公开(公告)号：US20150206956A1

公开(公告)日：2015-07-23

申请号：US14499922

申请日：2014-09-29

Applicant: Samsung Electronics Co., Ltd.

Inventor： JinBum KIM ,  JUNGHO YOO ,  BYEONGCHAN LEE ,  Choeun LEE ,  HYUN JUNG LEE ,  Seong Hoon JEONG ,  BONYOUNG KOO

IPC: H01L29/66 ,  H01L21/02 ,  H01L29/165 ,  H01L21/8234

CPC classification number: H01L29/66795 ,  H01L21/823431 ,  H01L21/823456 ,  H01L21/823481 ,  H01L29/165 ,  H01L29/66545 ,  H01L29/6656 ,  H01L29/7848

Abstract: A method of manufacturing a semiconductor device includes forming an active pattern protruding from a semiconductor substrate, forming a dummy gate pattern crossing over the active pattern, forming gate spacers on opposite first and second sidewalls of the dummy gate pattern, removing the dummy gate pattern to form a gate region exposing an upper surface and sidewalls of the active pattern between the gate spacers, recessing the upper surface of the active pattern exposed by the gate region to form a channel recess region, forming a channel pattern in the channel recess region by a selective epitaxial growth (SEG) process, and sequentially forming a gate dielectric layer and a gate electrode covering an upper surface and sidewalls of the channel pattern in the gate region. The channel pattern has a lattice constant different from that of the semiconductor substrate.

Abstract translation: 一种制造半导体器件的方法包括形成从半导体衬底突出的有源图案，形成与有源图案交叉的伪栅极图案，在伪栅极图案的相对的第一和第二侧壁上形成栅极间隔物，将伪栅极图案去除 形成栅极区域，暴露栅极间隔件之间的有源图案的上表面和侧壁，凹陷由栅极区域暴露的有源图案的上表面，以形成通道凹槽区域，在通道凹槽区域中形成通道图案 选择性外延生长（SEG）工艺，以及顺序地形成覆盖栅极区域中的沟道图案的上表面和侧壁的栅极电介质层和栅电极。 沟道图案具有与半导体衬底不同的晶格常数。