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公开(公告)号：US20180331002A1
公开(公告)日：2018-11-15
申请号：US16033054
申请日：2018-07-11
发明人： Koji BANDO , Akira MUTO
IPC分类号： H01L23/053 , H01L23/057 , H01L25/18 , H01L23/433 , H01L23/495 , H01L23/50 , H01L23/00 , H01L25/07 , H01L25/11 , H02M7/00 , H01L23/373 , H01L23/31 , H01L29/739 , H01L29/78 , H01L29/861
CPC分类号： H01L23/053 , H01L23/057 , H01L23/3107 , H01L23/3735 , H01L23/4334 , H01L23/49513 , H01L23/49524 , H01L23/49562 , H01L23/49575 , H01L23/50 , H01L24/32 , H01L24/33 , H01L24/40 , H01L24/48 , H01L24/73 , H01L25/072 , H01L25/115 , H01L25/18 , H01L29/7395 , H01L29/7802 , H01L29/8611 , H01L2224/05554 , H01L2224/32245 , H01L2224/33181 , H01L2224/40101 , H01L2224/40137 , H01L2224/48091 , H01L2224/48175 , H01L2224/73213 , H01L2224/73215 , H01L2224/73263 , H01L2224/73265 , H01L2924/12036 , H01L2924/13055 , H01L2924/13091 , H02M7/003
摘要： Each of first and second semiconductor devices mounted on a substrate includes an emitter terminal electrically connected with a front surface electrode of a semiconductor chip and exposed from a main surface of a sealing body located on a front surface side of the semiconductor chip. Each of the first and second semiconductor devices includes a collector terminal electrically connected with a back surface electrode of the semiconductor chip and exposed from the main surface of the sealing body located on a back surface side of the semiconductor chip. The collector terminal of the first semiconductor device is electrically connected with the emitter terminal of the second semiconductor device via a conductor pattern formed on an upper surface of the substrate.
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公开(公告)号：US20170103940A1
公开(公告)日：2017-04-13
申请号：US15385637
申请日：2016-12-20
发明人： Akira MUTO , Koji BANDO , Yukihiro SATO , Kazuhiro MITAMURA
IPC分类号： H01L23/495 , H01L23/544 , H01L23/31
CPC分类号： H01L23/49575 , B60L3/003 , B60L11/1803 , B60L15/007 , B60L2220/12 , B60L2240/525 , H01L21/56 , H01L23/3107 , H01L23/49513 , H01L23/49524 , H01L23/49537 , H01L23/49541 , H01L23/49555 , H01L23/49562 , H01L23/49565 , H01L23/544 , H01L23/564 , H01L24/32 , H01L24/33 , H01L24/37 , H01L24/40 , H01L24/41 , H01L24/48 , H01L24/73 , H01L24/78 , H01L24/83 , H01L24/84 , H01L24/85 , H01L24/92 , H01L2223/54406 , H01L2223/54433 , H01L2223/54486 , H01L2224/05553 , H01L2224/0603 , H01L2224/29116 , H01L2224/2929 , H01L2224/29339 , H01L2224/32245 , H01L2224/37011 , H01L2224/37013 , H01L2224/37147 , H01L2224/40095 , H01L2224/40139 , H01L2224/40245 , H01L2224/40998 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48247 , H01L2224/73215 , H01L2224/73221 , H01L2224/73263 , H01L2224/73265 , H01L2224/77704 , H01L2224/78704 , H01L2224/83192 , H01L2224/83447 , H01L2224/838 , H01L2224/83801 , H01L2224/83815 , H01L2224/8385 , H01L2224/83862 , H01L2224/84136 , H01L2224/84138 , H01L2224/84801 , H01L2224/84815 , H01L2224/8485 , H01L2224/84862 , H01L2224/8585 , H01L2224/92147 , H01L2224/92246 , H01L2224/92247 , H01L2924/00014 , H01L2924/1203 , H01L2924/13055 , H01L2924/13091 , H01L2924/15747 , H01L2924/181 , Y02T10/645 , Y02T10/7005 , H01L2924/00012 , H01L2924/0665 , H01L2224/05559 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207 , H01L2224/05599 , H01L2224/85399
摘要： On the assumption that a pair of hanging parts is provided in a lead frame and a clip includes a main body part and a pair of extension parts, the pair of the extension parts is mounted and supported on the pair of the hanging parts. Accordingly, the clip is mounted on a lead (one point) and the pair of the hanging parts (two points), and the clip is supported by the three points.
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公开(公告)号：US20180337158A1
公开(公告)日：2018-11-22
申请号：US16034102
申请日：2018-07-12
发明人： Koji BANDO
CPC分类号： H01L24/49 , H01L23/04 , H01L23/3121 , H01L23/3735 , H01L23/4006 , H01L23/562 , H01L24/45 , H01L24/48 , H01L24/73 , H01L25/072 , H01L2023/4087 , H01L2224/32225 , H01L2224/45124 , H01L2224/48227 , H01L2224/49175 , H01L2224/73265 , H01L2924/00
摘要： An electronic device includes: a substrate having an upper surface (front surface) on which a semiconductor chip is mounted, and a lower surface (back surface) opposite to the upper surface; and a housing (case) fixed to the substrate through an adhesive material. The housing has through-holes each formed on one short side and the other short side in an X direction. The substrate is disposed between the through-holes. A part of the upper surface of the substrate is fixed so as to face a part of a stepped surface formed at a height different from that of a lower surface of the housing. Further, an interval (distance) between a part (stepped surface) extending along a short side of the housing in the stepped surface and the upper surface of the substrate is larger than an interval (distance) between a part (stepped surface) extending along a long side of the housing in the stepped surface and the upper surface of the substrate.
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公开(公告)号：US20180122767A1
公开(公告)日：2018-05-03
申请号：US15721904
申请日：2017-09-30
发明人： Koji BANDO
CPC分类号： H01L24/49 , H01L23/04 , H01L23/3121 , H01L23/3735 , H01L23/4006 , H01L23/562 , H01L24/45 , H01L24/48 , H01L24/73 , H01L25/072 , H01L2023/4087 , H01L2224/32225 , H01L2224/45124 , H01L2224/48227 , H01L2224/49175 , H01L2224/73265 , H01L2924/00
摘要： An electronic device includes: a substrate having an upper surface (front surface) on which a semiconductor chip is mounted, and a lower surface (back surface) opposite to the upper surface; and a housing (case) fixed to the substrate through an adhesive material. The housing has through-holes each formed on one short side and the other short side in an X direction. The substrate is disposed between the through-holes. A part of the upper surface of the substrate is fixed so as to face a part of a stepped surface formed at a height different from that of a lower surface of the housing. Further, an interval (distance) between a part (stepped surface) extending along a short side of the housing in the stepped surface and the upper surface of the substrate is larger than an interval (distance) between a part (stepped surface) extending along a long side of the housing in the stepped surface and the upper surface of the substrate.
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公开(公告)号：US20160163615A1
公开(公告)日：2016-06-09
申请号：US14941721
申请日：2015-11-16
IPC分类号： H01L23/36 , H02M7/537 , H01L29/861 , H01L23/31 , H01L27/06 , H01L29/739
CPC分类号： H02M7/537 , H01L23/3107 , H01L23/49551 , H01L23/49555 , H01L23/49562 , H01L23/49568 , H01L23/49575 , H01L24/06 , H01L24/29 , H01L24/32 , H01L24/48 , H01L24/49 , H01L24/73 , H01L27/0664 , H01L29/0615 , H01L29/0619 , H01L29/7397 , H01L29/861 , H01L29/8611 , H01L2224/0603 , H01L2224/29101 , H01L2224/32245 , H01L2224/48137 , H01L2224/48247 , H01L2224/48257 , H01L2224/49111 , H01L2224/49113 , H01L2224/49171 , H01L2224/73265 , H01L2924/00014 , H01L2924/0002 , H01L2924/0781 , H01L2924/13055 , H01L2924/13091 , H01L2924/181 , H01L2924/1815 , H02M7/003 , H02P27/06 , H01L2924/00012 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207 , H01L2924/014
摘要： For example, a semiconductor device has a lead connected to a second portion of a chip mounting part on which a semiconductor chip to be a heat source is mounted and a lead connected to a third portion of the chip mounting part on which the semiconductor chip to be the heat source is mounted. Further, each of the leads has a protruding portion protruding from a sealing member. In this manner, it is possible to enhance a heat dissipation characteristic of the semiconductor device.
摘要翻译： 例如，半导体器件具有连接到其上安装有作为热源的半导体芯片的芯片安装部的第二部分的引线和连接到芯片安装部的第三部分的引线，半导体芯片上的半导体芯片 作为热源安装。 此外，每个引线具有从密封构件突出的突出部分。 以这种方式，可以提高半导体器件的散热特性。
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公开(公告)号：US20190006258A1
公开(公告)日：2019-01-03
申请号：US15969897
申请日：2018-05-03
发明人： Kuniharu MUTO , Koji BANDO
IPC分类号： H01L23/31 , H01L21/56 , H01L23/495 , H01L25/16 , H01L25/00 , H01L21/48 , H01L23/40 , H01L23/00
摘要： Reliability of a semiconductor module is improved. In a resin mold step of assembly of a semiconductor module, an IGBT chip, a diode chip, a control chip, a part of each of chip mounting portions are resin molded so that a back surface of each of the chip mounting portions is exposed from a back surface of a sealing body. After the resin molding, an insulating layer is bonded to the back surface of the sealing body so as to cover each back surface (exposed portion) of the chip mounting portions, and then, a TIM layer is bonded to an insulating layer. Here, a region of the TIM layer in a plan view is included in a region of the insulating layer.
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公开(公告)号：US20180241319A1
公开(公告)日：2018-08-23
申请号：US15891872
申请日：2018-02-08
发明人： Koji BANDO , Kuniharu MUTO , Hideaki SATO
摘要： An electronic device includes a first substrate, a wiring substrate (second substrate) disposed over the first substrate, and an enclosure (case) in which the first substrate and the wiring substrate are accommodated and that has a first side and a second side. A driver component (semiconductor component) is mounted on the wiring substrate. A gate electrode of a first semiconductor component is electrically connected to the driver component via a lead disposed on a side of the first side and a wiring disposed between the driver component and the first side. A gate electrode of a second semiconductor component is electrically connected to the driver component via a lead disposed on a side of the second side and a wiring disposed between the driver component and the second side.
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公开(公告)号：US20180138828A1
公开(公告)日：2018-05-17
申请号：US15867978
申请日：2018-01-11
发明人： Kuniharu MUTO , Koji BANDO , Takamitsu KANAZAWA , Ryo KANDA , Akihiro TAMURA , Hirobumi MINEGISHI
CPC分类号： H02M7/537 , H01L23/04 , H01L23/3107 , H01L23/49541 , H01L27/0664 , H01L2224/0603 , H01L2224/32245 , H01L2224/48137 , H01L2224/48139 , H01L2224/48247 , H01L2224/4903 , H01L2224/73265 , H01L2224/92247 , H01L2924/181 , H02M7/003 , H02M7/53875 , H01L2924/00012 , H01L2924/00
摘要： Reliability of a semiconductor device is improved. A third semiconductor chip on which a control circuit is formed, and a first semiconductor chip of a plurality of IGBT chips are electrically connected via a high-side relay board. That is, the first semiconductor chip and the third semiconductor chip are electrically connected via a first wire, a high-side relay board and a second wire. Similarly, the third semiconductor chip on which the control circuit is formed and a second semiconductor chip of a plurality of IGBT chips are electrically connected via a low-side relay board. That is, the second semiconductor chip and the third semiconductor chip are electrically connected via the first wire, the low-side relay board and the second wire.
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公开(公告)号：US20180047649A1
公开(公告)日：2018-02-15
申请号：US15655617
申请日：2017-07-20
发明人： Koji BANDO , Akira MUTO
IPC分类号： H01L23/053 , H01L23/057 , H01L23/00 , H01L25/18 , H01L23/50 , H01L25/07 , H01L23/495
CPC分类号： H01L23/053 , H01L23/057 , H01L23/3107 , H01L23/3735 , H01L23/4334 , H01L23/49513 , H01L23/49524 , H01L23/49562 , H01L23/49575 , H01L23/50 , H01L24/32 , H01L24/33 , H01L24/40 , H01L24/48 , H01L24/73 , H01L25/072 , H01L25/115 , H01L25/18 , H01L29/7395 , H01L29/7802 , H01L29/8611 , H01L2224/05554 , H01L2224/32245 , H01L2224/33181 , H01L2224/40101 , H01L2224/40137 , H01L2224/48091 , H01L2224/48175 , H01L2224/73213 , H01L2224/73215 , H01L2224/73263 , H01L2224/73265 , H01L2924/12036 , H01L2924/13055 , H01L2924/13091 , H02M7/003
摘要： Each of first and second semiconductor devices mounted on a substrate includes an emitter terminal electrically connected with a front surface electrode of a semiconductor chip and exposed from a main surface of a sealing body located on a front surface side of the semiconductor chip. Each of the first and second semiconductor devices includes a collector terminal electrically connected with a back surface electrode of the semiconductor chip and exposed from the main surface of the sealing body located on a back surface side of the semiconductor chip. The collector terminal of the first semiconductor device is electrically connected with the emitter terminal of the second semiconductor device via a conductor pattern formed on an upper surface of the substrate.
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公开(公告)号：US20170033710A1
公开(公告)日：2017-02-02
申请号：US15194624
申请日：2016-06-28
发明人： Kuniharu MUTO , Koji BANDO , Takamitsu KANAZAWA , Ryo KANDA , Akihiro TAMURA , Hirobumi MINEGISHI
IPC分类号： H02M7/537 , H03K17/567 , H01L23/495 , H01L23/04 , H01L27/06 , H02M7/00
CPC分类号： H02M7/537 , H01L23/04 , H01L23/3107 , H01L23/49541 , H01L27/0664 , H01L2224/0603 , H01L2224/32245 , H01L2224/48137 , H01L2224/48139 , H01L2224/48247 , H01L2224/4903 , H01L2224/73265 , H01L2224/92247 , H01L2924/181 , H02M7/003 , H02M7/53875 , H01L2924/00012 , H01L2924/00
摘要： Reliability of a semiconductor device is improved. A third semiconductor chip on which a control circuit is formed, and a first semiconductor chip of a plurality of IGBT chips are electrically connected via a high-side relay board. That is, the first semiconductor chip and the third semiconductor chip are electrically connected via a first wire, a high-side relay board and a second wire. Similarly, the third semiconductor chip on which the control circuit is formed and a second semiconductor chip of a plurality of IGBT chips are electrically connected via a low-side relay board. That is, the second semiconductor chip and the third semiconductor chip are electrically connected via the first wire, the low-side relay board and the second wire.
摘要翻译： 提高了半导体器件的可靠性。 其上形成有控制电路的第三半导体芯片，并且多个IGBT芯片的第一半导体芯片经由高侧继电器板电连接。 也就是说，第一半导体芯片和第三半导体芯片经由第一线，高侧继电器板和第二线电连接。 类似地，其上形成有控制电路的第三半导体芯片和多个IGBT芯片的第二半导体芯片经由低侧继电器板电连接。 也就是说，第二半导体芯片和第三半导体芯片经由第一线，低侧继电器板和第二线电连接。
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