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    SEMICONDUCTOR DEVICES AND METHODS OF FABRICATING THE SAME
    5.
    发明申请
    SEMICONDUCTOR DEVICES AND METHODS OF FABRICATING THE SAME 有权
    半导体器件及其制造方法

    公开(公告)号：US20160351715A1

    公开(公告)日：2016-12-01

    申请号：US15135566

    申请日：2016-04-22

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Sujin JUNG ,  JinBum KIM ,  KANG HUN MOON ,  KWAN HEUM LEE ,  BYEONGCHAN LEE ,  Choeun LEE ,  Yang XU

    IPC: H01L29/78 ,  H01L29/66 ,  H01L29/08

    CPC classification number: H01L29/7851 ,  H01L29/0847 ,  H01L29/66795 ,  H01L29/7848

    Abstract: A semiconductor device is disclosed. The device includes a substrate including an active region defined by a device isolation layer, a fin pattern protruding from the substrate and extending in a first direction, the fin pattern including a gate fin region and a source/drain fin region, a gate pattern disposed on the gate fin region to extend in a second direction crossing the first direction, and a source/drain portion provided on a sidewall of the source/drain fin region. When measured in the second direction, a width of the source/drain fin region is different from a width in the second direction of the gate fin region.

    Abstract translation: 公开了一种半导体器件。 该器件包括：衬底，其包括由器件隔离层限定的有源区，从衬底突出并沿第一方向延伸的鳍状图案，所述鳍图案包括栅极鳍区和源极/漏极鳍区，栅极图案设置 在所述栅极鳍区域上沿与所述第一方向交叉的第二方向延伸，以及设置在所述源极/漏极鳍片区域的侧壁上的源极/漏极部分。 当在第二方向上测量时，源极/漏极鳍片区域的宽度不同于栅极鳍片区域的第二方向上的宽度。

    SEMICONDUCTOR DEVICE
    6.
    发明申请
    SEMICONDUCTOR DEVICE 有权
    半导体器件

    公开(公告)号：US20150287711A1

    公开(公告)日：2015-10-08

    申请号：US14562788

    申请日：2014-12-08

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： SEOKHOON KIM ,  BONYOUNG KOO ,  JinBum KIM ,  CHUL KIM ,  KWAN HEUM LEE ,  BYEONGCHAN LEE ,  Sujin JUNG

    IPC: H01L27/02 ,  H01L29/06 ,  H01L27/088 ,  H01L29/78

    CPC classification number: H01L27/0207 ,  H01L21/823431 ,  H01L27/0886 ,  H01L29/0649 ,  H01L29/66545 ,  H01L29/7834 ,  H01L29/7848

    Abstract: Provided is a semiconductor device which includes a substrate including a first region and a second region different from the first region, a first active pattern provided on the substrate in the first region, a second active pattern provided on the substrate in the second region, a first gate structure crossing over the first active pattern and a second gate structure crossing over the second active pattern, first source/drain regions disposed on the first active pattern at opposite sides of the first gate structure, second source/drain regions disposed on the second active pattern at opposite sides of the second gate structure, and auxiliary spacers disposed in the first region to cover a lower portion of each of the first source/drain regions.

    Abstract translation: 提供一种半导体器件，其包括：衬底，其包括第一区域和与第一区域不同的第二区域;设置在第一区域中的衬底上的第一有源图案，设置在第二区域中的衬底上的第二有源图案; 在第一有源图案上交叉的第一栅极结构和与第二有源图案交叉的第二栅极结构，在第一栅极结构的相对侧设置在第一有源图案上的第一源/漏区，设置在第二有源图案上的第二栅极结构的第二栅极结构 在第二栅极结构的相对侧的有源图案以及设置在第一区域中以覆盖每个第一源极/漏极区域的下部的辅助间隔物。

    SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING THE SAME
    7.
    发明申请
    SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING THE SAME 有权
    半导体器件及其制造方法

    公开(公告)号：US20160359021A1

    公开(公告)日：2016-12-08

    申请号：US15134556

    申请日：2016-04-21

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： JinBum KIM ,  Kang Hun MOON ,  Choeun LEE ,  Sujin JUNG ,  Yang XU

    IPC: H01L29/66 ,  H01L29/08 ,  H01L21/306 ,  H01L29/06 ,  H01L21/308 ,  H01L29/78 ,  H01L21/8234

    CPC classification number: H01L29/66795 ,  H01L21/823425 ,  H01L21/823431 ,  H01L29/0657 ,  H01L29/0688 ,  H01L29/0847 ,  H01L29/161 ,  H01L29/165 ,  H01L29/66545 ,  H01L29/6656 ,  H01L29/7848

    Abstract: Methods of forming an integrated circuit device are provided. The methods may include forming a gate structure on a substrate, forming a first etch mask on a sidewall of the gate structure, anisotropically etching the substrate using the gate structure and the first etch mask as an etch mask to form a preliminary recess in the substrate, forming a sacrificial layer in the preliminary recess, forming a second etch mask on the first etch mask, etching the sacrificial layer and the substrate beneath the sacrificial layer using the gate structure and the first and second etch masks as an etch mask to form a source/drain recess in the substrate, and forming a source/drain in the source/drain recess. A sidewall of the source/drain recess may be recessed toward the gate structure relative to an outer surface of the second etch mask.

    Abstract translation: 提供了形成集成电路器件的方法。 所述方法可以包括在衬底上形成栅极结构，在栅极结构的侧壁上形成第一蚀刻掩模，使用栅极结构和第一蚀刻掩模各向异性蚀刻衬底作为蚀刻掩模，以在衬底中形成预备凹槽 在所述初步凹槽中形成牺牲层，在所述第一蚀刻掩模上形成第二蚀刻掩模，使用所述栅极结构和所述第一和第二蚀刻掩模作为蚀刻掩模蚀刻所述牺牲层和所述牺牲层下方的所述衬底，以形成 源极/漏极凹部，并且在源极/漏极凹部中形成源极/漏极。 源极/漏极凹部的侧壁可以相对于第二蚀刻掩模的外表面朝向栅极结构凹陷。

    SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
    8.
    发明申请
    SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME 有权
    半导体器件及其制造方法

    公开(公告)号：US20150206956A1

    公开(公告)日：2015-07-23

    申请号：US14499922

    申请日：2014-09-29

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： JinBum KIM ,  JUNGHO YOO ,  BYEONGCHAN LEE ,  Choeun LEE ,  HYUN JUNG LEE ,  Seong Hoon JEONG ,  BONYOUNG KOO

    IPC: H01L29/66 ,  H01L21/02 ,  H01L29/165 ,  H01L21/8234

    CPC classification number: H01L29/66795 ,  H01L21/823431 ,  H01L21/823456 ,  H01L21/823481 ,  H01L29/165 ,  H01L29/66545 ,  H01L29/6656 ,  H01L29/7848

    Abstract: A method of manufacturing a semiconductor device includes forming an active pattern protruding from a semiconductor substrate, forming a dummy gate pattern crossing over the active pattern, forming gate spacers on opposite first and second sidewalls of the dummy gate pattern, removing the dummy gate pattern to form a gate region exposing an upper surface and sidewalls of the active pattern between the gate spacers, recessing the upper surface of the active pattern exposed by the gate region to form a channel recess region, forming a channel pattern in the channel recess region by a selective epitaxial growth (SEG) process, and sequentially forming a gate dielectric layer and a gate electrode covering an upper surface and sidewalls of the channel pattern in the gate region. The channel pattern has a lattice constant different from that of the semiconductor substrate.

    Abstract translation: 一种制造半导体器件的方法包括形成从半导体衬底突出的有源图案，形成与有源图案交叉的伪栅极图案，在伪栅极图案的相对的第一和第二侧壁上形成栅极间隔物，将伪栅极图案去除 形成栅极区域，暴露栅极间隔件之间的有源图案的上表面和侧壁，凹陷由栅极区域暴露的有源图案的上表面，以形成通道凹槽区域，在通道凹槽区域中形成通道图案 选择性外延生长（SEG）工艺，以及顺序地形成覆盖栅极区域中的沟道图案的上表面和侧壁的栅极电介质层和栅电极。 沟道图案具有与半导体衬底不同的晶格常数。

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