公开(公告)号：US12133357B2

公开(公告)日：2024-10-29

申请号：US17123760

申请日：2020-12-16

申请人： Intel Corporation

发明人： Jin Yang ,  David Shia ,  Mohanraj Prabhugoud ,  Olaotan Elenitoba-Johnson ,  Craig Jahne ,  Phil Geng

IPC分类号： H05K7/20

CPC分类号： H05K7/20254 ,  H05K7/20418 ,  H05K7/20509

摘要： Examples described herein relate to a cold plate. In some examples, the cold plate includes a surface with fins and at least two channels, wherein a first channel is shaped with a first opening extending towards the surface, a second opening proximate and across a first fin attached to the surface, and a third opening from the surface and extending away from the surface. In some examples, when a fluid is provided to the first opening, the first opening directs the fluid towards the surface, the second opening directs the fluid across the first fin, and the third opening directs the fluid away from the surface. In some examples, the second opening comprises split openings around opposite sides of the first fin.

公开(公告)号：US20230031457A1

公开(公告)日：2023-02-02

申请号：US17957436

申请日：2022-09-30

申请人： Intel Corporation

发明人： Phil Geng ,  Ralph Miele ,  Christopher Gonzalez ,  Timothy Gates ,  Sanjoy Saha ,  Ashish Gupta ,  Sandeep Ahuja

IPC分类号： B21C37/16

摘要： Methods, systems, apparatus, and articles of manufacture to crimp a tube are disclosed. An example crimp disclosed herein includes a first crimp section extending between a first end of the crimp and a point along the crimp between the first end and a second end, a first inner diameter of the first crimp section constant between the first end and the point, and a second crimp section adjacent the first crimp section, the second crimp section extending between the point and the second end, a second inner diameter of the second crimp section to increase from the point to the second end.

公开(公告)号：US20210408724A1

公开(公告)日：2021-12-30

申请号：US17470646

申请日：2021-09-09

申请人： Intel Corporation

发明人： Xiang Li ,  George Vergis ,  Phil Geng

IPC分类号： H01R13/627

摘要： Systems, apparatuses and methods may provide for technology including a memory module, a motherboard, and a latch assembly coupled to the memory module and the motherboard, the latch assembly including a connector coupled to the motherboard, a first lever coupled to the connector via a first pivot point, an L-shaped load member extending through an opening in the first lever, a second lever coupled to the L-shaped load member via a second pivot point, and a spring to bias the L-shaped load member away from the opening in the first lever. The latch assembly may be used as a dual inline memory module (DIMM) retention assembly for compression mount technology (CMT) and land grid array (LGA) connector loading,

公开(公告)号：US11842943B2

公开(公告)日：2023-12-12

申请号：US16986122

申请日：2020-08-05

申请人： Intel Corporation

发明人： Barrett M. Faneuf ,  Phil Geng ,  Kenan Arik ,  David Shia ,  Casey Winkel ,  Sandeep Ahuja ,  Eric D. McAfee ,  Jeffory L. Smalley ,  Minh T. D. Le ,  Ralph V. Miele ,  Marc Milobinski ,  Aaron P. Anderson ,  Brendan T. Pavelek ,  Fernando Gonzalez Lenero ,  Carlos Alvizo Flores

IPC分类号： H01L23/367 ,  H05K7/20 ,  H05K7/14 ,  G11C5/06

CPC分类号： H01L23/3677 ,  G11C5/06 ,  H05K7/1422 ,  H05K7/20509

摘要： An apparatus is described. The apparatus includes an electronic system. The electronic system includes a chassis. The electronic system includes a semiconductor chip cooling component that is rigidly fixed to the chassis. The electronic system includes a packaged semiconductor chip having a lid that is contact with the semiconductor chip cooling component. The electronic system includes an electronic circuit board. The packaged semiconductor chip is electro-mechanically attached to the electronic circuit board.

公开(公告)号：US20190281719A1

公开(公告)日：2019-09-12

申请号：US16422854

申请日：2019-05-24

申请人： Intel Corporation

发明人： Phil Geng ,  George Vergis ,  Xiang Li

IPC分类号： H05K7/12 ,  H05K1/11 ,  H05K7/14 ,  H05K7/10

摘要： Embodiments are directed towards apparatuses, methods, and systems for a memory module, e.g., a dual in-line memory module (DIMM) including a first lengthwise edge along the DIMM and a second lengthwise edge, opposite the first lengthwise edge, to couple the DIMM with a printed circuit board (PCB). In embodiments, the DIMM includes one or more notches along the first lengthwise edge, to removeably couple with one or more flexible supports located at least partially along a length or width of a chassis and to engage the notches to assist in retention of the DIMM in the chassis to reduce a shock and/or vibration associated with a load of a plurality of DIMMs on the PCB. In some embodiments, the one or more flexible supports are coupled to a support structure, such as a pole mounted or otherwise coupled to a panel of the chassis. Additional embodiments may be described and claimed.

公开(公告)号：US20190165503A1

公开(公告)日：2019-05-30

申请号：US16264944

申请日：2019-02-01

申请人： Intel Corporation

发明人： Phil Geng ,  Xiang Li ,  George Vergis ,  Mani Prakash

IPC分类号： H01R12/70 ,  H01R12/73

摘要： An embodiment of a connector housing for a circuit board may include a connector body to receive the circuit board, and a relaxation mechanism mechanically coupled to the connector body to relax stress on the connector housing and maintain the circuit board received in the connector body under a load which exceeds a load threshold. Other embodiments are disclosed and claimed.

公开(公告)号：US12131977B2

公开(公告)日：2024-10-29

申请号：US18498891

申请日：2023-10-31

申请人： Intel Corporation

发明人： Barrett M. Faneuf ,  Phil Geng ,  Kenan Arik ,  David Shia ,  Casey Winkel ,  Sandeep Ahuja ,  Eric D. McAfee ,  Jeffory L Smalley ,  Minh T. D. Le ,  Ralph V. Miele ,  Marc Milobinski ,  Aaron P. Anderson ,  Brendan T. Pavelek ,  Carlos Alvizo Flores ,  Fernando Gonzalez Lenero

IPC分类号： H01L23/367 ,  G11C5/06 ,  H05K7/14 ,  H05K7/20

CPC分类号： H01L23/3677 ,  G11C5/06 ,  H05K7/1422 ,  H05K7/20509

摘要： An apparatus is described. The apparatus includes a housing including a base and sidewalls. The housing is to support a circuit board. The apparatus also includes a heat sink to be supported by the housing independent of the circuit board. The heat sink is to be thermally coupled to a semiconductor package attached to the circuit board. The heat sink is to be closer to the base of the housing than the circuit board is to be to the base of the housing.

公开(公告)号：US20240113479A1

公开(公告)日：2024-04-04

申请号：US17957761

申请日：2022-09-30

申请人： Intel Corporation

发明人： Kai Xiao ,  Phil Geng ,  Carlos Alberto Lizalde Moreno ,  Raul Enriquez Shibayama ,  Steven A. Klein

IPC分类号： H01R13/6597 ,  H01R12/71 ,  H01R13/50 ,  H01R13/6471 ,  H01R33/74 ,  H01R43/18 ,  H01R43/20

CPC分类号： H01R13/6597 ,  H01R12/714 ,  H01R13/50 ,  H01R13/6471 ,  H01R33/74 ,  H01R43/18 ,  H01R43/20 ,  H01R12/57

摘要： Methods, apparatus, systems, and articles of manufacture are disclosed for socket interconnect structures and related methods. An example socket interconnect apparatus includes a housing defining a plurality of first openings and a plurality of second openings and a ground structure coupled to the housing. The ground structure defines a plurality of third openings. The third openings of the ground structure align with the second openings of the housing when the ground structure is coupled to the housing. A plurality of ground pins are located in respective ones of the second openings and third openings. The ground structure is to electrically couple the ground pins. A plurality of signal pins are located in respective ones of the first openings of the housing. The signal pins are electrically isolated from the ground structure.

公开(公告)号：US20230038805A1

公开(公告)日：2023-02-09

申请号：US17956624

申请日：2022-09-29

申请人： Intel Corporation

发明人： Phil Geng ,  David Shia ,  Ralph Miele ,  Sandeep Ahuja ,  Jeffory Smalley

IPC分类号： H01L23/367 ,  H01L23/433 ,  H01L23/40

摘要： Methods, systems, apparatus, and articles of manufacture to control load distribution of integrated circuit packages are disclosed. An example apparatus includes a heatsink, a base of the heatsink to be thermally coupled to a semiconductor device, and a rigid plate to be coupled to the semiconductor device and the base of the heatsink, the rigid plate stiffer than the base, the rigid plate distinct from a bolster plate to which the heatsink is to be coupled.

公开(公告)号：US10790603B2

公开(公告)日：2020-09-29

申请号：US16264944

申请日：2019-02-01

申请人： Intel Corporation

发明人： Phil Geng ,  Xiang Li ,  George Vergis ,  Mani Prakash

IPC分类号： H01R12/70 ,  H01R12/73

摘要： An embodiment of a connector housing for a circuit board may include a connector body to receive the circuit board, and a relaxation mechanism mechanically coupled to the connector body to relax stress on the connector housing and maintain the circuit board received in the connector body under a load which exceeds a load threshold. Other embodiments are disclosed and claimed.