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10 条记录 (耗时 0.015 秒)

    THERMAL CONTROL FOR PROCESSOR-BASED DEVICES
    1.
    发明申请
    THERMAL CONTROL FOR PROCESSOR-BASED DEVICES 审中-公开

    公开(公告)号：US20200260613A1

    公开(公告)日：2020-08-13

    申请号：US16859202

    申请日：2020-04-27

    申请人： Intel Corporation

    发明人： Casey Winkel ,  Yingqiong Bu ,  Ming Zhang ,  Yuehong Fan

    IPC分类号： H05K7/20

    摘要： The present disclosure is directed to systems and methods of improving the thermal performance of processor-based devices. Such thermal performance improvement may include limiting the degree of tilt experienced by a semiconductor device as a thermal solution coupled to the semiconductor device is tightened to the substrate. Such thermal performance improvements may include increasing the available heat transfer area associated with a particular heat producing semiconductor device. Such thermal performance improvements may include thermally coupling one or more cool blocks thermally coupled to one or more remote heat-producing devices to a central cool block that may be cooled using a cooling medium or coupled to a central heat-producing semiconductor device.

    Thermal control for processor-based devices
    3.
    发明授权
    Thermal control for processor-based devices 有权

    公开(公告)号：US11917790B2

    公开(公告)日：2024-02-27

    申请号：US16859202

    申请日：2020-04-27

    申请人： Intel Corporation

    发明人： Prabhakar Subrahmanyam ,  Casey Winkel ,  Yingqiong Bu ,  Ming Zhang ,  Yuehong Fan ,  Yi Xia ,  Ying-Feng Pang

    IPC分类号： H05K7/20

    CPC分类号： H05K7/20154 ,  H05K7/209 ,  H05K7/20209 ,  H05K7/20927

    摘要： The present disclosure is directed to systems and methods of improving the thermal performance of processor-based devices. Such thermal performance improvement may include limiting the degree of tilt experienced by a semiconductor device as a thermal solution coupled to the semiconductor device is tightened to the substrate. Such thermal performance improvements may include increasing the available heat transfer area associated with a particular heat producing semiconductor device. Such thermal performance improvements may include thermally coupling one or more cool blocks thermally coupled to one or more remote heat-producing devices to a central cool block that may be cooled using a cooling medium or coupled to a central heat-producing semiconductor device.

    Technologies for managing hot spots in a compute device
    5.
    发明授权
    Technologies for managing hot spots in a compute device 有权

    公开(公告)号：US11058028B2

    公开(公告)日：2021-07-06

    申请号：US16398957

    申请日：2019-04-30

    申请人： Intel Corporation

    发明人： Casey Winkel ,  Shaorong Zhou ,  Lianchang Du ,  Feng Qi

    IPC分类号： H05K7/20

    摘要： Technologies for managing hot spots in a compute device with use of a vortex tube are disclosed. Cold air from one or more vortex tubes can be routed to hot spots of one or more compute devices, providing effective spot cooling. This approach may allow for cooling of components that might otherwise be difficult to cool, such as components where would be difficult or impossible to cool with a heat sink. This approach may also be effective in cooling components that are downstream of a heat sink and would otherwise only be cooled by air that was already heated by the heat sink.

    Dual in-line memory modules (DIMM) connector towers with removable and/or lay-flat latches
    7.
    发明授权
    Dual in-line memory modules (DIMM) connector towers with removable and/or lay-flat latches 有权

    公开(公告)号：US11228126B2

    公开(公告)日：2022-01-18

    申请号：US16739006

    申请日：2020-01-09

    申请人： Intel Corporation

    发明人： Guixiang Tan ,  Xiang Li ,  Casey Winkel

    IPC分类号： H01R12/73 ,  H01R43/26 ,  H01R12/70

    摘要： Embodiments are directed towards apparatuses, methods, and systems for a connector having a housing body to couple a dual in-line memory module (DIMM) to a printed circuit board (PCB). In embodiments, the housing body includes first and second opposing ends of the connector and a first and a second latch coupled at the respective first and second opposing ends of the connector to engage the DIMM. In embodiments, the first and the second opposing ends have respective first and second heights relative to a height of the housing body to allow the DIMM to be inserted or removed at an angle when disengaged from the first and second latch. In embodiments, one or more of the latches are removably coupled to the connector and/or can be rotated into a lay-flat position to allow the DIMM to be removed at an angle. Additional embodiments may be described and claimed.

    TECHNOLOGIES FOR MANAGING HOT SPOTS IN A COMPUTE DEVICE
    10.
    发明申请
    TECHNOLOGIES FOR MANAGING HOT SPOTS IN A COMPUTE DEVICE 审中-公开

    公开(公告)号：US20190261536A1

    公开(公告)日：2019-08-22

    申请号：US16398957

    申请日：2019-04-30

    申请人： Intel Corporation

    发明人： Casey Winkel ,  Shaorong Zhou ,  Lianchang Du ,  Feng Qi

    IPC分类号： H05K7/20

    摘要： Technologies for managing hot spots in a compute device with use of a vortex tube are disclosed. Cold air from one or more vortex tubes can be routed to hot spots of one or more compute devices, providing effective spot cooling. This approach may allow for cooling of components that might otherwise be difficult to cool, such as components where would be difficult or impossible to cool with a heat sink. This approach may also be effective in cooling components that are downstream of a heat sink and would otherwise only be cooled by air that was already heated by the heat sink.