Abstract:
Techniques are presented for the programming of a non-volatile memory in which multi-state memory cells use a charge trapping layer. When writing data onto a word lines, different data states are written individually, while programming inhibiting the other states, thereby breaking down the write operation into a number of sub-operations, one for each state to be written. This allows for improved timing and decreased power consumption.
Abstract:
According to one embodiment, a semiconductor device includes a memory circuit, a first FIFO, a second FIFO and an input/output circuit. The memory circuit outputs data. The first FIFO receives data from the memory circuit and outputs data synchronously with a first clock signal. The second FIFO receives data output from the first FIFO and outputs data synchronously with the first clock signal. The input/output circuit outputs data output from the second FIFO. The second FIFO is disposed in the vicinity of the input/output circuit than the first FIFO.
Abstract:
According to an aspect of the present invention, there is provided a nonvolatile semiconductor memory element including: a semiconductor substrate including: a source region; a drain region; and a channel region; a lower insulating film that is formed on the channel region; a charge storage film that is formed on the lower insulating film and that stores data; an upper insulating film that is formed on the charge storage film; and a control gate that is formed on the upper insulating film, wherein the upper insulating film includes: a first insulting film; and a second insulating film that is laminated with the first insulating film, and wherein the first insulating film is formed to have a trap level density larger than that of the second insulating film.
Abstract:
There may be provided a semiconductor memory device and an operating method thereof. A semiconductor memory device may include a memory cell array including a plurality of memory strings. The semiconductor memory device may include a peripheral circuit for performing a program operation on the plurality of memory strings, and a control logic for controlling the peripheral circuit to perform the program operation. The control logic may control the peripheral circuit to adjust potential levels of program permission voltages to be applied to the plurality of memory strings according to arrangement positions of the memory strings.
Abstract:
A method of programming target memory cells of a nonvolatile memory device includes; programming the target memory cells using an incrementally adjusted program time, reading a code word stored by the target memory cells and determining a bit error rate (BER) associated with the target memory cells in view of the read code word, and if the BER exceeds an upper BER limit, increasing the program time by a unit time.
Abstract:
Disclosed herein is a regulator for a non-volatile memory is provided. The regulator comprises an operational amplifier for receiving a reference voltage and a feedback voltage to output a voltage amplifying the difference of the reference voltage and the feedback voltage, the feedback voltage being obtained by dividing an output voltage of the regulator; a first switching unit turning on in response to the amplified voltage; a second switching unit electrically connected between a first node and the first switching unit for protecting the first switching unit from the voltage of the first node; and a third switching unit providing the output voltage of the regulator to a second node in response to a voltage of the first node.
Abstract:
A memory device includes core memory such as flash memory for storing data. The memory device includes a first power input to receive a first voltage used to power the flash memory. Additionally, the memory device includes a second power input to receive a second voltage. The memory device includes power management circuitry configured to receive the second voltage and derive one or more internal voltages. The power management circuitry supplies or conveys the internal voltages to the flash memory. The different internal voltages generated by the power management circuitry (e.g., voltage converter circuit) and supplied to the core memory enable operations such as read/program/erase with respect to cells in the core memory.
Abstract:
A semiconductor device includes a memory circuit, a first FIFO, a second FIFO and an input/output circuit. The memory circuit outputs data. The first FIFO receives data from the memory circuit and outputs data synchronously with a first clock signal. The second FIFO receives data output from the first FIFO and outputs data synchronously with the first clock signal. The input/output circuit outputs data output from the second FIFO. The second FIFO is disposed closer to the input/output circuit than the first FIFO.
Abstract:
A semiconductor memory device includes a plurality of memory cells connected to a plurality of word lines; a peripheral circuit suitable for applying a program pulse to at least one of the word lines, performing a program verification operation to the plurality of memory cells by using a first program verification voltage; and a control logic suitable for controlling the peripheral circuit to repeat the applying of the program pulse and the performing the program verification operation until program verification passes by increasing a level of the program pulse by an amount of a step voltage at each repetition, wherein a size of the step voltage decreases at each repetition.
Abstract:
A method populates a parameter set for dynamically adjusting an operating condition in a memory block of a non-volatile memory circuit. A desired condition limit is identified, and a first parameter is computed as a function of a first memory operation to be performed on the memory block. The first parameter is included in a parameter set, and the memory block is cycled until the operating condition reaches the desired condition limit. After cycling, a second parameter is determined as a function of a second memory operation to be performed on the memory block, and the second parameter is included in the parameter set. The steps of cycling, and determining and the including the second parameter may be repeated until a desired number of cycles/parameters are reached. A retention bake may also be performed on the memory circuit, and a bit error rate resulting from a read operation verified.