- 专利标题： SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
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申请号： US15385637申请日： 2016-12-20
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公开(公告)号： US20170103940A1公开(公告)日： 2017-04-13
- 发明人: Akira MUTO , Koji BANDO , Yukihiro SATO , Kazuhiro MITAMURA
- 申请人： Renesas Electronics Corporation
- 优先权： JP2014-194648 20140925
- 主分类号： H01L23/495
- IPC分类号： H01L23/495 ; H01L23/544 ; H01L23/31
摘要：
On the assumption that a pair of hanging parts is provided in a lead frame and a clip includes a main body part and a pair of extension parts, the pair of the extension parts is mounted and supported on the pair of the hanging parts. Accordingly, the clip is mounted on a lead (one point) and the pair of the hanging parts (two points), and the clip is supported by the three points.
公开/授权文献
- US10141248B2 Semiconductor device and manufacturing method thereof 公开/授权日：2018-11-27
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