公开(公告)号：US12131977B2

公开(公告)日：2024-10-29

申请号：US18498891

申请日：2023-10-31

申请人： Intel Corporation

发明人： Barrett M. Faneuf ,  Phil Geng ,  Kenan Arik ,  David Shia ,  Casey Winkel ,  Sandeep Ahuja ,  Eric D. McAfee ,  Jeffory L Smalley ,  Minh T. D. Le ,  Ralph V. Miele ,  Marc Milobinski ,  Aaron P. Anderson ,  Brendan T. Pavelek ,  Carlos Alvizo Flores ,  Fernando Gonzalez Lenero

IPC分类号： H01L23/367 ,  G11C5/06 ,  H05K7/14 ,  H05K7/20

CPC分类号： H01L23/3677 ,  G11C5/06 ,  H05K7/1422 ,  H05K7/20509

摘要： An apparatus is described. The apparatus includes a housing including a base and sidewalls. The housing is to support a circuit board. The apparatus also includes a heat sink to be supported by the housing independent of the circuit board. The heat sink is to be thermally coupled to a semiconductor package attached to the circuit board. The heat sink is to be closer to the base of the housing than the circuit board is to be to the base of the housing.