公开(公告)号：US07759135B2

公开(公告)日：2010-07-20

申请号：US12242163

申请日：2008-09-30

Applicant: Horst Theuss

Inventor： Horst Theuss

IPC: H01L21/00 ,  H01L21/44 ,  H01L23/58 ,  H01L27/14 ,  H01L23/22

CPC classification number: G01P1/023 ,  H01L21/561 ,  H01L21/568 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48145 ,  H01L2924/10158 ,  H01L2924/1461 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/3025 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: A method of manufacturing a sensor node module includes forming a protruding structure on a carrier. A sensor die is applied onto the protruding structure with an active sensing surface of the sensor die facing the carrier. The sensor die is encapsulated with mold material, wherein the protruding structure prevents the mold material from covering the active sensing surface. The carrier and the protruding structure are removed from the sensor die.

Abstract translation: 制造传感器节点模块的方法包括在载体上形成突出结构。 将传感器模具施加到突出结构上，其中传感器芯片的主动感测表面面向载体。 传感器模具用模具材料封装，其中突出结构防止模具材料覆盖主动感测表面。 载体和突出结构从传感器模具中移除。

公开(公告)号：US07719101B2

公开(公告)日：2010-05-18

申请号：US11627670

申请日：2007-01-26

Applicant: Jochen Dangelmaier ,  Horst Theuss

Inventor： Jochen Dangelmaier ,  Horst Theuss

IPC: H01L23/48

CPC classification number: H01L24/10 ,  H01L22/32 ,  H01L23/3114 ,  H01L23/3171 ,  H01L24/05 ,  H01L24/06 ,  H01L24/12 ,  H01L24/13 ,  H01L24/16 ,  H01L2224/023 ,  H01L2224/0401 ,  H01L2224/05022 ,  H01L2224/05571 ,  H01L2224/0603 ,  H01L2224/10145 ,  H01L2224/13 ,  H01L2224/13005 ,  H01L2224/13022 ,  H01L2224/13027 ,  H01L2224/13099 ,  H01L2224/14 ,  H01L2224/1403 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/171 ,  H01L2924/00 ,  H01L2924/0002 ,  H01L2924/01006 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01068 ,  H01L2924/014 ,  H01L2924/10157 ,  H01L2924/207 ,  H01L2224/05552 ,  H01L2924/00012

Abstract: A semiconductor device includes surface-mountable external contacts on an underside of the semiconductor device, wherein the external contacts are arranged on external contact pads and surrounded by a solder-resist layer. The external contacts of the outer edge regions include external contact pads that merge into inspection tags, wherein the inspection tags can be wetted by solder and are not covered by the solder-resist layer.

Abstract translation: 半导体器件包括在半导体器件的下侧上的可表面安装的外部触点，其中外部触点布置在外部接触焊盘上并被阻焊层包围。 外边缘区域的外部触点包括合并到检查标签中的外部接触垫，其中检查标签可以被焊料润湿并且不被阻焊层覆盖。

公开(公告)号：US20100078832A1

公开(公告)日：2010-04-01

申请号：US12242163

申请日：2008-09-30

Applicant: Horst Theuss

Inventor： Horst Theuss

IPC: H01L21/50 ,  G08B23/00 ,  H01L23/31

CPC classification number: G01P1/023 ,  H01L21/561 ,  H01L21/568 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48145 ,  H01L2924/10158 ,  H01L2924/1461 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/3025 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: A method of manufacturing a sensor node module includes forming a protruding structure on a carrier. A sensor die is applied onto the protruding structure with an active sensing surface of the sensor die facing the carrier. The sensor die is encapsulated with mold material, wherein the protruding structure prevents the mold material from covering the active sensing surface. The carrier and the protruding structure are removed from the sensor die.

Abstract translation: 制造传感器节点模块的方法包括在载体上形成突出结构。 将传感器模具施加到突出结构上，其中传感器芯片的主动感测表面面向载体。 传感器模具用模具材料封装，其中突出结构防止模具材料覆盖主动感测表面。 载体和突出结构从传感器模具中移除。

公开(公告)号：US07566585B2

公开(公告)日：2009-07-28

申请号：US11552702

申请日：2006-10-25

Applicant: Horst Theuss

Inventor： Horst Theuss

IPC: H01L21/44

CPC classification number: H01L23/49503 ,  H01L24/48 ,  H01L24/81 ,  H01L24/83 ,  H01L24/85 ,  H01L2224/0401 ,  H01L2224/0603 ,  H01L2224/10135 ,  H01L2224/10165 ,  H01L2224/1403 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/17 ,  H01L2224/1703 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/81136 ,  H01L2224/81138 ,  H01L2224/81194 ,  H01L2224/81801 ,  H01L2224/83801 ,  H01L2224/85 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01032 ,  H01L2924/01068 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/181 ,  H01L2924/3511 ,  H01L2924/3512 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A semiconductor substrate, a semiconductor chip and a semiconductor component with areas composed of a stressed monocrystalline material, and a method for production of a semiconductor component is disclosed. In one embodiment, the semiconductor chip includes relatively thick stressed layers achieving reduced switching times. For this purpose, the semiconductor substrate has one or more areas with extrinsic, permanent curvature, with the crystal structure K being compressed and/or widened and/or distorted in these areas.

Abstract translation: 公开了一种半导体衬底，半导体芯片和具有由应力单晶材料构成的区域的半导体元件，以及用于制造半导体元件的方法。 在一个实施例中，半导体芯片包括实现减少的开关时间的相对厚的应力层。 为此，半导体衬底具有一个或多个具有外部永久曲率的区域，晶体结构K在这些区域中被压缩和/或加宽和/或变形。

公开(公告)号：US20090127638A1

公开(公告)日：2009-05-21

申请号：US11941625

申请日：2007-11-16

Applicant: Thomas Kilger ,  Horst Theuss

Inventor： Thomas Kilger ,  Horst Theuss

IPC: H01L29/84 ,  H01L21/50

CPC classification number: H01L23/315 ,  B81B7/007 ,  B81C1/0023 ,  B81C2203/0154 ,  G01L19/0645 ,  G01L19/141 ,  H01L23/3128 ,  H01L23/3135 ,  H01L23/49822 ,  H01L23/5389 ,  H01L23/552 ,  H01L24/16 ,  H01L24/48 ,  H01L24/97 ,  H01L25/0657 ,  H01L25/162 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/97 ,  H01L2225/0651 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01068 ,  H01L2924/01082 ,  H01L2924/09701 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/1461 ,  H01L2924/15311 ,  H01L2924/16152 ,  H01L2924/1617 ,  H01L2924/16195 ,  H01L2924/1627 ,  H01L2924/181 ,  H01L2924/3025 ,  H05K1/186 ,  H05K3/4611 ,  H05K3/4644 ,  H05K2201/0195 ,  H05K2201/10151 ,  H05K2201/10371 ,  H01L2224/85 ,  H01L2224/81 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: An electrical device and method is disclosed. One embodiment provides a substrate, a sensor chip disposed completely above a plane section of a surface of the substrate. A structurally homogeneous material layer is disposed above the substrate and the sensor chip. A cavity is formed between the substrate and the material layer. The sensor chip is disposed inside the cavity.

Abstract translation: 公开了一种电气装置和方法。 一个实施例提供了一种基板，完全设置在基板的表面的平面部分上方的传感器芯片。 结构均匀的材料层设置在基板和传感器芯片上。 在基板和材料层之间形成空腔。 传感器芯片设置在腔内。

公开(公告)号：US20090026560A1

公开(公告)日：2009-01-29

申请号：US11828085

申请日：2007-07-25

Applicant: Ralf Wombacher ,  Horst Theuss

Inventor： Ralf Wombacher ,  Horst Theuss

IPC: H01L29/84 ,  H01L21/56 ,  H01L31/0203

CPC classification number: H01L23/291 ,  B81B7/0025 ,  H01L23/055 ,  H01L23/298 ,  H01L23/564 ,  H01L24/34 ,  H01L24/45 ,  H01L24/48 ,  H01L24/83 ,  H01L24/85 ,  H01L24/97 ,  H01L2224/0401 ,  H01L2224/05624 ,  H01L2224/05669 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/45014 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/484 ,  H01L2224/48624 ,  H01L2224/48669 ,  H01L2224/48724 ,  H01L2224/48769 ,  H01L2224/48824 ,  H01L2224/48869 ,  H01L2224/73265 ,  H01L2224/8192 ,  H01L2224/81951 ,  H01L2224/83 ,  H01L2224/83801 ,  H01L2224/8385 ,  H01L2224/8592 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01007 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01023 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01068 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/1461 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19043 ,  H01L2224/85 ,  H01L2924/00 ,  H01L2224/37099

Abstract: A sensor package is disclosed. One embodiment provides a sensor device having a carrier, a semiconductor sensor mounted on the carrier and an active surface. Contact elements are electrically connecting the carrier with the semiconductor sensor. A protective layer made of an inorganic material covers at least the active surface and the contact elements.

Abstract translation: 公开了一种传感器封装。 一个实施例提供了一种具有载体，安装在载体上的半导体传感器和有源表面的传感器装置。 接触元件将载体与半导体传感器电连接。 由无机材料制成的保护层至少覆盖活性表面和接触元件。

公开(公告)号：US07468560B2

公开(公告)日：2008-12-23

申请号：US11335125

申请日：2006-01-19

Applicant: Volker Guengerich ,  Horst Theuss

Inventor： Volker Guengerich ,  Horst Theuss

IPC: H01L23/48 ,  H01L29/40

CPC classification number: H01L23/3128 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/50 ,  H01L23/66 ,  H01L24/28 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/46 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/83 ,  H01L24/85 ,  H01L2223/6611 ,  H01L2223/6622 ,  H01L2223/6627 ,  H01L2224/05624 ,  H01L2224/05644 ,  H01L2224/29101 ,  H01L2224/32225 ,  H01L2224/45014 ,  H01L2224/45015 ,  H01L2224/45033 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45572 ,  H01L2224/45573 ,  H01L2224/45686 ,  H01L2224/45688 ,  H01L2224/4569 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/48235 ,  H01L2224/48471 ,  H01L2224/48599 ,  H01L2224/48699 ,  H01L2224/48799 ,  H01L2224/4899 ,  H01L2224/49109 ,  H01L2224/73265 ,  H01L2224/83801 ,  H01L2224/8385 ,  H01L2224/85 ,  H01L2224/85205 ,  H01L2224/86205 ,  H01L2924/00011 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01068 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/078 ,  H01L2924/07802 ,  H01L2924/0781 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/1903 ,  H01L2924/2075 ,  H01L2924/20751 ,  H01L2924/20752 ,  H01L2924/20753 ,  H01L2924/20754 ,  H01L2924/20755 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/3025 ,  H05K1/0243 ,  H05K3/341 ,  H05K2201/09472 ,  H05K2201/09809 ,  H05K2201/10287 ,  H05K2201/10356 ,  H01L2924/00014 ,  H01L2224/78 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/00015 ,  H01L2224/83205

Abstract: A semiconductor device with micro connecting elements and method for producing the same disclosed. In one embodiment, the semiconductor device includes a number of micro connecting elements for the high-frequency coupling of components of the semiconductor device. The micro connecting elements have an at least three-layered structural form with a first layer of conducting material, a second layer of insulating material and a third layer of conducting material. In this configuration, the first and third layers and extend along a common center line and shield one another against electromagnetic interference fields. The first and third layers and are fixed on correspondingly adapted pairs of contact terminal areas of the components.

Abstract translation: 具有微连接元件的半导体器件及其制造方法。 在一个实施例中，半导体器件包括用于半导体器件的部件的高频耦合的多个微连接元件。 微连接元件具有至少三层结构形式，其具有第一层导电材料，第二层绝缘材料和第三层导电材料。 在该配置中，第一和第三层沿公共中心线延伸并相互屏蔽电磁干扰场。 第一和第三层并且固定在部件的相应适应的接触端子区域对上。

公开(公告)号：US20080197485A1

公开(公告)日：2008-08-21

申请号：US11709337

申请日：2007-02-21

Applicant: Horst Theuss ,  Bernd Stadler

Inventor： Horst Theuss ,  Bernd Stadler

IPC: H01L23/04 ,  H01L21/00

CPC classification number: H01L23/055 ,  B81B7/0077 ,  B81B2201/0257 ,  H01L23/552 ,  H01L24/29 ,  H01L24/30 ,  H01L24/32 ,  H01L24/33 ,  H01L24/48 ,  H01L25/16 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/29101 ,  H01L2224/32145 ,  H01L2224/48091 ,  H01L2224/48145 ,  H01L2224/48227 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/1461 ,  H01L2924/15151 ,  H01L2924/15787 ,  H01L2924/16151 ,  H01L2924/16152 ,  H01L2924/3025 ,  H04R1/04 ,  H04R1/06 ,  H01L2924/00 ,  H01L2224/0401 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2924/00012

Abstract: The invention relates to a module comprising a carrier, a first semiconductor chip applied to the carrier and having a movable element and a second semiconductor chip applied to the first semiconductor chip, wherein an active first main surface of the first semiconductor chip faces the carrier and a first cavity is formed between the two semiconductor chips.

Abstract translation: 本发明涉及一种模块，包括载体，施加到载体上的第一半导体芯片，并具有可移动元件和应用于第一半导体芯片的第二半导体芯片，其中第一半导体芯片的有源第一主表面面向载体， 在两个半导体芯片之间形成第一空腔。

公开(公告)号：US07319598B2

公开(公告)日：2008-01-15

申请号：US10519215

申请日：2003-06-25

Applicant: Rainer Steiner ,  Horst Theuss

Inventor： Rainer Steiner ,  Horst Theuss

IPC: H05K7/00

CPC classification number: H01L24/10 ,  H01L21/56 ,  H01L21/561 ,  H01L21/563 ,  H01L23/055 ,  H01L23/3128 ,  H01L23/3135 ,  H01L24/13 ,  H01L24/29 ,  H01L24/83 ,  H01L24/97 ,  H01L25/0655 ,  H01L25/16 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/83192 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/0101 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01052 ,  H01L2924/01068 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12041 ,  H01L2924/15151 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/3025 ,  H05K1/185 ,  H01L2224/81 ,  H01L2924/00 ,  H01L2224/05599

Abstract: The invention relates to an electronic component with a housing package comprising a number of layers of plastic with at least one buried interconnect layer and with at least one semiconductor chip, which has pointed-conical external contacts distributed on an outer side. The pointed-conical external contacts penetrate through one of the layers of plastic and form contact vias with respect to the buried interconnect layer. Furthermore, the invention relates to a method for producing such an electronic component.

Abstract translation: 本发明涉及一种具有壳体封装的电子部件，该壳体封装包括具有至少一个掩埋互连层的多个塑料层和至少一个半导体芯片，该半导体芯片具有分布在外侧上的尖锥形外部触点。 尖锥形外部触头穿过塑料层之一并形成相对于掩埋互连层的接触通孔。 此外，本发明涉及一种用于制造这种电子部件的方法。

公开(公告)号：US07268436B2

公开(公告)日：2007-09-11

申请号：US10795344

申请日：2004-03-09

Applicant: Robert Aigner ,  Albert Auburger ,  Frank Daeche ,  Guenter Ehrler ,  Andreas Meckes ,  Horst Theuss ,  Michael Weber

Inventor： Robert Aigner ,  Albert Auburger ,  Frank Daeche ,  Guenter Ehrler ,  Andreas Meckes ,  Horst Theuss ,  Michael Weber

IPC: H01L23/12 ,  H01L23/48 ,  H01L23/52 ,  H01L29/40

CPC classification number: H03H9/1085 ,  H01L23/3107 ,  H01L23/4951 ,  H01L2224/32145 ,  H01L2224/48091 ,  H01L2224/48465 ,  H01L2224/73265 ,  H03H9/0547 ,  H03H9/105 ,  H01L2924/00014 ,  H01L2924/00

Abstract: An electronic device can include a top side with circuit structures. The circuit structures form the bottom region of a cavity. Each cavity can be surrounded by a cavity frame made of plastic and can have a cavity cover made of semiconductor material.

Abstract translation: 电子设备可以包括具有电路结构的顶侧。 电路结构形成空腔的底部区域。 每个空腔可以由塑料制成的空腔框架包围，并且可以具有由半导体材料制成的空腔盖。