0105 ,  H01L2924/12042 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/30107 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/01047

摘要： In a method for manufacturing a semiconductor device according to the present invention, as shown in FIG. 2(A), a case (2) including a first terminal (1) is placed on a working table (3) with an opening (30) formed at the bottom of the case (2). Subsequently, as shown in FIG. 2(B), a plurality of packages (6,6,6) including second terminals (4) are placed on the working table (3) through the opening (30) of the case (2), forming a clearance (31) between the first terminal (1) and the second terminal (4). As shown in FIG. 2(C), a bonding material (7) is disposed in the clearance (31) so as to electrically connect the first terminal (1) and the second terminal (4). Thus, the exposed surfaces of the packages (6,6,6) in the opening (30) of the case (2) are aligned at the same height, thereby reducing variations in thermal resistance among the packages (6,6,6).

摘要翻译： 在本发明的半导体装置的制造方法中，如图1所示， 如图2（A）所示，包括第一端子（1）的壳体（2）被放置在工作台（3）上，开口（30）形成在壳体（2）的底部。 随后，如图3所示。 如图2（B）所示，包括第二端子（4）的多个包装件（6,6,6）通过壳体（2）的开口（30）放置在工作台（3）上，形成间隙（31） 在第一端子（1）和第二端子（4）之间。 如图所示。 如图2（C）所示，在间隙（31）中设置接合材料（7），以使第一端子（1）和第二端子（4）电连接。 因此，壳体（2）的开口（30）中的包装（6,6,6）的暴露表面以相同的高度排列，从而减少包装（6,6,6）之间的热阻变化， 。

公开(公告)号：US09391006B2

公开(公告)日：2016-07-12

申请号：US14804021

申请日：2015-07-20

申请人： Mitsubishi Electric Corporation

发明人： Yazhe Wang

IPC分类号： H01L21/00 ,  H01L23/495 ,  H01L23/31 ,  H01L21/56 ,  H01L23/367 ,  H01L23/00 ,  H01L23/36 ,  H01L25/16

CPC分类号： H01L23/49541 ,  H01L21/56 ,  H01L23/31 ,  H01L23/3107 ,  H01L23/3135 ,  H01L23/36 ,  H01L23/3675 ,  H01L23/49537 ,  H01L23/49551 ,  H01L23/49555 ,  H01L23/49575 ,  H01L24/48 ,  H01L24/83 ,  H01L24/85 ,  H01L25/16 ,  H01L2224/05599 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48106 ,  H01L2224/48245 ,  H01L2224/73265 ,  H01L2224/85447 ,  H01L2224/8547 ,  H01L2924/00014 ,  H01L2924/1301 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099

摘要： A semiconductor device includes a functional block unit, external terminals and, and an external resin sealing body. The functional block unit includes an internal resin sealing body having an edge and an opposite edgeb. The edge side of the internal resin sealing body covers a first end of an internal terminal, but does not cover a second end of the internal terminal. The edge side of the internal resin sealing body covers a first end of an internal terminal, but does not cover a second end of the internal terminal. The external resin sealing body covers the root portion and a portion of the middle portion of the external terminal, but does not cover the terminal portion of the external terminal. The functional block unit and the external terminals and are integrally connected together and sealed by the external resin sealing body.

摘要翻译： 半导体器件包括功能块单元，外部端子和外部树脂密封体。 功能块单元包括具有边缘和相对边缘的内部树脂密封体。 内部树脂密封体的边缘侧覆盖内部端子的第一端，但不覆盖内部端子的第二端。 内部树脂密封体的边缘侧覆盖内部端子的第一端，但不覆盖内部端子的第二端。 外部树脂密封体覆盖外部端子的根部部分和中间部分的一部分，但不覆盖外部端子的端子部分。 功能块单元和外部端子一体地连接在一起并由外部树脂密封体密封。

公开(公告)号：US20160148859A1

公开(公告)日：2016-05-26

申请号：US14862102

申请日：2015-09-22

申请人： Renesas Electronics Corporation

发明人： Akira MUTO ,  Koji BANDO ,  Yukihiro SATO ,  Kazuhiro MITAMURA

IPC分类号： H01L23/495 ,  H01L21/56 ,  H01L23/31 ,  H01L23/00

CPC分类号： H01L23/49575 ,  B60L3/003 ,  B60L11/1803 ,  B60L15/007 ,  B60L2220/12 ,  B60L2240/525 ,  H01L21/56 ,  H01L23/3107 ,  H01L23/49513 ,  H01L23/49524 ,  H01L23/49537 ,  H01L23/49541 ,  H01L23/49555 ,  H01L23/49562 ,  H01L23/49565 ,  H01L23/544 ,  H01L23/564 ,  H01L24/32 ,  H01L24/33 ,  H01L24/37 ,  H01L24/40 ,  H01L24/41 ,  H01L24/48 ,  H01L24/73 ,  H01L24/78 ,  H01L24/83 ,  H01L24/84 ,  H01L24/85 ,  H01L24/92 ,  H01L2223/54406 ,  H01L2223/54433 ,  H01L2223/54486 ,  H01L2224/05553 ,  H01L2224/0603 ,  H01L2224/29116 ,  H01L2224/2929 ,  H01L2224/29339 ,  H01L2224/32245 ,  H01L2224/37011 ,  H01L2224/37013 ,  H01L2224/37147 ,  H01L2224/40095 ,  H01L2224/40139 ,  H01L2224/40245 ,  H01L2224/40998 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48247 ,  H01L2224/73215 ,  H01L2224/73221 ,  H01L2224/73263 ,  H01L2224/73265 ,  H01L2224/77704 ,  H01L2224/78704 ,  H01L2224/83192 ,  H01L2224/83447 ,  H01L2224/838 ,  H01L2224/83801 ,  H01L2224/83815 ,  H01L2224/8385 ,  H01L2224/83862 ,  H01L2224/84136 ,  H01L2224/84138 ,  H01L2224/84801 ,  H01L2224/84815 ,  H01L2224/8485 ,  H01L2224/84862 ,  H01L2224/8585 ,  H01L2224/92147 ,  H01L2224/92246 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/1203 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/15747 ,  H01L2924/181 ,  Y02T10/645 ,  Y02T10/7005 ,  H01L2924/00012 ,  H01L2924/0665 ,  H01L2224/05559 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/05599 ,  H01L2224/85399

摘要： On the assumption that a pair of hanging parts is provided in a lead frame and a clip includes a main body part and a pair of extension parts, the pair of the extension parts is mounted and supported on the pair of the hanging parts. Accordingly, the clip is mounted on a lead (one point) and the pair of the hanging parts (two points), and the clip is supported by the three points.

摘要翻译： 假设在引线框架中设置一对悬挂部件，并且夹子包括主体部分和一对延伸部分，所述一对延伸部分被安装并支撑在所述一对悬挂部分上。 因此，夹子安装在一个引线（一点）上，一对悬挂部分（两点）和夹子被三个点支撑。

公开(公告)号：US20160099237A1

公开(公告)日：2016-04-07

申请号：US14882088

申请日：2015-10-13

申请人： Micron Technology, Inc.

发明人： Meow Koon Eng ,  Yong Poo Chia ,  Suan Jeung Boon

IPC分类号： H01L25/00 ,  H01L23/498 ,  H01L23/31 ,  H01L23/495 ,  H01L23/00 ,  H01L25/10

CPC分类号： H01L25/105 ,  H01L21/50 ,  H01L21/568 ,  H01L23/3121 ,  H01L23/3128 ,  H01L23/49555 ,  H01L23/49811 ,  H01L23/49861 ,  H01L24/11 ,  H01L24/17 ,  H01L24/18 ,  H01L24/19 ,  H01L24/20 ,  H01L24/27 ,  H01L24/32 ,  H01L24/33 ,  H01L24/83 ,  H01L24/96 ,  H01L24/97 ,  H01L25/50 ,  H01L2224/04105 ,  H01L2224/05548 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/12105 ,  H01L2224/16 ,  H01L2224/16258 ,  H01L2224/17106 ,  H01L2225/1023 ,  H01L2225/1029 ,  H01L2225/1035 ,  H01L2225/1058 ,  H01L2225/1064 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/1434 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00014

摘要： Microelectronic die packages, stacked systems of die packages, and methods of manufacturing them are disclosed herein. In one embodiment, a system of stacked packages includes a first die package having a bottom side, a first dielectric casing, and first metal leads; a second die package having a top side attached to the bottom side of the first package, a dielectric casing with a lateral side, and second metal leads aligned with and projecting towards the first metal leads and including an exterior surface and an interior surface region that generally faces the lateral side; and metal solder connectors coupling individual first leads to individual second leads. In a further embodiment, the individual second leads have an “L” shape and physically contact corresponding individual first leads. In another embodiment, the individual second leads have a “C” shape and include a tiered portion that projects towards the lateral side of the second casing.