Patent search ap:"Yusuke Yasuda" Page 2

11.

发明申请
ELECTRONIC MEMBER, ELECTRONIC PART AND MANUFACTURING METHOD THEREFOR 失效
Title translation: 电子部件，电子部件及其制造方法

公开(公告)号：US20100195292A1

公开(公告)日：2010-08-05

申请号：US12696590

申请日：2010-01-29

Applicant: Eiichi Ide , Toshiaki Morita , Yusuke Yasuda

Inventor： Eiichi Ide , Toshiaki Morita , Yusuke Yasuda

IPC: H05K7/00 , H01B1/08 , H01B1/02 , H01B1/12 , H05K1/02 , H05K1/09 , B05D5/12 , C25D11/34

CPC classification number: H05K3/32 , C25D11/34 , H01L23/3142 , H01L23/481 , H01L23/49582 , H01L23/49811 , H01L23/49833 , H01L23/49866 , H01L23/50 , H01L24/13 , H01L24/16 , H01L24/27 , H01L24/32 , H01L24/45 , H01L24/48 , H01L24/50 , H01L24/73 , H01L24/81 , H01L24/83 , H01L25/0657 , H01L25/50 , H01L33/62 , H01L2224/05001 , H01L2224/05009 , H01L2224/05124 , H01L2224/05139 , H01L2224/05144 , H01L2224/05147 , H01L2224/05155 , H01L2224/05166 , H01L2224/05169 , H01L2224/05568 , H01L2224/05639 , H01L2224/13025 , H01L2224/13099 , H01L2224/13109 , H01L2224/16145 , H01L2224/16225 , H01L2224/29111 , H01L2224/29139 , H01L2224/2919 , H01L2224/29339 , H01L2224/32225 , H01L2224/32245 , H01L2224/45144 , H01L2224/48091 , H01L2224/48105 , H01L2224/48177 , H01L2224/48227 , H01L2224/48247 , H01L2224/73204 , H01L2224/73265 , H01L2224/81009 , H01L2224/81193 , H01L2224/81201 , H01L2224/81395 , H01L2224/81486 , H01L2224/8184 , H01L2224/83801 , H01L2224/8384 , H01L2224/85205 , H01L2225/06513 , H01L2225/06541 , H01L2924/00011 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01013 , H01L2924/01014 , H01L2924/01016 , H01L2924/01019 , H01L2924/01022 , H01L2924/01028 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01042 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/01327 , H01L2924/0133 , H01L2924/014 , H01L2924/0665 , H01L2924/10253 , H01L2924/12041 , H01L2924/12044 , H01L2924/15747 , H01L2924/1576 , H01L2924/181 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/19105 , H01L2924/351 , H05K1/185 , H05K3/244 , H05K2201/10636 , H05K2201/10674 , H05K2203/0315 , H05K2203/1157 , H05K2203/121 , Y02P70/611 , H01L2924/00014 , H01L2924/00 , H01L2924/00012 , H01L2924/3512 , H01L2924/053 , H01L2224/83205

Abstract: When silver oxide is reduced to silver, a large number of cores of metallic silver are formed inside the silver oxide. Then, the silver oxide is reduced in a manner of being hollowed out while its original outer configuration is being maintained. As a result, the curvature of the silver generated becomes larger. The utilization of this microscopic-particle implementation mechanism allows accomplishment of the bonding even if the silver oxide is supplied not in a particle-like configuration, but in a closely-packed layer-like configuration. In the present invention, there is provided an electronic member including an electrode for inputting/outputting an electrical signal, or a connection terminal for establishing a connection with the electrical signal, wherein the uppermost surface of the electrode or the connection terminal is a silver-oxide layer.

Abstract translation: 当氧化银还原成银时，在氧化银内形成大量的金属银芯。然后，氧化银被以中空的方式被还原，同时保持原有的外部结构。结果，产生的银的曲率变大。利用这种微观粒子实施机制，即使氧化银不是颗粒状构造而是紧密堆叠的层状结构，也可实现粘结。在本发明中，提供了一种电子部件，其包括用于输入/输出电信号的电极或用于建立与电信号的连接的连接端子，其中电极或连接端子的最上表面是银 - 氧化层。

12.

发明申请
SEMICONDUCTOR DEVICE, MANUFACTURING METHOD THEREOF, COMPOSITE METAL BODY AND MANUFACTURING METHOD THEREOF 有权
Title translation: 半导体器件及其制造方法，复合金属体及其制造方法

公开(公告)号：US20080237851A1

公开(公告)日：2008-10-02

申请号：US12019789

申请日：2008-01-25

Applicant: Toshiaki Morita , Yusuke Yasuda , Eiichi Ide

Inventor： Toshiaki Morita , Yusuke Yasuda , Eiichi Ide

IPC: H01L23/488 , H01L21/44

CPC classification number: H01L24/33 , H01L24/37 , H01L24/40 , H01L24/83 , H01L24/84 , H01L25/072 , H01L25/18 , H01L2224/04026 , H01L2224/29347 , H01L2224/32225 , H01L2224/325 , H01L2224/371 , H01L2224/37147 , H01L2224/37599 , H01L2224/40095 , H01L2224/40225 , H01L2224/48091 , H01L2224/48247 , H01L2224/49113 , H01L2224/49175 , H01L2224/73221 , H01L2224/73263 , H01L2224/83801 , H01L2224/8384 , H01L2224/84801 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01018 , H01L2924/01024 , H01L2924/01027 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01044 , H01L2924/01045 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01073 , H01L2924/01074 , H01L2924/01075 , H01L2924/01076 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/13091 , H01L2924/181 , H01L2924/19107 , H01L2924/351 , H01L2924/00014 , H01L2924/00 , H01L2924/00012

Abstract: A semiconductor device having a structure in which a semiconductor element and a Cu or Ni electrode are connected by way of a bonding layer comprising Cu, and the Cu bonding layer and the Cu or Ni electrode are diffusion-bonded to each other. The bonding layer is formed by conducting bonding in a reducing atmosphere by using a bonding material containing particles of Cu oxide with an average particle size of 1 nm to 50 μm and a reducing agent comprising an organic material, thereby providing excellent bonding strength to Ni or Cu electrode.

Abstract translation: 具有通过包含Cu的接合层连接半导体元件和Cu或Ni电极的结构的半导体器件，并且Cu键合层和Cu或Ni电极彼此扩散接合。通过使用含有平均粒径为1nm〜50μm的Cu氧化物的颗粒的接合材料和包含有机材料的还原剂，通过在还原气氛中导电接合而形成接合层，由此对Ni或铜电极。

13.

发明申请
CONDUCTIVE SINTERED LAYER FORMING COMPOSITION AND CONDUCTIVE COATING FILM FORMING METHOD AND BONDING METHOD USING THE SAME 审中-公开
Title translation: 导电烧结层形成组合物和导电涂膜形成方法和使用其的粘结方法

公开(公告)号：US20080160183A1

公开(公告)日：2008-07-03

申请号：US11965810

申请日：2007-12-28

Applicant: Eiichi Ide , Toshiaki Morita , Yusuke Yasuda , Hiroshi Hozoji

Inventor： Eiichi Ide , Toshiaki Morita , Yusuke Yasuda , Hiroshi Hozoji

IPC: H01B1/08 , B05D5/12 , B22F7/04

CPC classification number: H01B1/02 , B22F7/04 , H01B1/08 , H01L23/3735 , H01L23/3737 , H01L24/29 , H01L24/33 , H01L24/37 , H01L24/40 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/83 , H01L24/91 , H01L2224/27334 , H01L2224/29101 , H01L2224/29111 , H01L2224/29139 , H01L2224/2919 , H01L2224/29339 , H01L2224/29344 , H01L2224/29355 , H01L2224/29364 , H01L2224/29366 , H01L2224/29369 , H01L2224/32225 , H01L2224/32245 , H01L2224/37147 , H01L2224/40225 , H01L2224/45015 , H01L2224/45124 , H01L2224/45139 , H01L2224/45147 , H01L2224/48247 , H01L2224/49175 , H01L2224/73221 , H01L2224/73265 , H01L2224/83801 , H01L2224/8384 , H01L2224/8484 , H01L2224/85205 , H01L2224/8584 , H01L2924/00011 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01019 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/0133 , H01L2924/014 , H01L2924/0665 , H01L2924/09701 , H01L2924/10253 , H01L2924/12042 , H01L2924/13091 , H01L2924/15153 , H01L2924/15165 , H01L2924/15787 , H01L2924/181 , H01L2924/19041 , H01L2924/19043 , H01L2924/19105 , H01L2924/19107 , H01L2924/2076 , H05K1/097 , H05K3/321 , H05K2201/0224 , H01L2924/00014 , H01L2924/00 , H01L2924/3512 , H01L2224/83205 , H01L2924/00012

Abstract: There is provided a conductive sintered layer forming composition and a conductive sintered layer forming method that can lower heating temperature and shorten heating time for a process of accelerating sintering or bonding by sintering of metal nano-particles coated with an organic substance. The conductive sintered layer forming composition may be obtained by utilizing a phenomenon that particles may be sintered at low temperature by mixing silver oxide with metal particles coated with the organic substance and having a grain size of 1 nm to 5 μm as compared to sintering each simple substance. The conductive sintered layer forming composition of the invention is characterized in that it contains the metal particles whose surface is coated with the organic substance and whose grain size is 1 nm to 5 μm and the silver oxide particles.

Abstract translation: 提供一种导电烧结层形成组合物和导电烧结层形成方法，其可以通过烧结具有有机物质的金属纳米颗粒的烧结来加速烧结或接合的过程，从而降低加热温度并缩短加热时间。形成导电烧结层的组合物可以通过利用颗粒可以通过将氧化银与涂覆有机物质的金属颗粒混合并且与烧结相比具有1nm至5μm的颗粒尺寸而在低温下烧结的现象获得物质。本发明的导电性烧结层形成用组合物的特征在于，其含有表面被有机物质覆盖，粒径为1nm〜5μm的金属粒子和氧化银粒子。

14.

发明授权
Low temperature bonding material comprising coated metal nanoparticles, and bonding method 有权
Title translation: 包含金属纳米颗粒的低温粘合材料和粘合方法

公开(公告)号：US08821676B2

公开(公告)日：2014-09-02

申请号：US13099394

申请日：2011-05-03

Applicant: Yusuke Yasuda , Toshiaki Morita , Eiichi Ide , Hiroshi Hozoji , Toshiaki Ishii

Inventor： Yusuke Yasuda , Toshiaki Morita , Eiichi Ide , Hiroshi Hozoji , Toshiaki Ishii

IPC: B29C65/02 , B32B5/02 , B32B5/16

CPC classification number: H05K3/321 , B22F1/0014 , B22F1/0062 , B22F3/14 , B22F2003/145 , B23K35/22 , B23K35/3006 , B23K35/3013 , B23K35/302 , B23K35/40 , H01L24/29 , H01L24/32 , H01L24/33 , H01L24/37 , H01L24/40 , H01L24/45 , H01L24/83 , H01L25/072 , H01L2224/29007 , H01L2224/29101 , H01L2224/2919 , H01L2224/29311 , H01L2224/29324 , H01L2224/29339 , H01L2224/29344 , H01L2224/29355 , H01L2224/2936 , H01L2224/29364 , H01L2224/29366 , H01L2224/29369 , H01L2224/29371 , H01L2224/32225 , H01L2224/32245 , H01L2224/371 , H01L2224/37147 , H01L2224/3754 , H01L2224/40095 , H01L2224/40225 , H01L2224/45015 , H01L2224/45124 , H01L2224/48247 , H01L2224/49175 , H01L2224/73265 , H01L2224/83801 , H01L2224/8384 , H01L2224/84801 , H01L2224/85205 , H01L2224/8584 , H01L2924/00011 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01016 , H01L2924/01019 , H01L2924/01024 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01044 , H01L2924/01045 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01073 , H01L2924/01074 , H01L2924/01075 , H01L2924/01076 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/0665 , H01L2924/09701 , H01L2924/10253 , H01L2924/13091 , H01L2924/15153 , H01L2924/15165 , H01L2924/15787 , H01L2924/181 , H01L2924/19041 , H01L2924/19043 , H01L2924/19105 , H01L2924/2076 , H05K2201/0224 , H05K2201/0257 , H05K2201/0266 , Y10T428/12028 , Y10T428/12181 , Y10T428/2991 , Y10T428/8305 , H01L2924/00014 , H01L2924/00 , H01L2924/3512 , H01L2224/83205 , H01L2924/00012

Abstract: A bonding material comprising metal particles coated with an organic substance having carbon atoms of 2 to 8, wherein the metal particles comprises first portion of 100 nm or less, and a second portion larger than 100 nm but not larger than 100 μm, each of the portions having at least peak of a particle distribution, based on a volumetric base. The disclosure is further concerned with a bonding method using the bonding material.

Abstract translation: 一种粘合材料，其包含涂覆有碳原子数为2〜8的有机物质的金属粒子，其中，所述金属粒子包含100nm以下的第一部分和大于100nm但不大于100μm的第二部分，基于体积基数具有至少峰值分布的部分。本公开还涉及使用接合材料的接合方法。

15.

发明申请
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME 审中-公开
Title translation: 半导体器件及其制造方法

公开(公告)号：US20110156225A1

公开(公告)日：2011-06-30

申请号：US13062565

申请日：2009-07-31

Applicant: Hiroshi Hozoji , Toshiaki Morita , Yusuke Yasuda , Chiko Yorita , Yuji Shirai

Inventor： Hiroshi Hozoji , Toshiaki Morita , Yusuke Yasuda , Chiko Yorita , Yuji Shirai

IPC: H01L23/552 , H01L21/56

CPC classification number: H01L23/3121 , H01L21/561 , H01L23/3677 , H01L23/552 , H01L23/66 , H01L24/32 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/97 , H01L25/165 , H01L2221/68331 , H01L2224/32225 , H01L2224/32227 , H01L2224/45599 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2224/92 , H01L2224/97 , H01L2924/00014 , H01L2924/014 , H01L2924/12044 , H01L2924/14 , H01L2924/15313 , H01L2924/181 , H01L2924/19041 , H01L2924/19105 , H01L2924/3025 , H05K1/0206 , H05K1/0218 , H05K3/284 , H05K2201/0715 , H05K2201/0919 , H05K2203/1131 , H05K2203/1316 , H01L2224/83 , H01L2224/85 , H01L2224/92247 , H01L2924/00012 , H01L2924/3512 , H01L2924/00 , H01L2224/45015 , H01L2924/207 , H01L2224/45099

Abstract: A semiconductor device achieving both electromagnetic wave shielding property and reliability in a heating process upon mounting electronic components. In the semiconductor device, mount devices 5 and 6 mounted on a main surface of a circuit board 1 are provided, the mount devices 5 and 6 are electrically connected to a wiring pattern 4 at the main surface of the circuit board 1, a sealant 7 of an insulating resin is formed to seal the mount devices 5 and 6, metal particles are applied to a surface of the sealant 7, and the metal particles applied are sintered, thereby forming an electromagnetic shielding layer 2, and electrically connecting the electromagnetic shielding layer 2 to a ground pattern 3 of the circuit board 1.

Abstract translation: 一种在安装电子元件时实现电加热过程中的电磁波屏蔽性和可靠性的半导体器件。在半导体装置中，设置安装在电路基板1的主表面上的安装装置5和6，安装装置5和6在电路板1的主表面电连接到布线图案4，密封剂7 形成绝缘树脂以密封安装装置5和6，将金属颗粒施加到密封剂7的表面，并且将所施加的金属颗粒烧结，从而形成电磁屏蔽层2，并将电磁屏蔽层 2到电路板1的接地图案3。

16.

发明申请
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME 有权
Title translation: 半导体器件及其制造方法

公开(公告)号：US20110012262A1

公开(公告)日：2011-01-20

申请号：US12825783

申请日：2010-06-29

Applicant: Toshiaki MORITA , Yusuke Yasuda , Eiichi Ide

Inventor： Toshiaki MORITA , Yusuke Yasuda , Eiichi Ide

IPC: H01L23/498 , H01L21/768

CPC classification number: H01L24/29 , H01L24/32 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/83 , H01L2224/05624 , H01L2224/29101 , H01L2224/2919 , H01L2224/29339 , H01L2224/32225 , H01L2224/325 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48465 , H01L2224/48624 , H01L2224/73265 , H01L2224/8384 , H01L2224/92 , H01L2224/92247 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01019 , H01L2924/01024 , H01L2924/01028 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01044 , H01L2924/01045 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01073 , H01L2924/01074 , H01L2924/01075 , H01L2924/01076 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/014 , H01L2924/0665 , H01L2924/10253 , H01L2924/10272 , H01L2924/15173 , H01L2924/15311 , H01L2924/181 , H01L2924/00014 , H01L2924/00012 , H01L2924/00 , H01L2924/01026

Abstract: A semiconductor device wherein a semiconductor element made of Si or Si group material mounted on a substrate, the semiconductor element is mounted on the substrate and the semiconductor element is bonded to a silver bonding material via a oxide film formed on the semiconductor element. The bonding material comprising silver oxide particles having an average particle size of 1 nm to 50 nm and an organic reducing agent is used for bonding in air, which gives a high bonding strength to the oxide on the semiconductor element.

Abstract translation: 一种半导体器件，其中安装在衬底上的由Si或Si基团材料制成的半导体元件，所述半导体元件安装在所述衬底上，并且所述半导体元件经由形成在所述半导体元件上的氧化物膜结合到银接合材料。使用包含平均粒径为1nm〜50nm的氧化银粒子和有机还原剂的接合材料在空气中接合，这对半导体元件上的氧化物具有高的接合强度。

17.

发明申请
Interconnect material and interconnect formation method 审中-公开
Title translation: 互连材料和互连形成方法

公开(公告)号：US20090180914A1

公开(公告)日：2009-07-16

申请号：US12292937

申请日：2008-12-01

Applicant: Motoi Tobita , Yusuke Yasuda

Inventor： Motoi Tobita , Yusuke Yasuda

IPC: B22F7/00 , B32B15/02

CPC classification number: B22F1/0062 , B22F7/04 , Y10T428/2991

Abstract: A metal particle having an organic substance coated thereon, dispersibility that is the same as that of a known metal particle having an organic substance coated thereon, and an improved low temperature connectability. A method for forming interconnect between materials by using the interconnect materials that include a metal particle on which an organic substance is coated, which includes the steps of coating the interconnect materials on subject interconnect materials, and heating the materials at a temperature in the range of 50 to 400° C. for 1 sec to 10 min to form a sintered body made of metal between the subject interconnect materials. The organic substance is a secondary amine having a molecular weight of 250 or less, and the metal particle is made of a unit of silver, copper, or gold, which has a mean diameter of 100 nm or less, or a mixture thereof.

Abstract translation: 具有涂布有机物的金属颗粒，其分散性与其上涂覆有有机物质的已知金属颗粒的分散性和改善的低温连接性相同。一种用于通过使用包括其上涂覆有机物质的金属颗粒的互连材料形成材料之间的互连的方法，其包括以下步骤：在物体互连材料上涂布互连材料，并在 50〜400℃，保持1〜10分钟，形成由金属构成的烧结体。有机物质是分子量为250以下的仲胺，金属颗粒由平均直径为100nm以下的银，铜或金的单位或其混合物构成。

18.

发明申请
BONDING MATERIALS HAVING PARTICLE WITH ANISOTROPIC SHAPE 审中-公开
Title translation: 具有异物形状的颗粒的粘合材料

公开(公告)号：US20070298244A1

公开(公告)日：2007-12-27

申请号：US11766124

申请日：2007-06-21

Applicant: YUSUKE YASUDA , Toshiaki Morita , Toshiaki Ishii

Inventor： YUSUKE YASUDA , Toshiaki Morita , Toshiaki Ishii

IPC: B32B5/16

CPC classification number: H01L24/29 , B23K35/0233 , B23K35/22 , H01L24/33 , H01L24/37 , H01L24/40 , H01L24/83 , H01L25/072 , H01L2224/29101 , H01L2224/29111 , H01L2224/29144 , H01L2224/2919 , H01L2224/29339 , H01L2224/32225 , H01L2224/371 , H01L2224/3754 , H01L2224/40095 , H01L2224/40225 , H01L2224/45015 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/49111 , H01L2224/49175 , H01L2224/73265 , H01L2224/83801 , H01L2224/8384 , H01L2224/85205 , H01L2924/00011 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01024 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01044 , H01L2924/01045 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01073 , H01L2924/01074 , H01L2924/01076 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/01322 , H01L2924/014 , H01L2924/0665 , H01L2924/10253 , H01L2924/13091 , H01L2924/15787 , H01L2924/1579 , H01L2924/181 , H01L2924/19043 , H01L2924/19107 , Y10T428/256 , H01L2924/00014 , H01L2924/00 , H01L2924/00012 , H01L2924/00015 , H01L2924/2076 , H01L2224/83205

Abstract: An object of the present invention is to provide a bonding material that is excellent in shear strength and a capability of heat radiation of a bonding layer and can be formed into a sheet. The present invention has a feature of providing a bonding material comprising metal fibers each of which is coated on its surface with an organic material or a metal oxide, has an aspect ratio not more than 2, and has a longitudinal length equal to or less than 100 μm; and metal particles each of which is coated on its surface with an organic material or a metal oxide, has an aspect ratio equal to or less than 1.5, and has a particle size equal to or less than 100 nm, wherein sintering of the metal particles forms metallic bonds between the bonding material and surfaces of members to be bonded, thereby bonding the members to be bonded together.

Abstract translation: 本发明的目的在于提供一种接合材料，该接合材料的粘合层的剪切强度和热辐射能力优异，并且可以形成为片材。本发明的特征在于提供一种包含金属纤维的接合材料，每个金属纤维在其表面上涂覆有机材料或金属氧化物，其纵横比不大于2，纵向长度等于或小于 100个妈妈并且其表面上分别用有机材料或金属氧化物涂覆的金属颗粒具有等于或小于1.5的长径比，并且具有等于或小于100nm的粒度，其中金属颗粒的烧结在接合材料和要结合的构件的表面之间形成金属键，从而将要结合的构件结合在一起。