公开(公告)号：US20230197690A1

公开(公告)日：2023-06-22

申请号：US18175284

申请日：2023-02-27

申请人： Micron Technology, Inc.

发明人： Tongbi Jiang ,  Yong Poo Chia

IPC分类号： H01L25/07 ,  H01L25/00 ,  H01L23/31 ,  H01L23/48 ,  H01L21/768 ,  H01L21/82 ,  H01L23/00 ,  H01L21/56 ,  H01L23/538 ,  H01L25/10

CPC分类号： H01L25/071 ,  H01L21/82 ,  H01L21/561 ,  H01L21/568 ,  H01L21/76877 ,  H01L23/481 ,  H01L23/3107 ,  H01L23/3114 ,  H01L23/3142 ,  H01L23/5389 ,  H01L24/19 ,  H01L24/27 ,  H01L24/32 ,  H01L24/83 ,  H01L24/96 ,  H01L24/97 ,  H01L25/50 ,  H01L25/105 ,  H01L2221/68359 ,  H01L2224/20 ,  H01L2224/838 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/32145 ,  H01L2224/83193 ,  H01L2225/1035 ,  H01L2225/1058 ,  H01L2225/06548 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/19041 ,  H01L2924/19043

摘要： A device is disclosed which includes at least one integrated circuit die, at least a portion of which is positioned in a body of encapsulant material, and at least one conductive via extending through the body of encapsulant material.

公开(公告)号：US20180323179A1

公开(公告)日：2018-11-08

申请号：US16038621

申请日：2018-07-18

申请人： Micron Technology, Inc.

发明人： Meow Koon Eng ,  Yong Poo Chia ,  Suan Jeung Boon

IPC分类号： H01L25/10 ,  H01L25/00 ,  H01L23/00 ,  H01L23/31 ,  H01L23/495 ,  H01L23/498 ,  H01L21/50 ,  H01L21/56

CPC分类号： H01L25/105 ,  H01L21/50 ,  H01L21/568 ,  H01L23/3121 ,  H01L23/3128 ,  H01L23/49555 ,  H01L23/49811 ,  H01L23/49861 ,  H01L24/11 ,  H01L24/17 ,  H01L24/18 ,  H01L24/19 ,  H01L24/20 ,  H01L24/27 ,  H01L24/32 ,  H01L24/33 ,  H01L24/83 ,  H01L24/96 ,  H01L24/97 ,  H01L25/50 ,  H01L2224/04105 ,  H01L2224/05548 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/12105 ,  H01L2224/16 ,  H01L2224/16258 ,  H01L2224/17106 ,  H01L2225/1023 ,  H01L2225/1029 ,  H01L2225/1035 ,  H01L2225/1058 ,  H01L2225/1064 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/1434 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00014

摘要： Microelectronic die packages, stacked systems of die packages, and methods of manufacturing them are disclosed herein. In one embodiment, a system of stacked packages includes a first die package having a bottom side, a first dielectric casing, and first metal leads; a second die package having a top side attached to the bottom side of the first package, a dielectric casing with a lateral side, and second metal leads aligned with and projecting towards the first metal leads and including an exterior surface and an interior surface region that generally faces the lateral side; and metal solder connectors coupling individual first leads to individual second leads. In a further embodiment, the individual second leads have an “L” shape and physically contact corresponding individual first leads. In another embodiment, the individual second leads have a “C” shape and include a tiered portion that projects towards the lateral side of the second casing.

公开(公告)号：US20160099237A1

公开(公告)日：2016-04-07

申请号：US14882088

申请日：2015-10-13

申请人： Micron Technology, Inc.

发明人： Meow Koon Eng ,  Yong Poo Chia ,  Suan Jeung Boon

IPC分类号： H01L25/00 ,  H01L23/498 ,  H01L23/31 ,  H01L23/495 ,  H01L23/00 ,  H01L25/10

CPC分类号： H01L25/105 ,  H01L21/50 ,  H01L21/568 ,  H01L23/3121 ,  H01L23/3128 ,  H01L23/49555 ,  H01L23/49811 ,  H01L23/49861 ,  H01L24/11 ,  H01L24/17 ,  H01L24/18 ,  H01L24/19 ,  H01L24/20 ,  H01L24/27 ,  H01L24/32 ,  H01L24/33 ,  H01L24/83 ,  H01L24/96 ,  H01L24/97 ,  H01L25/50 ,  H01L2224/04105 ,  H01L2224/05548 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/12105 ,  H01L2224/16 ,  H01L2224/16258 ,  H01L2224/17106 ,  H01L2225/1023 ,  H01L2225/1029 ,  H01L2225/1035 ,  H01L2225/1058 ,  H01L2225/1064 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/1434 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00014

摘要： Microelectronic die packages, stacked systems of die packages, and methods of manufacturing them are disclosed herein. In one embodiment, a system of stacked packages includes a first die package having a bottom side, a first dielectric casing, and first metal leads; a second die package having a top side attached to the bottom side of the first package, a dielectric casing with a lateral side, and second metal leads aligned with and projecting towards the first metal leads and including an exterior surface and an interior surface region that generally faces the lateral side; and metal solder connectors coupling individual first leads to individual second leads. In a further embodiment, the individual second leads have an “L” shape and physically contact corresponding individual first leads. In another embodiment, the individual second leads have a “C” shape and include a tiered portion that projects towards the lateral side of the second casing.

公开(公告)号：US20180350730A1

公开(公告)日：2018-12-06

申请号：US16058496

申请日：2018-08-08

申请人： Micron Technology, Inc.

发明人： Chua Swee Kwang ,  Yong Poo Chia

IPC分类号： H01L23/495 ,  H01L21/48 ,  H01L23/047 ,  H01L23/31 ,  H01L23/00 ,  H01L29/06

CPC分类号： H01L23/49575 ,  H01L21/4821 ,  H01L21/4825 ,  H01L21/4839 ,  H01L23/047 ,  H01L23/3114 ,  H01L23/49503 ,  H01L23/4951 ,  H01L24/32 ,  H01L24/48 ,  H01L29/0657 ,  H01L2224/05599 ,  H01L2224/32145 ,  H01L2224/32245 ,  H01L2224/45015 ,  H01L2224/45099 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48464 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/10155 ,  H01L2924/10158 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/207 ,  H01L2924/00012 ,  H01L2224/85399

摘要： Semiconductor dies with recesses, associated leadframes, and associated systems and methods are disclosed. A semiconductor system in accordance with one embodiment includes a semiconductor die having a first surface and a second surface facing opposite from the first surface, with the first surface having a die recess. The system can further include a support paddle carrying the semiconductor die, with at least part of the support paddle being received in the die recess. In particular embodiments, the support paddle can form a portion of a leadframe. In other particular embodiments, the support paddle can include a paddle surface that faces toward the semiconductor die and has an opening extending through the paddle surface and through the support paddle.

公开(公告)号：US10056359B2

公开(公告)日：2018-08-21

申请号：US15474854

申请日：2017-03-30

申请人： Micron Technology, Inc.

发明人： Meow Koon Eng ,  Yong Poo Chia ,  Suan Jeung Boon

IPC分类号： H01L23/48 ,  H01L25/10 ,  H01L23/495 ,  H01L23/498 ,  H01L23/00 ,  H01L21/50 ,  H01L25/00 ,  H01L23/31 ,  H01L21/56

CPC分类号： H01L25/105 ,  H01L21/50 ,  H01L21/568 ,  H01L23/3121 ,  H01L23/3128 ,  H01L23/49555 ,  H01L23/49811 ,  H01L23/49861 ,  H01L24/11 ,  H01L24/17 ,  H01L24/18 ,  H01L24/19 ,  H01L24/20 ,  H01L24/27 ,  H01L24/32 ,  H01L24/33 ,  H01L24/83 ,  H01L24/96 ,  H01L24/97 ,  H01L25/50 ,  H01L2224/04105 ,  H01L2224/05548 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/12105 ,  H01L2224/16 ,  H01L2224/16258 ,  H01L2224/17106 ,  H01L2225/1023 ,  H01L2225/1029 ,  H01L2225/1035 ,  H01L2225/1058 ,  H01L2225/1064 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/1434 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00014

摘要： Microelectronic die packages, stacked systems of die packages, and methods of manufacturing them are disclosed herein. In one embodiment, a system of stacked packages includes a first die package having a bottom side, a first dielectric casing, and first metal leads; a second die package having a top side attached to the bottom side of the first package, a dielectric casing with a lateral side, and second metal leads aligned with and projecting towards the first metal leads and including an exterior surface and an interior surface region that generally faces the lateral side; and metal solder connectors coupling individual first leads to individual second leads. In a further embodiment, the individual second leads have an “L” shape and physically contact corresponding individual first leads. In another embodiment, the individual second leads have a “C” shape and include a tiered portion that projects towards the lateral side of the second casing.

公开(公告)号：US20170278775A1

公开(公告)日：2017-09-28

申请号：US15620191

申请日：2017-06-12

申请人： Micron Technology, Inc.

发明人： Chua Swee Kwang ,  Yong Poo Chia

IPC分类号： H01L23/495 ,  H01L21/48 ,  H01L23/00 ,  H01L23/047 ,  H01L23/31 ,  H01L29/06

CPC分类号： H01L23/49575 ,  H01L21/4821 ,  H01L21/4825 ,  H01L21/4839 ,  H01L23/047 ,  H01L23/3114 ,  H01L23/49503 ,  H01L23/4951 ,  H01L24/32 ,  H01L24/48 ,  H01L29/0657 ,  H01L2224/32145 ,  H01L2224/32245 ,  H01L2224/45015 ,  H01L2224/45099 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48464 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/10155 ,  H01L2924/10158 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/207 ,  H01L2924/00012 ,  H01L2224/85399 ,  H01L2224/05599

摘要： Semiconductor dies with recesses, associated leadframes, and associated systems and methods are disclosed. A semiconductor system in accordance with one embodiment includes a semiconductor die having a first surface and a second surface facing opposite from the first surface, with the first surface having a die recess. The system can further include a support paddle carrying the semiconductor die, with at least part of the support paddle being received in the die recess. In particular embodiments, the support paddle can form a portion of a leadframe. In other particular embodiments, the support paddle can include a paddle surface that faces toward the semiconductor die and has an opening extending through the paddle surface and through the support paddle.

公开(公告)号：US09679834B2

公开(公告)日：2017-06-13

申请号：US15001070

申请日：2016-01-19

申请人： Micron Technology, Inc.

发明人： Chua Swee Kwang ,  Yong Poo Chia

IPC分类号： H01L23/495 ,  H01L23/047 ,  H01L21/48 ,  H01L29/06 ,  H01L23/00 ,  H01L23/31

CPC分类号： H01L23/49575 ,  H01L21/4821 ,  H01L21/4825 ,  H01L21/4839 ,  H01L23/047 ,  H01L23/3114 ,  H01L23/49503 ,  H01L23/4951 ,  H01L24/32 ,  H01L24/48 ,  H01L29/0657 ,  H01L2224/32145 ,  H01L2224/32245 ,  H01L2224/45015 ,  H01L2224/45099 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48464 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/10155 ,  H01L2924/10158 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/207 ,  H01L2924/00012 ,  H01L2224/85399 ,  H01L2224/05599

摘要： Semiconductor dies with recesses, associated leadframes, and associated systems and methods are disclosed. A semiconductor system in accordance with one embodiment includes a semiconductor die having a first surface and a second surface facing opposite from the first surface, with the first surface having a die recess. The system can further include a support paddle carrying the semiconductor die, with at least part of the support paddle being received in the die recess. In particular embodiments, the support paddle can form a portion of a leadframe. In other particular embodiments, the support paddle can include a paddle surface that faces toward the semiconductor die and has an opening extending through the paddle surface and through the support paddle.

公开(公告)号：US11594525B2

公开(公告)日：2023-02-28

申请号：US17751460

申请日：2022-05-23

申请人： Micron Technology, Inc.

发明人： Tongbi Jiang ,  Yong Poo Chia

IPC分类号： H01L25/07 ,  H01L25/00 ,  H01L23/31 ,  H01L23/48 ,  H01L21/768 ,  H01L21/82 ,  H01L23/00 ,  H01L21/56 ,  H01L23/538 ,  H01L25/10

摘要： A device is disclosed which includes at least one integrated circuit die, at least a portion of which is positioned in a body of encapsulant material, and at least one conductive via extending through the body of encapsulant material.

公开(公告)号：US20220285325A1

公开(公告)日：2022-09-08

申请号：US17751460

申请日：2022-05-23

申请人： Micron Technology, Inc.

发明人： Tongbi Jiang ,  Yong Poo Chia

IPC分类号： H01L25/07 ,  H01L25/00 ,  H01L23/31 ,  H01L23/48 ,  H01L21/768 ,  H01L21/82 ,  H01L23/00 ,  H01L21/56 ,  H01L23/538 ,  H01L25/10

摘要： A device is disclosed which includes at least one integrated circuit die, at least a portion of which is positioned in a body of encapsulant material, and at least one conductive via extending through the body of encapsulant material.

公开(公告)号：US10396059B2

公开(公告)日：2019-08-27

申请号：US16038621

申请日：2018-07-18

申请人： Micron Technology, Inc.

发明人： Meow Koon Eng ,  Yong Poo Chia ,  Suan Jeung Boon

IPC分类号： H01L25/10 ,  H01L23/31 ,  H01L23/495 ,  H01L23/498 ,  H01L23/00 ,  H01L21/50 ,  H01L25/00 ,  H01L21/56

摘要： Microelectronic die packages, stacked systems of die packages, and methods of manufacturing them are disclosed herein. In one embodiment, a system of stacked packages includes a first die package having a bottom side, a first dielectric casing, and first metal leads; a second die package having a top side attached to the bottom side of the first package, a dielectric casing with a lateral side, and second metal leads aligned with and projecting towards the first metal leads and including an exterior surface and an interior surface region that generally faces the lateral side; and metal solder connectors coupling individual first leads to individual second leads. In a further embodiment, the individual second leads have an “L” shape and physically contact corresponding individual first leads. In another embodiment, the individual second leads have a “C” shape and include a tiered portion that projects towards the lateral side of the second casing.