公开(公告)号：US20120091568A1

公开(公告)日：2012-04-19

申请号：US13333086

申请日：2011-12-21

Applicant: Jenny Ong Wai Lian ,  Chen Wei Adrian Chng

Inventor： Jenny Ong Wai Lian ,  Chen Wei Adrian Chng

IPC: H01L23/495

CPC classification number: H01L23/4952 ,  H01L23/3107 ,  H01L23/49575 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/78 ,  H01L24/85 ,  H01L2224/05552 ,  H01L2224/05553 ,  H01L2224/05554 ,  H01L2224/05555 ,  H01L2224/32245 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48227 ,  H01L2224/48237 ,  H01L2224/48247 ,  H01L2224/48458 ,  H01L2224/48463 ,  H01L2224/48464 ,  H01L2224/48465 ,  H01L2224/48472 ,  H01L2224/48475 ,  H01L2224/48479 ,  H01L2224/4848 ,  H01L2224/48491 ,  H01L2224/48499 ,  H01L2224/48599 ,  H01L2224/48639 ,  H01L2224/48699 ,  H01L2224/48739 ,  H01L2224/4903 ,  H01L2224/49051 ,  H01L2224/4945 ,  H01L2224/73265 ,  H01L2224/78313 ,  H01L2224/78318 ,  H01L2224/85051 ,  H01L2224/85191 ,  H01L2224/85205 ,  H01L2224/85439 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/14 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2224/48471 ,  H01L2924/00 ,  H01L2924/00015 ,  H01L2924/00012 ,  H01L2224/4554

Abstract: One embodiment includes an encapsulated semiconductor package having a lead frame with die pad surrounded by a plurality of first and second leadfingers. A semiconductor chip including chip contact pads on its upper active surface is attached to the die pad. A plurality of first bond wires, incoluding a first electrically conductive material, extend between the chip contact pads and the plurality of first leadfingers. A plurality of second bond wires, including a second electrically conductive material, extend between a chip contact pad and a second leadfinger. The semiconductor package further includes a plurality of electrically conducting means attached to the second leadfingers.

Abstract translation: 一个实施例包括封装的半导体封装，其具有引线框架，引线框架具有由多个第一引线脚和第二引线引脚围绕的管芯焊盘。 包括其上活性表面上的芯片接触焊盘的半导体芯片附接到管芯焊盘。 浸入第一导电材料的多个第一接合线在芯片接触焊盘和多个第一引线管之间延伸。 包括第二导电材料的多个第二接合线在芯片接触焊盘和第二引线框之间延伸。 半导体封装还包括附接到第二引线管的多个导电装置。

公开(公告)号：US08138081B2

公开(公告)日：2012-03-20

申请号：US12580560

申请日：2009-10-16

Applicant: Adams Zhu ,  Xingquan Fang ,  Fred Ren ,  Yongsuk Kwon

Inventor： Adams Zhu ,  Xingquan Fang ,  Fred Ren ,  Yongsuk Kwon

IPC: H01L21/44

CPC classification number: H01L23/4952 ,  H01L23/3107 ,  H01L24/05 ,  H01L24/45 ,  H01L24/48 ,  H01L24/85 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05556 ,  H01L2224/13144 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48472 ,  H01L2224/48475 ,  H01L2224/48599 ,  H01L2224/48655 ,  H01L2224/48699 ,  H01L2224/48755 ,  H01L2224/78313 ,  H01L2224/85051 ,  H01L2224/85455 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01202 ,  H01L2924/014 ,  H01L2924/181 ,  H01L2924/20755 ,  H01L2924/20757 ,  H01L2924/2076 ,  H01L2224/78 ,  H01L2924/00 ,  H01L2924/00012

Abstract: The invention includes a packaged semiconductor device in which the bond wires are bonded to the leads with an aluminum bump bond. The semiconductor device is mounted on a leadframe having leads with a nickel plating. To form the bump bond between a fine aluminum wire, such as a 2 mil diameter wire, and the lead, an aluminum bump is bonded to the nickel plating and the wire is bonded to the bump. The bump is aluminum doped with nickel and is formed from a large diameter wire, such as a 6 mil diameter wire.

Abstract translation: 本发明包括一种封装的半导体器件，其中接合线通过铝凸块接合结合到引线上。 半导体器件安装在具有镀镍导线的引线框架上。 为了形成诸如2密耳直径的线的细铝线与引线之间的凸起接合，铝凸块被接合到镀镍，并且导线被接合到凸点。 凸块是掺杂有镍的铝，并且由诸如6密耳直径的电线的大直径电线形成。

公开(公告)号：US08138079B2

公开(公告)日：2012-03-20

申请号：US11926154

申请日：2007-10-29

Applicant: Jin-Yuan Lee ,  Ying-Chih Chen ,  Mou-Shiung Lin

Inventor： Jin-Yuan Lee ,  Ying-Chih Chen ,  Mou-Shiung Lin

IPC: H01L21/28 ,  H01L21/60 ,  H01L21/768

CPC classification number: H01L24/48 ,  H01L24/03 ,  H01L24/05 ,  H01L2224/02166 ,  H01L2224/04042 ,  H01L2224/05073 ,  H01L2224/05166 ,  H01L2224/05171 ,  H01L2224/05187 ,  H01L2224/05548 ,  H01L2224/05556 ,  H01L2224/05558 ,  H01L2224/05624 ,  H01L2224/05644 ,  H01L2224/45144 ,  H01L2224/4807 ,  H01L2224/48453 ,  H01L2224/48463 ,  H01L2224/48599 ,  H01L2224/48624 ,  H01L2224/48644 ,  H01L2224/48647 ,  H01L2224/854 ,  H01L2224/85424 ,  H01L2224/85444 ,  H01L2224/85447 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01007 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/04941 ,  H01L2924/05042 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/04953 ,  H01L2224/45099 ,  H01L2924/00 ,  H01L2924/00012

Abstract: A method and structure are provided to enable wire bond connections over active and/or passive devices and/or low-k dielectrics, formed on an Integrated Circuit die. A semiconductor substrate having active and/or passive devices is provided, with interconnect metallization formed over the active and/or passive devices. A passivation layer formed over the interconnect metallization is provided, wherein openings are formed in the passivation layer to an upper metal layer of the interconnect metallization. Compliant metal bond pads are formed over the passivation layer, wherein the compliant metal bond pads are connected through the openings to the upper metal layer, and wherein the compliant metal bond pads are formed substantially over the active and/or passive devices. The compliant metal bond pads may be formed of a composite metal structure.

Abstract translation: 提供了一种方法和结构，以在集成电路管芯上形成的有源和/或无源器件和/或低k电介质上实现引线接合连接。 提供了具有有源和/或无源器件的半导体衬底，其中在有源和/或无源器件上形成互连金属化。 提供了形成在互连金属化之上的钝化层，其中在钝化层中形成开口以形成互连金属化的上金属层。 柔性金属焊盘形成在钝化层上方，其中柔性金属接合焊盘通过开口连接到上金属层，并且其中柔性金属接合焊盘基本上形成在有源和/或无源器件的上方。 顺应性金属接合焊盘可以由复合金属结构形成。

公开(公告)号：US08129263B2

公开(公告)日：2012-03-06

申请号：US13178331

申请日：2011-07-07

Applicant: Hun-Teak Lee ,  Jong-Kook Kim ,  Chul-Sik Kim ,  Ki-Youn Jang ,  Rajendra D. Pendse

Inventor： Hun-Teak Lee ,  Jong-Kook Kim ,  Chul-Sik Kim ,  Ki-Youn Jang ,  Rajendra D. Pendse

IPC: H01L21/44 ,  H01L23/48

CPC classification number: H01L24/85 ,  H01L23/13 ,  H01L23/4952 ,  H01L23/49833 ,  H01L24/05 ,  H01L24/06 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L2224/04042 ,  H01L2224/05553 ,  H01L2224/05554 ,  H01L2224/05556 ,  H01L2224/05599 ,  H01L2224/32225 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48011 ,  H01L2224/48091 ,  H01L2224/48095 ,  H01L2224/48227 ,  H01L2224/48455 ,  H01L2224/48465 ,  H01L2224/48471 ,  H01L2224/48475 ,  H01L2224/48479 ,  H01L2224/4848 ,  H01L2224/48599 ,  H01L2224/48644 ,  H01L2224/48647 ,  H01L2224/48699 ,  H01L2224/48744 ,  H01L2224/48747 ,  H01L2224/49109 ,  H01L2224/49175 ,  H01L2224/49433 ,  H01L2224/73265 ,  H01L2224/78301 ,  H01L2224/85051 ,  H01L2224/85205 ,  H01L2224/85444 ,  H01L2224/85447 ,  H01L2224/85986 ,  H01L2224/92 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0106 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2224/85181 ,  H01L2224/85186 ,  H01L2924/2065 ,  H01L2224/78 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/4554

Abstract: A method of manufacture of a semiconductor package includes: providing a substrate; mounting a semiconductor die on the substrate, the semiconductor die having a die pad; mounting a lead finger on the substrate; attaching a support pedestal on sides of the lead finger; and attaching a wire interconnection between the die pad and the support pedestal, the wire interconnection having a ball bond on the die pad and a stitch bond on the support pedestal.

Abstract translation: 半导体封装的制造方法包括：提供衬底; 将半导体管芯安装在基板上，半导体管芯具有管芯焊盘; 将引线安装在基板上; 在所述引导指的侧面附接支撑基座; 并且在芯片焊盘和支撑基座之间附接电线互连，电线互连在芯片焊盘上具有球接合，并且在支撑基座上具有针脚接合。

公开(公告)号：US20120038059A1

公开(公告)日：2012-02-16

申请号：US12853856

申请日：2010-08-10

Applicant: Lai Nguk CHIN ,  Foong Yue HO ,  Wong Kwet NAM ,  Koo Eng LUON ,  Sally FOONG ,  Kevin GUAN

Inventor： Lai Nguk CHIN ,  Foong Yue HO ,  Wong Kwet NAM ,  Koo Eng LUON ,  Sally FOONG ,  Kevin GUAN

IPC: H01L23/49 ,  H01L21/50

CPC classification number: H01L24/49 ,  H01L24/27 ,  H01L24/32 ,  H01L24/33 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/83 ,  H01L24/85 ,  H01L24/92 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/27436 ,  H01L2224/2919 ,  H01L2224/32014 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48456 ,  H01L2224/48465 ,  H01L2224/4848 ,  H01L2224/48599 ,  H01L2224/48699 ,  H01L2224/48997 ,  H01L2224/49112 ,  H01L2224/49113 ,  H01L2224/49427 ,  H01L2224/73265 ,  H01L2224/83191 ,  H01L2224/838 ,  H01L2224/8503 ,  H01L2224/85051 ,  H01L2224/85181 ,  H01L2224/85203 ,  H01L2224/85205 ,  H01L2224/85207 ,  H01L2224/85951 ,  H01L2224/85986 ,  H01L2224/92247 ,  H01L2225/0651 ,  H01L2225/06562 ,  H01L2924/00014 ,  H01L2924/01014 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01057 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0665 ,  H01L2924/14 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/48455 ,  H01L2224/85399 ,  H01L2224/05599

Abstract: A method for die stacking is disclosed. In one embodiment a first die is formed overlying a substrate. A first wire is bonded to the first die and to a bond finger of the substrate, wherein the first wire is bonded to the bond finger with a first bond. A first stitch bump is formed overlying the first stitch bond, wherein the first stitch bump is formed from a molten ball of conductive material. A second die is formed overlying the first die. A second wire is bonded to the second die and to the first stitch bump, wherein the second wire is bonded to the first stitch bump with a second bond.

Abstract translation: 公开了一种用于芯片堆叠的方法。 在一个实施例中，第一管芯形成在衬底上。 第一线被接合到第一管芯和衬底的接合指状物，其中第一电线用第一接合键合到接合指状物。 第一缝合凸起形成在第一线圈接合之上，其中第一线圈凸起由导电材料的熔融球形成。 第二模具形成在第一模具上方。 第二线被接合到第二模具和第一线圈凸块，其中第二线材以第二接合键合到第一线圈凸块。

公开(公告)号：US20120018768A1

公开(公告)日：2012-01-26

申请号：US13188187

申请日：2011-07-21

Applicant: Yi-Qun Li ,  Charles Owen Edwards ,  Chih-Wei Huang ,  Ah Liu

Inventor： Yi-Qun Li ,  Charles Owen Edwards ,  Chih-Wei Huang ,  Ah Liu

IPC: H01L33/62

CPC classification number: H01L33/62 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L2224/32225 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/4809 ,  H01L2224/48091 ,  H01L2224/48095 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/4848 ,  H01L2224/48599 ,  H01L2224/49107 ,  H01L2224/73265 ,  H01L2224/83801 ,  H01L2224/8385 ,  H01L2224/85205 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/12041 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2924/2076 ,  H01L2224/83205 ,  H01L2224/85399 ,  H01L2224/05599

Abstract: An LED-based light emitting device comprises: a substrate; at least one LED die mounted to the substrate; at least one bond wire that electrically connects the LED die; and a light transmissive material (silicone) encapsulating the at least one LED die and at least one bond wire. The at least one bond wire has a hook-shaped portion that loops back on itself.

Abstract translation: 一种基于LED的发光器件包括：衬底; 至少一个安装在所述基板上的LED管芯; 至少一个电连接所述LED管芯的接合线; 以及封装所述至少一个LED管芯和至少一个接合线的透光材料（硅氧烷）。 所述至少一个接合线具有自身回绕的钩形部分。

公开(公告)号：US20120007224A1

公开(公告)日：2012-01-12

申请号：US13240124

申请日：2011-09-22

Applicant: Hajime HASEBE ,  Tadatoshi DANNO ,  Yukihiro SATOU

Inventor： Hajime HASEBE ,  Tadatoshi DANNO ,  Yukihiro SATOU

IPC: H01L23/495

CPC classification number: H01L23/49503 ,  H01L21/4853 ,  H01L21/563 ,  H01L23/3107 ,  H01L23/3121 ,  H01L23/49 ,  H01L23/4952 ,  H01L23/49548 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/97 ,  H01L2224/26175 ,  H01L2224/27013 ,  H01L2224/29339 ,  H01L2224/32057 ,  H01L2224/32245 ,  H01L2224/32257 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48095 ,  H01L2224/48247 ,  H01L2224/48253 ,  H01L2224/48257 ,  H01L2224/484 ,  H01L2224/48463 ,  H01L2224/48599 ,  H01L2224/48639 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/83051 ,  H01L2224/83101 ,  H01L2224/83385 ,  H01L2224/85439 ,  H01L2224/92 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01047 ,  H01L2924/01067 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/014 ,  H01L2924/15151 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/351 ,  Y10T29/49121 ,  H01L2224/85 ,  H01L2924/00012 ,  H01L2924/3512 ,  H01L2924/00 ,  H01L2224/05599

Abstract: In a non-leaded type semiconductor device, a tab, tab suspension leads, and other leads are exposed to one surface of a seal member. A semiconductor element is positioned within the seal member and fixed to a surface of the tab with an adhesive. The tab is formed larger than the semiconductor element so that outer peripheral edges of the tab are positioned outside outer peripheral edges of the semiconductor element. A groove is formed in the tab surface portion positioned between the area to which the semiconductor element is fixed and wire connection areas to which the wires are connected, the groove being formed so as to surround the semiconductor element fixing area, thereby preventing peeling-off between the tab to which the semiconductor element is fixed and the resin which constitutes the package.

Abstract translation: 在非引线型半导体器件中，突片，突片悬挂引线和其它引线暴露于密封构件的一个表面。 半导体元件被定位在密封构件内并用粘合剂固定到突片的表面。 突片形成为比半导体元件大，使得突片的外周边缘位于半导体元件的外周边缘的外侧。 在位于半导体元件固定的区域与电线连接的电线连接区域之间的突片表面部分中形成有沟槽，该沟槽形成为围绕半导体元件固定区域，从而防止剥离 在半导体元件固定的突片与构成封装的树脂之间。

公开(公告)号：US08076770B2

公开(公告)日：2011-12-13

申请号：US12190010

申请日：2008-08-12

Applicant: Yutaka Kagaya ,  Fumitomo Watanabe ,  Hajime Takasaki

Inventor： Yutaka Kagaya ,  Fumitomo Watanabe ,  Hajime Takasaki

IPC: H01L23/48 ,  H01L21/56

CPC classification number: H01L23/3128 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/97 ,  H01L25/105 ,  H01L2224/32145 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/48599 ,  H01L2224/49171 ,  H01L2224/92 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01014 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/10253 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2224/83 ,  H01L2224/85 ,  H01L2224/82 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/85399 ,  H01L2224/05599

Abstract: A semiconductor device includes a wiring board having connection pads thereon and a semiconductor chip mounted on the wiring board. The wiring board and the semiconductor chip are covered with a sealing portion. Conductive members are extended upward from the connection pads and are exposed from the sealing portion. Rewiring lines are connected to the exposed conductive members. Land portions are arranged on the sealing portion and are electrically connected to the conductive members through the rewiring lines.

Abstract translation: 半导体器件包括其上具有连接焊盘的布线板和安装在布线板上的半导体芯片。 接线板和半导体芯片被密封部分覆盖。 导电构件从连接垫向上延伸并从密封部分露出。 再生线连接到暴露的导电构件。 接地部设置在密封部上，并通过再布线与导电部件电连接。

公开(公告)号：US20110252623A1

公开(公告)日：2011-10-20

申请号：US13171137

申请日：2011-06-28

Applicant: Teck Kheng Lee ,  David Yih Ming Chai ,  Hong Wan Ng

Inventor： Teck Kheng Lee ,  David Yih Ming Chai ,  Hong Wan Ng

IPC: B23P11/00

CPC classification number: H01L23/12 ,  H01L21/76898 ,  H01L23/13 ,  H01L23/3121 ,  H01L23/3135 ,  H01L23/481 ,  H01L24/05 ,  H01L24/06 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/85 ,  H01L2224/04042 ,  H01L2224/05571 ,  H01L2224/05599 ,  H01L2224/06136 ,  H01L2224/2518 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/4809 ,  H01L2224/48091 ,  H01L2224/48095 ,  H01L2224/48227 ,  H01L2224/48235 ,  H01L2224/4824 ,  H01L2224/4845 ,  H01L2224/48464 ,  H01L2224/48472 ,  H01L2224/48599 ,  H01L2224/49 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2224/85203 ,  H01L2224/85205 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/0002 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01014 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01031 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15192 ,  H01L2924/15787 ,  Y10T29/49826 ,  H01L2924/00 ,  H01L2224/05552

Abstract: Microelectronic devices, associated assemblies, and associated methods are disclosed herein. For example, certain aspects of the invention are directed toward a microelectronic device that includes a microfeature workpiece having a side and an aperture in the side. The device can further include a workpiece contact having a surface. At least a portion of the surface of the workpiece contact can be accessible through the aperture and through a passageway extending between the aperture and the surface. Other aspects of the invention are directed toward a microelectronic support device that includes a support member having a side carrying a support contact that can be connectable to a workpiece contact of a microfeature workpiece. The device can further include recessed support contact means carried by the support member. The recessed support contact means can be connectable to a second workpiece contact of the microfeature workpiece.

Abstract translation: 本文公开了微电子器件，相关联的组件和相关联的方法。 例如，本发明的某些方面涉及一种微电子器件，该微电子器件包括具有侧面和孔侧的微特征工件。 该装置还可包括具有表面的工件接触件。 工件接触面的至少一部分表面可以通过孔径和通过在孔和表面之间延伸的通道而接近。 本发明的其它方面涉及一种微电子支撑装置，其包括支撑构件，所述支撑构件具有承载能够连接到微特征工件的工件接触件的支撑触点的侧面。 该装置还可以包括由支撑构件承载的凹进的支撑接触装置。 凹入的支撑接触装置可以连接到微特征工件的第二工件接触件。

公开(公告)号：US08021976B2

公开(公告)日：2011-09-20

申请号：US10434142

申请日：2003-05-08

Applicant: Jin-Yuan Lee ,  Ying-chih Chen

Inventor： Jin-Yuan Lee ,  Ying-chih Chen

IPC: H01L21/60

CPC classification number: H01L24/48 ,  H01L24/03 ,  H01L24/05 ,  H01L2224/02166 ,  H01L2224/04042 ,  H01L2224/05073 ,  H01L2224/05166 ,  H01L2224/05171 ,  H01L2224/05187 ,  H01L2224/05548 ,  H01L2224/05556 ,  H01L2224/05558 ,  H01L2224/05624 ,  H01L2224/05644 ,  H01L2224/45144 ,  H01L2224/4807 ,  H01L2224/48453 ,  H01L2224/48463 ,  H01L2224/48599 ,  H01L2224/48624 ,  H01L2224/48644 ,  H01L2224/48647 ,  H01L2224/854 ,  H01L2224/85424 ,  H01L2224/85444 ,  H01L2224/85447 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01007 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/04941 ,  H01L2924/05042 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/04953 ,  H01L2224/45099 ,  H01L2924/00 ,  H01L2924/00012

Abstract: A method and structure are provided to enable wire bond connections over active and/or passive devices and/or low-k dielectrics, formed on an Integrated Circuit die. A semiconductor substrate having active and/or passive devices is provided, with interconnect metallization formed over the active and/or passive devices. A passivation layer formed over the interconnect metallization is provided, wherein openings are formed in the passivation layer to an upper metal layer of the interconnect metallization. Compliant metal bond pads are formed over the passivation layer, wherein the compliant metal bond pads are connected through the openings to the upper metal layer, and wherein the compliant metal bond pads are formed substantially over the active and/or passive devices. The compliant metal bond pads may be formed of a composite metal structure.